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Specifications
Current - Saturation (Isat):
23A
Mfr. Part #:
PSPMAA1770-220M-CGP
Package:
SMD,17.5x17mm
Key Attributes
Model Number:
PSPMAA1770-220M-CGP
Product Description
Product Overview
The PSPMAA1770-220M-CGP is a high-performance SMD Molding Power Inductor designed for various electronic applications. It offers reliable performance with a focus on durability and operational stability across a wide temperature range.
Product Attributes
- Brand: PuLuoDe ()
- Origin: Shenzhen, China
- Material: FeSiCr Core, Copper Wire, Sn-Ni-Cu Electrode
- Color: Black (Marking)
- Certifications: Compliant with IPC/JEDEC J-STD-020E
Technical Specifications
| Product Code | Series | Test Frequency | Inductance | Tolerance | DCR (m) Typ | Irms (A) T40 | Isat (A) L0 drop30% | Operating Temperature Range | Dimensions (mm) (L x W x H) |
| PSPMAA1770-220M-CGP | SMD Molding Power Inductor | 100KHZ / 1V | 22 H | 20% | 25 | 12 | 23 | -40 ~ 125 | 17.00.5 x 17.51 x 7.0 MAX |
Electrical Characteristics
| Parameter | Value | Condition |
| Inductance | 22 H | @ 25 Ambient Temperature |
| Tolerance | 20% | @ 25 Ambient Temperature |
| DCR | 25 m (Typ) | @ 25 Ambient Temperature |
| Temperature Rise Current (Irms) | 12 A | T40 |
| Saturation Current (Isat) | 23 A | L0 drop30% |
| Operating Temperature Range | -40 ~ 125 | Ambient |
Dimensions and Land Pattern
| Series | Dimension (L x W x H) (mm) | Land Pattern (a x b x c) (mm) |
| 1770 | 17.00.5 x 17.51 x 7.0 MAX | 13Typ x 3.1Typ x 4.8Typ |
Soldering Profile
| Classification | Profile Feature | Value |
| Reflow Soldering Profile | Preheat Temperature Min (Ts min) | 150 C |
| Reflow Soldering Profile | Preheat Temperature Max (Ts max) | 200 C |
| Reflow Soldering Profile | Preheat Time (ts) | 60 - 120 seconds |
| Reflow Soldering Profile | Ramp-up Rate | 3 C/ second max. |
| Reflow Soldering Profile | Liquidous Temperature (TL) | 217 C |
| Reflow Soldering Profile | Time maintained above TL (tL) | 60 - 150 seconds |
| Reflow Soldering Profile | Time within 5C of actual peak temperature (tp) | 20 - 30 seconds |
| Reflow Soldering Profile | Ramp-down Rate | 6 C/ second max. |
| Reflow Soldering Profile | Time 25C to peak temperature | 8 minutes max. |
Reliability Test
| Test Name | Specification & Requirement | Method Used |
| Solderability | The surface of terminal/pin tested shall be covered with new solder by 95% | Solder heat proof: Preheating: 180 10 90 seconds, Soldering: 255 5 for 3 1 sec |
| Mechanical Shock | Inductance change within 5% Without mechanical damage | Drop down with 981m/s2 (100G) shock Attitude upon a rubber block shock testing machine, 3 tests. |
| Vibration | Inductance change within 5% Without mechanical damage | Vibration frequency: 10Hz to 55Hz to 10Hz 60 seconds cycle, Vibration time: 2 hours |
| Thermal Shock | Inductance change within 5% Without mechanical damage | -40, (30 mins) -> room temp. (5 mins) -> 125, (30 mins) -> room temp. (5 mins) 100 cycles |
| Heat Resistance | Inductance change within 5% Without mechanical damage | Apply IDC current @ 85 ambient Duration: 1000 hrs |
| Humidity Resistance | Inductance change within 5% Without mechanical damage | Apply IDC current @ 60 ambient Humidity: 90~95 Duration: 1000 hrs |
| Low Temp. Storing | Inductance change within 5% Without mechanical damage | Storing Temp. -40 2 for total 1,000 +4/-0 hours |
| High Temp. Storing | Inductance change within 5% Without mechanical damage | Storing Temp. 125 2 for total 1,000 +4/-0 hours |
Packing Information
| Reel Size (mm) | MPQ | A | B | C | W | P | Po | Ao | Bo | Ko |
| 330 x 100 | 300pcs/Reel | 17 | 32 | 24 | 4 | 17.7 Ref | 19.4 Ref | 7.9 Ref |
2507081835_PROD-Tech-PSPMAA1770-220M-CGP_C49308184.pdf
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