Product Overview
The NUF8401MN is an eight-channel (C-R-C) Pi-style EMI filter array with integrated ESD protection. It offers a typical component configuration of R = 100 and C = 12 pF, delivering a cutoff frequency of 175 MHz and stop band attenuation greater than -25 dB from 800 MHz to 2.2 GHz. This performance is ideal for parallel interfaces with data rates up to 117 Mbps, effectively minimizing interference from 2G/3G, GPS, Bluetooth, and WLAN signals. The device integrates EMI/ESD protection in a compact DFN package, providing cost, reliability, and space savings. It is suitable for EMI filtering of LCD and camera data lines, as well as I/O ports and keypads.
Product Attributes
- Brand: ON Semiconductor
- Certifications: Pb-Free
Technical Specifications
| Model | Description | ESD Protection | R/C Values | Cutoff Frequency (f3dB) | Stop Band Attenuation | Data Rate | Package | Ordering Information |
|---|---|---|---|---|---|---|---|---|
| NUF8401MN | 8-Channel EMI Filter with Integrated ESD Protection | 14 kV (IEC61000-4-2 Level 4, Contact Discharge) | 100 / 12 pF | 175 MHz | > -25 dB (800 MHz to 2.2 GHz) | Up to 117 Mbps | DFN16 (1.6 mm x 4.0 mm) | NUF8401MNT4G |
Electrical Characteristics
| Parameter | Test Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Maximum Reverse Working Voltage (VRWM) | 5.0 | V | |||
| Breakdown Voltage (VBR) | IR = 1.0 mA | 6.0 | 7.0 | 8.0 | V |
| Leakage Current (IR) | VRWM = 3.3 V | 100 | nA | ||
| Resistance (RA) | IR = 20 mA | 85 | 100 | 115 | |
| Diode Capacitance (Cd) | VR = 2.5 V, f = 1.0 MHz | 10 | 12 | 15 | pF |
| Line Capacitance (CL) | VR = 2.5 V, f = 1.0 MHz | 20 | 24 | 30 | pF |
| 3 dB Cut-Off Frequency (f3dB) | 175 | MHz | |||
| 6 dB Cut-Off Frequency (f6dB) | 275 | MHz |
Maximum Ratings
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| ESD Discharge (IEC61000-4-2 Contact Discharge) | VPP | 14 | kV |
| Steady-State Power per Resistor @ 25C | PR | 328 | mW |
| Operating Temperature Range | TOP | -40 to 85 | C |
| Storage Temperature Range | TSTG | -55 to 150 | C |
| Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) | TL | 260 | C |
Package Dimensions
| Dimension | Min | Max | Unit |
|---|---|---|---|
| A | 0.80 | 1.00 | mm |
| A1 | 0.00 | 0.05 | mm |
| A3 | 0.20 | REF | mm |
| b | 0.18 | 0.30 | mm |
| D | 4.00 | BSC | mm |
| D2 | 3.10 | 3.30 | mm |
| E | 1.60 | BSC | mm |
| E2 | 0.30 | 0.50 | mm |
| e | 0.50 | BSC | mm |
| K | 0.20 | --- | mm |
| L | 0.20 | 0.40 | mm |
| L1 | 0.00 | 0.15 | mm |
2410010231_onsemi-NUF8401MNT4G_C895158.pdf
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