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Specifications
Mfr. Part #:
RA1206F1R006G
Package:
1206
Key Attributes
Model Number:
RA1206F1R006G
Product Description
Product Overview
The RAxxx Series Metal Alloy Current Sensing Chip Resistors from Pakermicro are designed for high stability and reliability, offering ultra-low resistance values and excellent temperature coefficient characteristics. These resistors feature a high power rating of up to 3 watts and are halogen-free and RoHS compliant. They are suitable for a wide range of applications including automotive electronics, current sensing, mobile phones, computers, power supplies, and battery chargers.
Product Attributes
- Brand: Pakermicro ()
- Series: RAxxx
- Material: Metal Alloy
- Package: Plastic Package Epoxy UL: 94V-0
- Compliance: Halogen free, RoHS compliant, Pb free, AEC-Q200 relevant provisions
- Mounting Position: Any
- Marking: 4 digits (for 0.5%, 1%, 2%, 3%, 5% tolerance products)
Technical Specifications
| Model | Rated Power | Resistance Range | TCR (ppm/) | Insulation Resistance | Dimensions (L x W x T mm) | E (mm) |
|---|---|---|---|---|---|---|
| RA1206 | 1W | 1m~100m (D, F, G, H, J) | 1m: 350 2m~100m: 50 | >100M | 3.2 0.20 x 1.6 0.20 x 0.60 0.20 | 0.50 0.20 |
| RA1206 | 1/2W | 110m~200m (D, F, G, H, J) | 50 | 3.2 0.20 x 1.6 0.20 x 0.60 0.20 | 0.50 0.20 | |
| RA2512 | 2W, 3W | 0.5m~500m (D, F, G, H, J) | 0.5 m (), 1m: 350 1m ()~4m (): 50 2m~500m: 50 | 6.4 0.20 x 3.2 0.20 x 0.80 0.20 | : 2.20 0.20 : 0.90 0.20 | |
| RA0805 | 1/4W | 1m (D, F, G, H, J) | 350 | >100M | 2.0 0.10 x 1.25 0.10 x 0.60 0.20 | 0.40 0.20 |
| RA0805 | 1/2W | 2 m~20m (D, F, G, H, J) | 50 | 2.0 0.10 x 1.25 0.10 x 0.60 0.20 | 0.40 0.20 |
Technical Specifications (Continued)
| Item | Specification | Test Method | Test Conditions |
|---|---|---|---|
| Operating Temperature Range | -55~+170 | - | - |
| Resistance Range (Example Codes) | R50m=0.5m, R001=1m, R010=10m, R1R5m=1.5m, R002=2m, R010=10m, R500=500m | - | - |
| Solderability | < 1% | J-STD-002B test B | Dip terminal in flux, then solder bath at 2455 for 2~3sec. |
| Resistance to Soldering Heat | < 1% | IEC60115-1 4.18 | Dip terminal in flux, then solder bath at 2605 for 101sec. |
| Mechanical Shock | < 1% | MIL-STD-202 METHOD 213 | Resistance to 100g's, Normal duration 6ms, half sine shock pulse. |
| Terminal Strength | < 1% | AEC-Q200-006 | Applied 17.7N (1.8Kg) for 601 seconds. |
| Terminal Bending | < 1% | AEC-Q200-005 | Min 2mm deflection, 60sec. |
| Thermal Shock | < 1% | MIL-STD-202 METHOD 107 | -55/+125, Number of cycles is 300. Devices mounted. |
| Biased Humidity | < 1% | IEC60115-1 4.23.4 | 85/85%RH, 1000 hours. |
| Operational Life | < 1% | IEC60115-1 4.13 | 10% of operating power, 1000 hours. |
| Temperature Cycling | < 1% | JESD22 Method JA-104 | -55 to +125, 1000 Cycles. |
| Short-time Overload | < 1% | IEC60115-1 4.8 | Applied 5.0 times of rated power for 5 seconds. |
| High Temperature Exposure | < 1% | MIL-STD-202 METHOD 108 | 1000 hrs. @T=125. |
| Low Temperature Operation | < 1% | MIL-STD-202 METHOD 103 | 45 min. @T=-55 . |
| ESD Test | < 1% | AEC-Q200-002 | 2KV, 2times/1s |
| Temperature Coefficient | See Technical Specifications Table | - | TCR=(R-R0)/(t-t0)R0 10 (ppm) |
Technical Specifications (Continued)
| Model | Recommended Solder Pad Dimension (a x b x L mm) | Package Dimensions (A x B x C mm) | Reel Dimensions (W x A x B x C mm) | Quantity per Reel |
|---|---|---|---|---|
| RA0805 (1m~20m) | 1.40 x 1.20 x 1.40 | - | - | 5000pcs |
| RA2512 (0.5m~4m ) | 4.00 x 3.10 x 1.80 | - | - | 4000pcs |
| RA2512 (1m~500m) | 4.00 x 2.10 x 4.10 | - | - | 4000pcs |
| RA1206 (1m~200m) | 1.80 x 1.70 x 1.60 | - | - | 5000pcs |
| RA0805 | - | - | 60.001.00 x 1782.00 x 13.500.50 x 11.400.10 x 9.000.3 | 5000pcs |
| RA1206 | - | - | 60.001.00 x 1782.00 x 13.500.50 x 11.400.10 x 9.000.3 | 5000pcs |
| RA2512 | - | - | 60.001.00 x 1782.00 x 13.500.50 x 15.401.00 x 13.000.3 | 4000pcs |
2511271355_PAKER-RA1206F1R006G_C53054967.pdf
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