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quality Current Sensing Chip Resistor PAKER RA2512F3R009G Metal Alloy Type with High Power Rating and Low TCR factory
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quality Current Sensing Chip Resistor PAKER RA2512F3R009G Metal Alloy Type with High Power Rating and Low TCR factory
>
Specifications
Mfr. Part #:
RA2512F3R009G
Package:
2512
Key Attributes
Model Number: RA2512F3R009G
Product Description

Product Overview

The RAxxx Series Metal Alloy Current Sensing Chip Resistors from Pakermicro are designed for high stability and reliability. These resistors feature ultra-low resistance values, excellent temperature coefficient characteristics, and high power ratings up to 3 watts. They are halogen-free, RoHS compliant, and Pb-free, meeting AEC-Q200 provisions. Applications include automotive electronics, current sensing, mobile phones, computers, power supplies, and battery chargers.

Product Attributes

  • Brand: Pakermicro
  • Origin: Shenzhen, China
  • Material: Metal Alloy
  • Package: Plastic Package (Epoxy UL: 94V-0)
  • Compliance: Halogen free, RoHS compliant, Pb free, AEC-Q200 relevant provisions
  • Mounting Position: Any

Technical Specifications

Model Rated Power Resistance Range TCR (ppm/) Insulation Resistance Operating Temperature Range
RA1206 1W 1m~100m 1m: 350
2m~100m: 50
>100M -55~+170
RA1206 1/2W 110m~200m 50
RA2512 2W, 3W 0.5m~500m 0.5 m 1m: 350
2m~500m: 50
RA0805 1/4W, 1/2W 1m (350)
2 m~20m (50)
1m: 350
2 m~20m: 50
>100M -55~+170

Packing Information

Model Packing Code Quantity Reel Dimensions (mm)
RA0805 G (reel) 5000pcs 1782.00 (A)
60.001.00 (B)
13.500.50 (C)
11.400.10 (F)
9.000.3 (W)
RA1206 G (reel) 5000pcs 1782.00 (A)
60.001.00 (B)
13.500.50 (C)
11.400.10 (F)
9.000.3 (W)
RA2512 G (reel) 4000pcs 1782.00 (A)
60.001.00 (B)
13.500.50 (C)
15.401.00 (F)
13.000.3 (W)

Package Outline Dimensions

Type L (mm) W (mm) T (mm) E (mm)
RA1206 3.20.20 1.60.20 0.600.20 0.500.20
RA2512 6.40.20 3.20.20 0.800.20 :2.200.20
:0.900.20
RA0805 2.00.10 1.250.10 0.600.20 0.400.20

Recommended Solder Pad Dimensions

Type Resistance Range A (mm) B (mm) C (mm)
RA0805 1m~20m 1.40 1.20 1.40
RA2512 0.5m~4m () 4.00 3.10 1.80
RA2512 1m~500m 4.00 2.10 4.10

Performance Reliability Test Methods

Test Item Test Methods Test Conditions R% (Max)
Solderability IEC60115-1 4.18 Dip terminal in flux, then in soldering bath at 2455 for 2~3sec. < 1%
Resistance to soldering heat IEC60115-1 4.23.4 Dip terminal in flux, then in soldering bath at 2605 for 101sec. < 1%
Mechanical Shock MIL-STD-202 METHOD 213 Resistance to 100g's, Normal duration 6ms, half sine shock pulse. < 1%
Terminal Bending AEC-Q200-005 Min 2mm deflection, 60sec. < 1%
Terminal Strength AEC-Q200-006 Applied a 17.7N (1.8Kg) for 601seconds. < 1%
ESD test AEC-Q200-002 2KV, 2times/1s < 1%
Biased Humidity IEC60115-1 4.13 1000 hours, 85/85%RH, 10% of operating power. < 1%
Operational life IEC60115-1 4.8 1000 hours, 85/85%RH, 10% of operating power. < 1%
Temperature cycling MIL-STD-202 METHOD 107 1000 Cycles (-55 to +125). < 1%
Short-time overload MIL-STD-202 METHOD 108 Applied 5.0 times of rated power for 5 second. < 1%
High Temperature Exposure JESD22 Method JA-104 1000 hrs. @T=125. < 1%
Low Temperature operation MIL-STD-202 METHOD 103 45 min. @T=-55 . < 1%
Resistance to vibration MIL-STD-202 METHOD 204 5g's for 20min. 12 cycles, 10-2000Hz. < 1%
Thermal shock J-STD-002B test B Use -55/+125C, Number of cycles is 300. Devices mounted. Maximum transfer time is 20 seconds. < 1%

Temperature Coefficient TCR

TCR=(R-R0)/(t-t0)R0 106 (ppm)

Where R0 is resistance at room temperature, R is resistance at +125 or +155, t0 is room temperature, and t is test temperature (+125 or +155).


2511271355_PAKER-RA2512F3R009G_C53054977.pdf

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