Product Overview
The ERJ series of chip resistors (precision grade) offers a compact and lightweight design with high reliability based on alloy thick film and three-layer electrode construction. They are available in tape packaging suitable for automatic mounting and support both reflow and flow soldering. These resistors feature high precision resistance tolerances and comply with international standards, including AEC-Q200 certification for most series and RoHS directive compliance.
Product Attributes
- Brand: (Not specified)
- Origin: (Not specified)
- Material: Alloy thick film, Alumina substrate
- Certifications: AEC-Q200 (except ERJXG, ERJ1R), RoHS directive compliant
Technical Specifications
| Series | Shape/Size (Code) | Rated Power (70C) (W) | Resistance Tolerance (%) | Resistance Value Range () | Temp. Coefficient (10-6/C) | Operating Temp. Range (C) | AEC-Q200 Grade |
| ERJ1RH | 0603 | 0.05 | 0.5 | 1k ~ 1M (E24, E96) | 50 | 55~+125 | |
| ERJ2RH | 1005 | 0.063 | 0.5 | 100 ~ 100k (E24, E96) | 50 | 55~+155 | 0 |
| ERJ2RK | 1005 | 0.063 | 0.5 | 10 ~ 97.6, 102k ~ 1M (E24, E96) | 100 | 55~+155 | 0 |
| ERJ3RB | 1608 | 0.1 | 0.5 | 100 ~ 100k (E24, E96) | 50 | 55~+155 | 0 |
| ERJ3RE | 1608 | 0.1 | 0.5 | 10 ~ 97.6, 102k ~ 1M (E24, E96) | 100 | 55~+155 | 0 |
| ERJ6RB | 2012 | 0.1 | 0.5 | 100 ~ 100k (E24, E96) | 50 | 55~+155 | 0 |
| ERJ6RE | 2012 | 0.1 | 0.5 | 10 ~ 97.6, 102k ~ 1M (E24, E96) | 100 | 55~+155 | 0 |
| ERJXGN | 0402 | 0.031 | 1 | 10 ~ 1M (3) (E24, E96) | <100 : 300, 100 : 200 | 55~+125 | |
| ERJ1GN | 0603 | 0.05 | 1 | 10 ~ 1M (3) (E24, E96) | 200 | 55~+125 | 1 |
| ERJ2RC | 1005 | 0.1 | 1 | 1 ~ 9.76 (E24, E96) | 100 ~ +600 | 55~+155 | 0 |
| ERJ2RK | 1005 | 0.1 | 1 | 10 ~ 1M (E24, E96) | 100 | 55~+155 | 0 |
| ERJ3EK | 1608 | 0.1 | 1 | 10 ~ 1M (E24, E96) | 100 | 55~+155 | 0 |
| ERJ6EN | 2012 | 0.125 | 1 | 10 ~ 2.2M (E24, E96) | 100 | 55~+155 | 0 |
| ERJ8EN | 3216 | 0.25 | 1 | 10 ~ 2.2M (E24, E96) | 100 | 55~+155 | 0 |
| ERJ14N | 3225 | 0.5 | 1 | 10 ~ 1M (E24, E96) | 100 | 55~+155 | 0 |
| ERJ12N | 4532 | 0.75 | 1 | 10 ~ 1M (E24, E96) | 100 | 55~+155 | 0 |
| ERJ12S | 5025 | 0.75 | 1 | 10 ~ 1 M (E24, E96) | 100 | 55~+155 | 0 |
| ERJ1TN | 6432 | 1 | 1 | 10 ~ 1M (E24, E96) | 100 | 55~+155 | 0 |
Performance Characteristics
| Test Item | Characteristic Value | Test Condition |
| Resistance | Within specified tolerance | 20 C |
| Temperature Coefficient of Resistance | Within specified value | +25 C/+155 C (ERJXG, ERJ1G : +25 C/+125 C) |
| Overload | 2 % | 2.5 times rated voltage, 5 s |
| Solderability | 1 % | 270 C, 10 s |
| Thermal Shock | 1 % | 55 C (30 min) / +155 C (ERJXG, ERJ1G : +125 C) (30 min), 100 cycles |
| Heat Resistance | 1 % | +155 C (ERJXG, ERJ1G : +125 C), 1000 h |
| High Humidity (Steady) | 1 % | 60 C, 90 % ~ 95 %RH, 1000 h |
| Durability (Humid Load) | 2 % (ERJXG,1G : 3 %) | 60 C, 90 % ~ 95 %RH, rated voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h |
| Durability at 70 C | 2 % (ERJXG,1G : 3 %) | 70 C, rated voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h |
Safety Precautions
Product Mounting: Avoid mechanical stress on electrodes and protective film during and after mounting. Ensure correct relative positioning to prevent solder bridging.
Rated Power and Ambient Temperature: Do not exceed values specified by the load derating curve. Confirm actual temperature rise due to PCB, wiring, and adjacent components. Consult for special conditions.
Pulsed Load: User must test and evaluate the entire product after mounting when applying pulsed or transient loads.
Stable Load: Operate within rated power to avoid performance and reliability degradation.
Flux Residue: Halogenated flux residues may affect performance and reliability; confirm before use.
Soldering with Soldering Iron: Avoid direct contact of soldering iron tip with the resistor. Limit soldering time at high temperatures (within 3 seconds at below 350 C).
Solder Amount: Excessive solder increases mechanical stress and risk of surface cracks. Use appropriate amounts.
Protective Film Damage: Avoid mechanical impact during auto-mounting and ensure proper board maintenance to prevent damage.
Handling: Do not strike or grip with hard objects (pliers, tweezers) to prevent damage to the protective film and body.
PCB Bending: Avoid collision or extrusion due to excessive PCB bending.
Solvent Immersion: Avoid prolonged immersion in solvents. Confirm solvent specifications before use.
Transient Voltage: Products are designed based on theoretical critical voltage or steady-state conditions. User must test and evaluate the entire product after mounting for transient phenomena.
Terminal Pressure: Avoid excessive pressure on terminal parts.
General Precautions for Fixed Resistors:
- Always exchange the product specification sheet before use.
- Do not use if catalog information is missing.
- The performance and quality shown are for individual components. User must test and evaluate the entire product after mounting.
- For applications in transportation, communication, medical, aerospace, heating appliances, fuel/gas equipment, rotating machinery, disaster prevention/security equipment, where failure could cause injury, implement fault protection systems (protective circuits, redundant circuits).
Usage Precautions:
- Designed for general electronic equipment (AV, home appliances, office equipment, information communication equipment).
- Not designed for special environments: liquids (water, oil, solvents), direct sunlight, dust, corrosive gases (sea breeze, Cl2, H2S, NH3, SO2, NO2), static electricity (use ESD protection measures), strong electromagnetic waves, condensation, or sealing/coating with resin.
- Account for Joule heat generated during operation and component placement to avoid affecting other components or exceeding operating temperature.
- Avoid placing near flammable materials.
- Use of lead-free solder, halogenated, or water-soluble fluxes may affect performance.
- Flux cleaning after soldering can impact performance; use caution, especially with water/water-soluble cleaners due to insulation effects of water stains.
Storage Precautions:
- Shelf life (solderability, etc.): 1 year from delivery under conditions of 5 C ~ 35 C and 45 % ~ 85 %RH.
- Avoid storage in environments with corrosive gases or direct sunlight, as this may lead to decreased electrical performance, solderability issues, or deformation/deterioration of packaging materials.
Packaging Label: Includes product model, quantity, country of origin (in English).
1912111437_PANASONIC-ERJ2RKF4701X_C400631.pdf
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