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quality SMD Inductor PROD Tech PSPMAF0615-R22M-CGF-AP used in personal entertainment and measurement devices factory
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quality SMD Inductor PROD Tech PSPMAF0615-R22M-CGF-AP used in personal entertainment and measurement devices factory
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Specifications
Current - Saturation (Isat):
22A
Mfr. Part #:
PSPMAF0615-R22M-CGF-AP
Package:
SMD,7.1x6.6mm
Key Attributes
Model Number: PSPMAF0615-R22M-CGF-AP
Product Description

SMD Inductor - PSPMAF0615-R22M-CGF-AP

This SMD Inductor, model PSPMAF0615-R22M-CGF-AP, is designed for general electronic equipment applications. It is suitable for use in AV equipment, communication devices, home appliances, entertainment systems, computer equipment, personal devices, office equipment, measurement devices, and industrial robots, operating within conventional environmental conditions. The product is manufactured by PROD TECHNOLOGY CO., LTD. and E-LIVEN TECHNOLOGY CO., LTD., located in Taoyuan, Taiwan.

Product Attributes

  • Brand: PROD TECHNOLOGY CO., LTD. / E-LIVEN TECHNOLOGY CO., LTD.
  • Origin: Taiwan
  • Product Type: SMD Inductor
  • Part Number: PSPMAF0615-R22M-CGF-AP
  • Revision: 1.0
  • Date: 2016-1-13

Technical Specifications

Item P/N Product Test Frequency Test Instrument Inductance (H) Tolerance DCR (m) Max @ 25 Heat Rating DC Current (Idc) Typical (A) Saturation DC Current (Isat) Typical (A) Dimensions (mm) A Dimensions (mm) B Dimensions (mm) C Dimensions (mm) D Dimensions (mm) E
SMD Inductor PSPMAF0615-R22M-CGF-AP SMD Inductor 100 kHz / 1.0V Zentech-3305 / Zentech502BC 0.22 20% 14 22 5.2 7.00.5 6.60.3 1.3 0.2 3.00.3 1.80.5

Additional Notes

  • All test data is referenced to 25 ambient.
  • Typical Heat Rating DC Current would cause an approximately T of 40.
  • Typical Saturation DC Current would cause Lo to drop approximately 20%.
  • Operation Temperature Range: -55 ~ 125.
  • The Part temperature (ambient + T) should not exceed 125 under worst-case operating conditions.
  • Circuit design, component placement, PWB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Mechanical Reliability Test

Test Specification & Requirement Method Used
Solderability The surface of terminal/pin tested shall be covered with new solder by 95% Solder heat proof: Preheating: 180 10 90 seconds, Soldering: 255 5 for 3 1 sec
Shock Inductance change within 5% Without mechanical damage Without Drop down with 981m/s2 (100G) shock upon a rubber block method shock testing machine, 3 tests.
Vibration Inductance change within 5% Without mechanical damage Vibration frequency: 10Hz to 55Hz to 10Hz 60 seconds cycle, Vibration time: 2 hours

Endurance Reliability Test

Test Specification & Requirement Method Used
Thermal Shock Inductance change within 5% Without mechanical damage -25, (30 mins) -> room temp. (5 mins) -> 125, (30 mins) -> room temp. (5 mins) 100 cycles
Heat Resistance Inductance change within 5% Without mechanical damage Apply IDC current @ 85 ambient, Duration: 1000 hrs
Humidity Resistance Inductance change within 5% Without mechanical damage Apply IDC current @ 60 ambient, Humidity: 90~95, Duration: 1000 hrs
Low Temp. Storing Inductance change within 5% Without mechanical damage Storing Temp. -25 2 for total 1,000 +4/-0 hours
High Temp. Storing Inductance change within 5% Without mechanical damage Storing Temp. 125 2 for total 1,000 +4/-0 hours

Packing

Standard Quantity for Packaging: 2000 pcs/Reel (Carrier Tape and Reel Materials: Paper, Plastics)

Product Precautions ()

  • Product shelf life is 12 months under storage conditions: 5~40, 10~80% RH. Exceeding the shelf life may cause oxidation of product terminals.
  • Do not use or store in extreme environments (high salt, strong acids, strong bases, strong radiation, etc.).
  • Preheat the product before soldering; the temperature difference between preheating and soldering temperature should be controlled within 150.
  • When re-disassembling and re-soldering after the product is soldered, follow the specified conditions. Excessive heating or repeated disassembly may cause product failure.
  • After soldering the product to the circuit board, avoid applying residual stress to the inductor due to overall or local deformation of the circuit board, which may lead to cracking, detachment, or failure.
  • Do not expose the product to liquids such as cleaning agents or alcohol, as this may corrode the product body and cause failure.
  • The product temperature will rise with increasing current when powered on; ensure sufficient margin is considered during design.
  • Excessive static electricity can cause permanent damage to the product; pay attention to static protection.
  • Do not touch any part of the product during power-on to prevent electric shock.
  • As a magnetic product, carefully consider the mutual influence between surrounding components and this product during design.
  • This product is suitable for general electronic equipment. For applications requiring high safety and reliability, or where product failure could endanger life or property, or have significant negative societal impact, consult with the company before design and use. The company will not bear responsibility for any consequences arising from use without written consent. Special uses include, but are not limited to: equipment, transportation equipment, aerospace equipment, power generation control equipment, nuclear power related equipment, explosion ignition control equipment, traffic control equipment, national defense security equipment, disaster prevention and relief equipment, safety standard equipment, emergency rescue equipment, and other equipment identified as special purpose.

2410121327_PROD-Tech-PSPMAF0615-R22M-CGF-AP_C436584.pdf

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