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quality Low insertion loss EMI filter Nexperia PCMF3HDMI14SZ designed for effective common mode EMI suppression factory
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quality Low insertion loss EMI filter Nexperia PCMF3HDMI14SZ designed for effective common mode EMI suppression factory
quality Low insertion loss EMI filter Nexperia PCMF3HDMI14SZ designed for effective common mode EMI suppression factory
>
Specifications
Mfr. Part #:
PCMF3HDMI14SZ
Package:
WLCSP-15
Key Attributes
Model Number: PCMF3HDMI14SZ
Product Description

Product Overview

Common-mode ElectroMagnetic Interference (EMI) filters with integrated ElectroStatic Discharge (ESD) protection for one, two, and three differential channels. These devices are engineered to offer low insertion loss for high-speed differential signals while effectively attenuating unwanted common-mode signals. Each differential channel features integrated coils for signal line coupling and diodes for ESD protection up to 15 kV on each signal line. Key benefits include superior common-mode suppression, excellent RF performance, and high symmetry between line pairs. They are available in industry-standard Wafer Level Chip Scale Packages (WLCSP) for a smaller footprint.

Product Attributes

  • Brand: Nexperia
  • Certifications: IEC 61000-4-2, IEC 61000-4-5

Technical Specifications

Type numberNumber of channelsPackage NameDescriptionMarking CodeInput Voltage (V)ESD Voltage (kV)Storage Temp (C)Ambient Temp (C)Channel Series Resistance ()Diode Capacitance (pF)Common Mode Insertion Loss (dB) @ 800 MHzCommon Mode Insertion Loss (dB) @ 1.7 GHzCommon Mode Insertion Loss (dB) @ 3 GHzDifferential Mode Insertion Loss (dB) @ 1 MHzDifferential Cut-off Frequency (GHz)
PCMF1HDMI14S1WLCSP5wafer level chip-size package; 5 bumps (2-1-2)PF1S-0.5 to 515 (contact) / 15 (air)-40 to +125-40 to +85- to 3- to 0.25- to -12- to -21.5- to -31.5- to 0.3- to 6
PCMF2HDMI14S2WLCSP10wafer level chip-size package; 10 bumps (4-2-4)PF2S-0.5 to 515 (contact) / 15 (air)-40 to +125-40 to +85- to 3- to 0.25- to -12- to -21.5- to -31.5- to 0.3- to 6
PCMF3HDMI14S3WLCSP15wafer level chip-size package; 15 bumps (6-3-6)PF3S-0.5 to 515 (contact) / 15 (air)-40 to +125-40 to +85- to 3- to 0.25- to -12- to -21.5- to -31.5- to 0.3- to 6

2006101443_Nexperia-PCMF3HDMI14SZ_C552020.pdf

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