Product Overview
The NB6L295M is a dual-channel programmable clock/data delay chip designed for clock or data de-skewing and timing adjustment. It offers two individual variable delay channels (PD0 and PD1) that can operate in either Dual Delay Mode or Extended Delay Mode. In Dual Delay Mode, each channel provides independent programmable delay. In Extended Delay Mode, the delay of PD0 is cascaded with PD1 for additive delay. Programming is achieved via a 3-pin Serial Data Interface, offering a fine increment resolution of typically 11 ps. The device supports multi-level inputs compatible with LVPECL, LVDS, CML, LVCMOS, and LVTTL logic levels, and features differential CML outputs with internal termination and temperature compensation. It is suitable for high-performance applications within the ECLinPS MAX family.
Product Attributes
- Brand: ON Semiconductor
- Family: ECLinPS MAX
- Package Type: QFN-24
- Pb-Free: Yes
- Operating Temperature: -40C to 85C
Technical Specifications
| Characteristic | Value | Unit |
|---|---|---|
| Input Clock Frequency | > 1.5 GHz | |
| Input Data Rate | > 2.5 Gb/s | |
| Programmable Delay Range (Dual Mode per Channel) | 0 to 6 | ns |
| Programmable Delay Range (Extended Mode) | 0 to 11.2 | ns |
| Total Delay Range (Dual Mode per Channel) | 3.2 to 8.5 | ns |
| Total Delay Range (Extended Mode) | 6.2 to 16.6 | ns |
| Delay Increment Resolution | 11 | ps |
| Linearity | ±20 (Maximum) | ps |
| Rise and Fall Times (Typical) | 100 | ps |
| Clock Jitter (RMS, Typical) | 2.4 | ps |
| Data Dependent Jitter (Pk-Pk, Typical) | 20 | ps |
| Input Compatibility | LVPECL, CML, LVDS (Differential); LVPECL, LVCMOS, LVTTL (Single Ended) | |
| Output Type | CML | |
| Output Voltage Amplitude (Typical) | 380 | mV |
| Internal Input/Output Termination | 50 | Ω |
| Supply Voltage (VCC) | 2.375 to 3.6 | V |
| Package Dimensions | 4 mm x 4 mm | |
| Pin Count | 24 | |
| Serial Interface | 3-Wire | |
| Power Supply Current (Typical) | 215 | mA |
| Thermal Resistance (Junction-to-Ambient, 0 lfpm) | 37 | °C/W |
| Thermal Resistance (Junction-to-Ambient, 500 lfpm) | 32 | °C/W |
| Thermal Resistance (Junction-to-Case) | 11 | °C/W |
2411271950_onsemi-NB6L295MMNG_C462881.pdf
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