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quality Electronic SMD Inductor 47 Microhenry 2 Amp Current PROD Tech PSPMAQ0605H-470M-ANP 20 Percent Tolerance factory
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quality Electronic SMD Inductor 47 Microhenry 2 Amp Current PROD Tech PSPMAQ0605H-470M-ANP 20 Percent Tolerance factory
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Specifications
Current - Saturation (Isat):
2.5A
Mfr. Part #:
PSPMAQ0605H-470M-ANP
Package:
SMD,7.1x6.6mm
Key Attributes
Model Number: PSPMAQ0605H-470M-ANP
Product Description

Product Overview

This specification details the PSPMAQ0605H-470M-ANP, an SMD Inductor designed for various electronic applications. It is manufactured by PROD TECHNOLOGY CO., LTD. and E-LIVEN TECHNOLOGY CO., LTD. The product is tested using Zentech-3305 / Zentech502BC instruments at a test frequency of 100 kHz / 1.0V.

Product Attributes

  • Brand: PROD TECHNOLOGY CO., LTD. / E-LIVEN TECHNOLOGY CO., LTD.
  • Origin: Taiwan

Technical Specifications

ItemP/NProductTest FrequencyInductance (H)ToleranceIrms (A) Max.Isat (A) Max.DCR (m) TypicalDCR (m) Max.
SMD InductorPSPMAQ0605H-470M-ANPSMD Inductor100 kHz / 1.0V47.0020%2.02.5180.0210.0

Dimensions (mm)

DimensionValue
A6.6 0.3
B7.1 0.5
C5.0 MAX
D3.0 0.3
E1.6 0.3
F (Ref.)7.80
G (Ref.)2.40
H (Ref.)3.50

Explanation of Part Numbers

PSPMAQ 0605H - 470M - ANP

  • PSPMAQ: Serial Codes
  • 0605H: Size
  • 470M: Inductance Code
  • ANP: Description

Electrical Characteristics Notes

  • All test Data is referenced to 25 ambient.
  • Typical Heat Rating DC Current would cause an approximately T of 40.
  • Typical Saturation DC Current would cause Lo to drop approximately 35%.
  • Operation Temperature Range: -40 ~ 125.
  • The Part temperature (ambient + T) should not exceed 125 under worst case operating conditions.
  • Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all effect the part temperature. Part temperature should be verified in the end application.

Mechanical Reliability Test

Specification & RequirementMethod Used
Solderability: Surface of terminal/pin tested shall be covered with new solder by 95%Solder heat proof: Preheating: 180 10 90 seconds, Soldering: 255 5 for 3 1 sec
Shock: Inductance change within 5% Without mechanical damageWithout Drop down with 981m/s2 (100G) shock attitude upon a rubber block method shock testing machine, 3 tests.
Vibration: Inductance change within 5% Without mechanical damageVibration frequency: 10Hz to 55Hz to 10Hz 60 seconds cycle, Vibration time: 2 hours

Endurance Reliability Test

Specification & RequirementMethod Used
Thermal Shock: Inductance change within 5% Without mechanical damage-25, (30 mins) -> room temp. (5 mins) -> 125, (30 mins) -> room temp. (5 mins) 100 cycles
Heat Resistance: Inductance change within 5% Without mechanical damageApply IDC current @ 85 ambient, Duration: 1000 hrs
Humidity Resistance: Inductance change within 5% Without mechanical damageApply IDC current @ 60 ambient, Humidity: 90~95, Duration: 1000 hrs
Low Temp. Storing: Inductance change within 5% Without mechanical damageStoring Temp. -25 2 for total 1,000 +4/-0 hours
High Temp. Storing: Inductance change within 5% Without mechanical damageStoring Temp. 125 2 for total 1,000 +4/-0 hours

Packing for SMD (Carrier Tape & Reel)

Unit (mm)ABWPAoBoKo
Value8001716126.90.17.6 0.15.4 Typ
Typical Pulling Force: 10 grams

Testing Report Data

No.A (mm)B (mm)C (mm)D (mm)E (mm)DCR Max (m)Inductance L(0)20%Result
16.597.314.943.031.61198.0042.68PASS
26.597.314.883.011.59199.0044.58PASS
36.587.244.853.021.61198.0042.95PASS
46.597.274.893.021.65199.0042.66PASS
56.587.254.943.011.62198.0042.78PASS
66.597.274.883.011.62198.0043.55PASS
76.597.294.853.011.62200.0043.47PASS
86.597.284.923.021.63198.0042.90PASS
96.597.264.923.011.55198.0042.98PASS
106.587.294.863.021.61199.0046.57PASS
X (Avg)6.597.284.893.021.61198.5043.51
R (StdDev)0.010.070.090.020.102.003.91

Product Precautions ()

  • Product shelf life is 12 months. Storage conditions: Temperature 5~40, Humidity within 10~80%RH. Exceeding the shelf life may cause oxidation of the product terminals.
  • Do not use or store in extreme environments (high salt, strong acid, strong alkali, strong radiation, etc.).
  • Preheat before soldering. The temperature difference between preheating and soldering temperature is recommended to be within 150.
  • When reworking after soldering, follow the specified conditions. Excessive heating or repeated disassembly may cause product failure.
  • After soldering to the PCB, avoid applying residual stress due to PCB deformation, which may lead to cracking, detachment, or failure.
  • Do not expose to cleaning agents, alcohol, or other liquids, as they may corrode the product body and cause failure.
  • Product temperature will rise with increasing current when powered on; ensure sufficient margin in design.
  • Excessive static electricity can cause permanent damage; ensure electrostatic protection.
  • Do not touch any part of the product during energization to prevent electric shock.
  • As a magnetic product, consider potential mutual influence with surrounding components during design.
  • Suitable for general electronic equipment (AV, communication, home appliances, entertainment, computers, personal devices, office equipment, measurement equipment, industrial robots, etc.) under normal operating conditions.
  • For applications requiring high safety and reliability, or where product failure could endanger life or property, or have significant negative societal impact, consult the company before design. The company is not liable for any consequences arising from use without written consent. Special uses include, but are not limited to: equipment, Transportation equipment, Aerospace equipment, Power generation control equipment, Nuclear power related equipment, Explosion ignition control equipment, Traffic control equipment, National defense security equipment, Disaster relief equipment, Safety standard equipment, Emergency medical equipment, and other designated special uses.

2410121435_PROD-Tech-PSPMAQ0605H-470M-ANP_C436585.pdf

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