Product Overview

This document specifies the PSPMAF0515-2R2M-CGF-AP, an SMD inductor manufactured by PROD TECHNOLOGY CO., LTD. and E-LIVEN TECHNOLOGY CO., LTD. This product is designed for general electronic equipment applications and is tested using Zentech-3305 / Zentech502BC instruments at a test frequency of 100 kHz / 1.0V. The inductor offers reliable performance with specific electrical and mechanical characteristics suitable for various industrial and consumer electronics.

Product Attributes

• Brand: PROD TECHNOLOGY CO., LTD. / E-LIVEN TECHNOLOGY CO., LTD.
• Origin: Taiwan
• Product Type: SMD Inductor
• Part Number: PSPMAF0515-2R2M-CGF-AP
• Revision Number: 1.0
• Date: 2016-1-13

Technical Specifications

Usage and Application Scenarios

This product is suitable for general electronic equipment such as AV equipment, communication equipment, home appliances, entertainment equipment, computer equipment, personal devices, office equipment, measuring equipment, and industrial robots. It is designed for use in conventional operating and usage environments. For applications requiring high safety and reliability, or where product failure could endanger life, property, or have significant societal impact, consultation with the manufacturer is mandatory. Special purpose applications include equipment, transportation equipment, aerospace equipment, power generation control equipment, nuclear power related equipment, explosion ignition control equipment, traffic control equipment, national defense security equipment, disaster relief equipment, safety standard equipment, emergency rescue equipment, and other designated special purpose equipment.

Notes and Precautions

• Storage period: 12 months. Storage conditions: 5~40, 10~80% RH. Exceeding this may lead to oxidation of product terminals.
• Avoid use and storage in extreme environments (high salt, strong acids, bases, strong radiation, etc.).
• Preheat before soldering; temperature difference between preheating and soldering should be within 150.
• For rework/desoldering, follow specified conditions. Excessive heating or repeated desoldering may cause failure.
• After soldering to the PCB, avoid applying residual stress due to PCB deformation, which can lead to cracking, detachment, or failure.
• Do not expose to cleaning agents, alcohol, or other liquids, as they can erode the product body and cause failure.
• Account for temperature rise with increasing current during operation.
• High static electricity can cause permanent damage; ensure static protection.
• Do not touch any part of the product during energization to prevent electric shock.
• As a magnetic product, consider potential mutual interference with surrounding components during design.
• Part temperature (ambient + T) should not exceed 125 under worst-case conditions. Circuit design, component placement, PWB trace size/thickness, airflow, and cooling provisions affect part temperature and should be verified in the end application.
• Typical Heat Rating DC Current causes approximately a 40 T.
• Typical Saturation DC Current causes Lo to drop approximately 20%.
• Operation Temperature Range: -40 ~ 125.