Product Overview
This specification sheet details the A2.0 product, a SMD Inductor (PSPMAA0603-3R3M-ANP). It is designed for various electronic applications requiring precise inductance. The product is manufactured by PuLuoDe Electronic Technology (Shenzhen) Co. LTD.
Product Attributes
- Brand: PuLuoDe
- Origin: Shenzhen, China
- Product Series: SMD INDUCTOR
Technical Specifications
| Product Code | Series | Dimension (mm) | Land Pattern (mm) | Inductance (H) | Tolerance | DCR (m) Max | Temperature Rise Current (IRMS) (A) | Saturation Current (ISAT) (A) | Operating Temperature Range (C) |
| PSPMAA0603-3R3M-ANP | 0603 | 6.60.3 (A) x 7.10.3 (B) x 3.0MAX (C) | 3.00.5 (a) x 1.60.5 (b) | 3.30 | 20% | 35.00 | 6.0 | 11.0 | -40 to +125 |
Reliability Test Summary
| Test Item | Test Condition | Acceptance Criteria |
| Solderability | Preheating: 180 10 90 seconds; Soldering: 255 5 for 3 1 sec | Surface of terminal/pin covered with new solder by 95% |
| Shock | Drop down with 981m/s2 (100G) shock | Inductance change within 5%; No mechanical damage |
| Vibration | 10Hz to 55Hz to 10Hz 60 seconds cycle, 2 hours | Inductance change within 5%; No mechanical damage |
| Thermal Shock | -25 (30 mins) -> room temp. (5 mins) -> 125 (30 mins) -> room temp. (5 mins), 100 cycles | Inductance change within 5%; No mechanical damage |
| Heat Resistance | Apply IDC current @ 85 ambient, 1000 hrs | Inductance change within 5%; No mechanical damage |
| Humidity Resistance | Apply IDC current @ 60 ambient, Humidity: 90~95, 1000 hrs | Inductance change within 5%; No mechanical damage |
| Low Temp. Storing | -25 2 for 1,000 +4/-0 hours | Inductance change within 5%; No mechanical damage |
| High Temp. Storing | 125 2 for 1,000 +4/-0 hours | Inductance change within 5%; No mechanical damage |
Packing Information
| Series | Reel Size (mm) | A | B | C | W | P | Po | Ao | Bo | Ko | Package Quantity | Packing Method | Typical Pulling Force |
| 0603 | 330 | 100 | 17 | 16 | 12 | 4 | 6.9 Typ | 7.6 Typ | 3.2 Typ | 1000pcs/Reel | 20~120 gf |
Precautions
Storage: 12 months, 5~40, 10~75%RH. Avoid extreme environments (high salt, strong acid/alkali, strong radiation).
Soldering: Preheat before welding. Temperature difference between preheating and welding within 150. Refer to EN61760-1:2006. Avoid repeated disassembly.
Handling: Do not use corrosive liquids (e.g., acetone). Avoid stress on the component after soldering due to PCB deformation. Protect against static electricity.
Design Considerations: Consider self-heating due to current. Account for magnetic coupling effects with surrounding components. For critical applications (automotive, aerospace, safety, medical, ), PROD strongly recommends redundant design and written permission from PROD for use.
2506181047_PROD-Tech-PSPMAA0603-3R3M-ANP_C726318.pdf
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