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quality Metal Alloy Chip Resistor PAKER RA2512F3R020G with Low Resistance Values and AEC Q200 Certification factory
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quality Metal Alloy Chip Resistor PAKER RA2512F3R020G with Low Resistance Values and AEC Q200 Certification factory
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Specifications
Mfr. Part #:
RA2512F3R020G
Package:
2512
Key Attributes
Model Number: RA2512F3R020G
Product Description

Product Overview

The RAxxx Series Metal Alloy Current Sensing Chip Resistors from Parker Microelectronics (Shenzhen) Co., Ltd. are designed for high stability and reliability. These resistors feature ultra-low resistance values, excellent temperature coefficient characteristics, and high power ratings up to 3 watts. They are halogen-free, RoHS compliant, and meet AEC-Q200 provisions. Ideal for automotive electronics, current sensing, mobile phones, computers, power supplies, and battery chargers, these resistors offer robust performance in demanding applications.

Product Attributes

  • Brand: Parker Microelectronics (Shenzhen) Co., Ltd.
  • Series: RAxxx Series
  • Material: Metal Alloy
  • Compliance: Halogen free, RoHS compliant, Pb free, AEC-Q200 provisions
  • Package: Plastic Package Epoxy UL: 94V-0
  • Mounting Position: Any

Technical Specifications

Model Rated Power Resistance Range TCR (ppm/) Insulation Resistance Operating Temperature Range
RA1206 1W 1m~100m (D, F, G, H, J) 1m: 350
2m~100m: 50
>100M -55~+170
RA1206 1/2W 110m~200m (D, F, G, H, J) 50 >100M
RA2512 2W, 3W 0.5m~500m (D, F, G, H, J) 0.5 m, 1m: 350
2m~500m: 50
>100M
RA0805 1/4W 1m (D, F, G, H, J) 350 >100M -55~+170
RA0805 1/2W 2 m~20m (D, F, G, H, J) 50 >100M

Packing Information

Type Packing Code Description
RAxxx Series G Reel ()
RAxxx Series V Bulk ()

Dimensions

Type L (mm) W (mm) T (mm) E (mm)
RA1206 3.20.20 1.60.20 0.600.20 0.500.20
RA2512 6.40.20 3.20.20 0.800.20 :2.200.20
:0.900.20
RA0805 2.00.10 1.250.10 0.600.20 0.400.20

Performance & Reliability Test Methods

Test Item Test Methods Test Conditions R% (Max)
Temperature Coefficient IEC60115-1 4.8 TCR=R-R0 /t-t0R0 106ppm Refer to Specification
Solderability J-STD-002B test B 2455 for 2~3sec < 1%
Resistance to soldering heat IEC60115-1 4.13 2605 for 101sec < 1%
Mechanical Shock MIL-STD-202 METHOD 213 100g's, Normal duration is 6ms, half sine shock pulse < 1%
Resistance to vibration MIL-STD-202 METHOD 204 5g's for 20min.12cycles, 10-2000Hz < 1%
Biased Humidity IEC60115-1 4.23.4 85/85%RH, 10% of operating power, 1000 hours < 1%
Operational life IEC60115-1 4.18 1000 hours, 85, 10% of operating power < 1%
Temperature cycling MIL-STD-202 METHOD 107 300 cycles (-55 to +125) < 1%
Short-time overload AEC-Q200-006 Applied 5.0 times of rated power for 5 second < 1%
High Temperature Exposure AEC-Q200-005 1000 hrs. @T=125 < 1%
Low Temperature operation JESD22 Method JA-104 45 min. @T=-55 < 1%
ESD test AEC-Q200-002 2KV, 2times/1s < 1%
Terminal Bending MIL-STD-202 METHOD 108 Min 2mm deflection ,60sec < 1%
Terminal Strength MIL-STD-202 METHOD 103 Applied a 17.7N (1.8Kg) for 601seconds < 1%
Thermal shock IEC60115-1 4.13 -55/+125C, Number of cycles is 300. Devices mounted. Maximum transfer time is 20 seconds. < 1%

2511271355_PAKER-RA2512F3R020G_C53054979.pdf

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