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Specifications
Load Capacitance:
-
Operating Temperature:
-
Frequency:
-
Mfr. Part #:
NX3215SA-32.768kHz-EXS00A-MU00202
Package:
SMD3215-2P
Key Attributes
Model Number:
NX3215SA-32.768kHz-EXS00A-MU00202
Product Description
Product Overview
The NX3215SA is a crystal unit designed for precise frequency control. It operates on a fundamental overtone and is suitable for various electronic applications requiring stable oscillation.
Product Attributes
- Brand: NIHON DEMPA KOGYO CO., LTD. (NDK)
- Origin: Japan (implied by company origin and document language)
- Material: Ceramic (Base), Metal (Cover), Tungsten (Terminal), Silicon + Ag filler (Conductive adhesive), Au (Electrode), Cr (Base)
- Certifications: Not explicitly mentioned
Technical Specifications
| Item | Specification |
|---|---|
| Type | NX3215SA |
| Nominal Frequency (F0) | 32.768 kHz |
| Overtone Order | Fundamental |
| Adjustment Tolerance (at +25C) | 20 10-6 Max. (Excluding aging) |
| Turning Point | +25C5C |
| Temperature Coefficient | -0.0410-6 / C2 Max. |
| Equivalent Resistance (RR) | 70 k Max. |
| Shunt Capacitance (C0) | 1.0 0.5 pF |
| Motional Capacitance (C1) | 4.0 2.0 fF |
| Insulation Resistance | 500 M (Min.) at DC100V 15V (Terminal to terminal and terminal to cover) |
| Operating Temperature Range | -40 to +85C |
| Storage Temperature Range | -40 to +125C |
| Maximum Drive Level | 0.5 mW Max. |
| Aging (at +25 C) | 3 10-6 Max. / 1 year |
| Reflow Soldering Peak Temperature | 265C, 10 sec |
| Reflow Soldering Heating | 230C or higher, 30 sec |
| Reflow Soldering Preheating | 150C to 180C, 120 sec |
| Reflow Passage Times | Two times |
| Manual Soldering Heat Resistance | Soldering iron of 400C on the terminal electrode for four seconds (twice) |
Measurement Circuit
| Parameter | Instrument | Load Capacitance (CL) | Level of Drive |
|---|---|---|---|
| Frequency Measurement | Network Analyzer (CNA-LF) | 7.0pF | 0.1 mW |
| Equivalent Resistance Measurement | Network Analyzer (CNA-LF) | Series | 0.1 mW |
Application Drawings
| Drawing Type | Document No. |
|---|---|
| Dimension Drawing | EXD14B-00462 |
| Taping and Reel Figure | EXK17B-00302 |
| Holder Marking | EXH11B-00422 |
| Reel Packing | EEK17B-00015 |
| Structural Drawing | EXD13B-00243 |
| Reliability Assurance Item | EXS30B-00661 |
| Quality Control Process Flow Chart | EXQ11B-00387 |
Reliability Assurance
| Test Item | Test Methods | Specification Code | Specification |
|---|---|---|---|
| AGING | 1 year at 25 C 3C | a | dF/F 5ppm, dCI 5 kohm |
| HEAT RESISTANCE | at +85 C for 500 hours. | a | dF/F 5ppm, dCI 5 kohm |
| COLD RESISTANCE | at 40 C for 500 hours. | a | dF/F 5ppm, dCI 5 kohm |
| HUMIDITY | at +85 C with 80 to 85 % RH for 500 hours. | a | dF/F 5ppm, dCI 5 kohm |
| THERMAL SHOCK | Temperature cycle (100 cycles) | a | dF/F 5ppm, dCI 5 kohm |
| VIBRATION | Frequency Range: 10 to 2000Hz, Amplitude or Acceleration: 1.52 mm or 196m/s2 | a | dF/F 5ppm, dCI 5 kohm |
| SHOCK 1 | Shock: 3000 Gs 0.3 msec. | a | dF/F 5ppm, dCI 5 kohm |
| SHOCK 2 | Device on 200 g weight dropped on concrete board from 1.5 m height. | b | dF/F 15ppm, dCI 5 kohm |
| SOLDERABILITY | Peak temperature 240C (more than 215 C 10 to 30 sec), Residual heat temperature 150 C, Residual heat time 60 to 120 sec | c | The electrodes shall acquire a new solder coat over at least 90 % of immersed area. |
| REFLOW RESISTANCE | Temperature cycle (3 cycles) | a | dF/F 5ppm, dCI 5 kohm |
2409291434_NDK-NX3215SA-32-768kHz-EXS00A-MU00202_C280830.pdf
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