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Specifications
Current - Saturation (Isat):
7.2A
Mfr. Part #:
PSTMAA5030-3R3MG
Package:
SMD,5.2x5mm
Key Attributes
Model Number:
PSTMAA5030-3R3MG
Product Description
Product Overview
The PSTMAA5030-Series is a SMD T-CORE Molding power inductor designed for general electronic equipment. It features a flat wire structure for low DC resistance and high rated current, a gapless structure to prevent inductor noise, and a closed magnetic circuit for reduced EMI. Its compact and thin design saves PCB space.
Product Attributes
- Brand: (PuLuoDe Electronic Technology (Shenzhen) Co., LTD)
- Origin: China
- Certifications: Not specified
Technical Specifications
| Product Code | Inductance (H) | Tolerance | DCR (m) Typ | Rated Current (IRMS) Typ (A) | Saturation Current (ISAT) Typ (A) | Dimension (mm) | Test Frequency |
| PSTMAA5030-R15MG | 0.15 | 20% | 1.05 | 1.42 | 25 | 5030 (5.2x5.0x3.0) | 1MHz / 1V |
| PSTMAA5030-R33MG | 0.33 | 20% | 1.6 | 1.95 | 21 | 5030 (5.2x5.0x3.0) | 1MHz / 1V |
| PSTMAA5030-R47MG | 0.47 | 20% | 2.5 | 2.95 | 19 | 5030 (5.2x5.0x3.0) | 1MHz / 1V |
| PSTMAA5030-R68MG | 0.68 | 20% | 3.8 | 4.5 | 16 | 5030 (5.2x5.0x3.0) | 1MHz / 1V |
| PSTMAA5030-1R0MG | 1.00 | 20% | 6 | 7.5 | 12.5 | 5030 (5.2x5.0x3.0) | 1MHz / 1V |
| PSTMAA5030-3R3MG | 3.30 | 20% | 24 | 26.5 | 6.5 | 5030 (5.2x5.0x3.0) | 1MHz / 1V |
Features
- Flat wire structure with ultra-low DC resistance and higher temperature rise current.
- Integrated structure effectively avoids inductor noise.
- Closed magnetic structure effectively reduces electromagnetic interference (EMI).
- Ultra-small and ultra-thin structure reduces PCB footprint.
Operating Conditions
- Inductor operating temperature range: -40 to +125.
- Typical Irms causes an approximate T of 40.
- Typical ISAT causes Lo to drop approximately 30%.
- Rated current is the minimum of ISAT and IRMS current.
- Final product operating temperature should not exceed 125.
Reliability Tests
| Test Item | Specification & Requirement | Method Used |
| Solderability | Surface of terminal/pin covered with new solder by 95% | Solder heat proof: Preheating: 180 10 90 seconds; Soldering: 255 5 for 3 1 sec |
| Mechanical Shock | Inductance change within 5%; Without mechanical damage | Drop down with 981m/s2 (100G) shock upon a rubber block method shock testing machine, 3 tests. |
| Vibration | Inductance change within 5%; Without mechanical damage | Vibration frequency: 10Hz to 55Hz to 10Hz 60 seconds cycle; Vibration time: 2 hours |
| Thermal Shock | Inductance change within 5%; Without mechanical damage | -55, (30 mins) -> room temp. (5 mins) -> 125, (30 mins) -> room temp. (5 mins); 100 cycles |
| Heat Resistance | Inductance change within 5%; Without mechanical damage | Apply IDC current @ 85 ambient; Duration: 1000 hrs |
| Humidity Resistance | Inductance change within 5%; Without mechanical damage | Apply IDC current @ 60 ambient; Humidity: 90~95; Duration: 1000 hrs |
| Low Temp. Storing | Inductance change within 5%; Without mechanical damage | Storing Temp. -55 2 for total 1,000 +4/-0 hours |
| High Temp. Storing | Inductance change within 5%; Without mechanical damage | Storing Temp. 125 2 for total 1,000 +4/-0 hours |
Packing Information
| Series | Reel Size (mm) | A (mm) | B (mm) | C (mm) | W (mm) | P (mm) | Po (mm) | Ao (mm) | Bo (mm) | Ko (mm) | MPQ (pcs) | Middle Box (pcs) | Outer Box (pcs) |
| 5030 | 330 | 100 | 12.5 | 12 | 8 | 4 | 5.2 Typ | 5.4 Typ | 3.3 Typ | 2000 | 6000 | 18000 |
Tape Peeling off force: 20g~120g.
Announcements
- Product storage life is 12 months (Storage conditions: 5~40, 10~75%RH).
- Do not use or store in extreme environments (high salt, strong acid, strong alkali, strong radiation, etc.).
- Preheat before soldering; temperature difference between preheating and soldering should be within 150.
- Resoldering corrections should follow specified conditions; excessive heating or repeated disassembly may cause failure.
- Avoid contact with cleaning agents, alcohol, or other liquids that may corrode the product.
- Ensure no residual stress is applied to the inductor due to PCB deformation after soldering.
- Consider thermal rise due to current; ensure sufficient margin in design.
- Protect against high static electricity, which can cause permanent damage.
- Do not touch any part of the product during operation to prevent electric shock.
- Consider potential magnetic interaction between the product and surrounding components.
- Suitable for general electronic equipment (AV, communication, home appliances, computers, etc.) under normal operating conditions.
- For applications requiring high safety and reliability, or where product failure could cause serious damage or affect safety (e.g., , transportation, aerospace, power generation, nuclear, explosion control, traffic control, national defense), consult with the company before use. The company is not liable for consequences arising from use without written consent for such special applications.
2504101957_PROD-Tech-PSTMAA5030-3R3MG_C46956301.pdf
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