Product Overview

The ERJ series of chip resistors (precision grade) offers high reliability due to its alloy thick film and three-layer electrode construction. These resistors are compact, lightweight, and suitable for automatic mounting machines with tape packaging. They are compatible with reflow and dip soldering methods and feature high-precision resistance value tolerance.

Product Attributes

• Certifications: AEC-Q200 certified (except ERJXG, ERJ1R)
• Compliance: RoHS directive compliant

Technical Specifications

Performance Characteristics

General Performance:

• 1% Precision: ERJXGN, 1GN, 2RC, 2RK, 3EK, 6EN, 8EN, 14N, 12N, 12S, 1TN series
• 0.5% Precision: ERJ1R, 2R, 3R, 6R series

Test Items and Conditions:
(For 1% Precision Series: ERJXGN, 1GN, 2RC, 2RK, 3EK, 6EN, 8EN, 14N, 12N, 12S, 1TN)

• Resistance: Within specified tolerance at 20 C
• Temp. Coefficient: Within specified value at +25 C/+155 C (ERJXG, ERJ1G: +25 C/+125 C)
• Overload: 2% at 2.5 times rated voltage for 5 s
• Solderability: 1% at 270 C for 10 s
• Thermal Shock: 1% from 55 C (30 min) / +155 C (30 min) (ERJXG, ERJ1G: +125 C), 100 cycles
• Heat Resistance: 1% at +155 C (ERJXG, ERJ1G: +125 C) for 1000 h
• High Temp. & Humidity (Steady): 1% at 60 C, 90 % ~ 95 %RH, 1000 h
• Durability (Damp Load): 2% (ERJXG, 1G: 3%) at 60 C, 90 % ~ 95 %RH, rated voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h
• Durability at 70 C: 2% (ERJXG, 1G: 3%) at 70 C, rated voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h

(For 0.5% Precision Series: ERJ1R, 2R, 3R, 6R)

• Resistance: Within specified tolerance at 20 C
• Temp. Coefficient: Within specified value at +25 C/+125 C
• Overload: 2% at 2.5 times rated voltage for 5 s
• Solderability: 1% at 270 C for 10 s
• Thermal Shock: 1% from 55 C (30 min) / +125 C (30 min) (ERJ1R: +125 C), 100 cycles
• Heat Resistance: 1% at +125 C (ERJ1R: +125 C), 1000 h
• High Temp. & Humidity (Steady): 1% at 60 C, 90 % ~ 95 %RH, 1000 h
• Durability (Damp Load): 2% (ERJ1R: 3%) at 60 C, 90 % ~ 95 %RH, rated voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h
• Durability at 70 C: 2% (ERJ1R: 3%) at 70 C, rated voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h

Safety Precautions

Product Mounting:

• Avoid mechanical stress on electrodes and protective film during and after mounting.
• Ensure consistent relative positioning during mounting to prevent solder bridging.

Operating Conditions:

• Do not exceed rated power and ambient temperature specified in the derating curve.
• Confirm temperature rise due to circuit board, wiring, adjacent components, and localized temperature, and ensure use without damaging the board or surrounding components. Consult for special conditions.
• For pulsed loads (instantaneous overload), conduct overall product testing after mounting.
• Use within rated power to maintain performance and reliability.

Soldering and Handling:

• If using halogen flux, confirm its effect on performance and reliability.
• When soldering with a soldering iron, do not let the tip directly touch the resistor. Minimize soldering time (within 3 seconds at below 350 C).
• Excessive solder can increase mechanical stress and cause surface cracks. Avoid using too much solder.
• Prevent damage to the protective film and body from impact or hard objects (pliers, tweezers).
• Avoid collision or extrusion due to excessive bending of the printed circuit board.
• Do not immerse the product in solvents for extended periods. Confirm solvent specifications before use.

Transient Voltage:

• The product is designed based on theoretical critical voltage or steady-state conditions. Actual usage conditions, especially for transient phenomena like pulses, require user evaluation after mounting.
• Avoid excessive pressure on the terminal parts.

General Precautions for Fixed Resistors:

• Always obtain and review the product's specification sheet before use.
• Do not use if catalog information is missing.
• The performance and quality described are for individual components. The user must test the entire product after mounting.
• For applications in transportation, communication, medical, aerospace, heating, fuel/gas, rotating, or disaster prevention equipment where component failure could cause severe injury, implement fault protection systems (protective circuits, redundant circuits).

Usage Precautions:

• Designed for general electronic equipment (AV, home appliances, office equipment, information communication equipment).
• Not designed for special environments: liquids (water, oil, solvents), direct sunlight, dusty areas, corrosive gases (sea breeze, Cl2, H2S, NH3, SO2, NO2), high static electricity environments (use ESD protection measures), strong electromagnetic wave environments, condensation environments, or sealing/coating with resin.
• Be mindful of component placement to avoid Joule heat affecting other components.
• Ensure component placement prevents exceeding operating temperature due to heat from surrounding parts. Do not install near flammable materials.
• Use of fluxless solder, halogen, or water-soluble flux may affect performance and reliability.
• Flux cleaning after soldering can affect performance and reliability. Use caution, especially with water and water-soluble cleaners, considering insulation impact of water residue.

Storage Precautions:

• Shelf life for solderability and other performance: 1 year from receipt in a controlled environment (5 C ~ 35 C, 45 % ~ 85 %RH).
• Avoid storage in environments with corrosive gases or direct sunlight.

Packaging Labeling:

• Labels include product model, quantity, and country of origin (primarily in English).