Product Overview
The RAxxx Series Metal Alloy Current Sensing Chip Resistors from Pakermicro (Shenzhen) Co., Ltd. are designed for high stability and reliability in demanding applications. These resistors feature ultra-low resistance values, excellent temperature coefficient characteristics, and high power ratings up to 3 watts. They are constructed with a metal alloy element and housed in an epoxy plastic package (UL: 94V-0). These resistors are halogen-free, RoHS compliant, and Pb-free, meeting AEC-Q200 provisions. Key applications include automotive electronics, current sensing, mobile phones, computers, power supplies, and battery chargers.
Product Attributes
- Brand: Pakermicro
- Origin: Shenzhen, China
- Material: Metal Alloy
- Package: Plastic Package Epoxy (UL: 94V-0)
- Compliance: Halogen free, RoHS compliant, Pb free, AEC-Q200 relevant provisions
- Mounting Position: Any
- Marking: 4 digits for 0.5%, 1%, 2%, 3%, 5% tolerance products (First letter 'R' denotes 10, others declare resistance).
Technical Specifications
| Model | Rated Power | Resistance Range | TCR (ppm/) | Insulation Resistance | Operating Temperature Range | Dimensions (L x W x T) mm | Electrode Size (E) mm |
|---|---|---|---|---|---|---|---|
| RA1206 | 1W | 1m~100m (D, F, G, H, J) | 1m: 350; 2m~100m: 50 | >100M | -55~+170 | 3.20.20 x 1.60.20 x 0.600.20 | 0.500.20 |
| 1/2W | 110m~200m | 50 | |||||
| RA2512 | 2W, 3W | 0.5m~500m | 0.5 m, 1m: 350; 2m~500m: 50 | 6.40.20 x 3.20.20 x 0.800.20 | :2.200.20; :0.900.20 | ||
| RA0805 | 1/4W, 1/2W | 1m (350); 2m~20m (50) | 1m: 350; 2m~20m: 50 | >100M | -55~+170 | 2.00.10 x 1.250.10 x 0.600.20 | 0.400.20 |
Performance Reliability Test Methods
| Test Item | Test Methods | Test Conditions | R% (Max) |
|---|---|---|---|
| Temperature Coefficient | IEC60115-1 4.8 | TCR=(R-R0)/(t-t0)R0 10 (ppm) | < 1% (varies by resistance value) |
| ESD test | AEC-Q200-002 | 2KV, 2times/1s | < 1% |
| Solderability | J-STD-002B test B | Dip in flux, then solder bath at 2455 for 2~3sec. | < 1% |
| Resistance to soldering heat | IEC60115-1 4.13 | Dip in flux, then solder bath at 2605 for 101sec. | < 1% |
| Mechanical Shock | MIL-STD-202 METHOD 213 | 100g's, Normal duration 6ms, half sine shock pulse. | < 1% |
| Terminal Bending | AEC-Q200-005 | Min 2mm deflection, 60sec. | < 1% |
| Terminal Strength | AEC-Q200-006 | Applied 17.7N (1.8Kg) for 601seconds. | < 1% |
| Thermal shock | MIL-STD-202 METHOD 107 | -55/+125C, 1000 Cycles. | < 1% |
| Biased Humidity | IEC60115-1 4.23.4 | 85/85%RH for 1000 hours. | < 1% |
| Operational life | IEC60115-1 4.18 | 10% of operating power, 1000 hours at 85. | < 1% |
| Temperature cycling | JESD22 Method JA-104 | Devices mounted. Max transfer time 20 seconds. | < 1% |
| Short-time overload | MIL-STD-202 METHOD 108 | Applied 5.0 times of rated power for 5 seconds. | < 1% |
| High Temperature Exposure | MIL-STD-202 METHOD 103 | 1000 hrs. @T=125. | < 1% |
| Low Temperature operation | 45 min. @T=-55 . | < 1% | |
| Vibration | MIL-STD-202 METHOD 204 | 5g's for 20min. 12 cycles, 10-2000Hz. | < 1% |
2511271355_PAKER-RA1206F1R008G_C53054969.pdf
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