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Specifications
Capacitance:
1nF
Operating Temperature:
-25℃~+125℃
Ratings:
Y1
Voltage(AC):
400V
Tolerance:
±20%
safety certification:
CQC;VDE;UL;KTL
Mfr. Part #:
H102M050FG55250L100A
Package:
Through Hole,P=10mm
Key Attributes
Model Number:
H102M050FG55250L100A
Product Description
Product Overview
The DAFU Manufacturing Y1 Safety Certified Ceramic Disc Capacitor is designed for electronic equipment, offering interference suppression, bridging, grounding protection, and bypassing functions. These capacitors are manufactured by Dongguan DAFU Electronics Co., Ltd. and are compliant with various international safety standards including UL, CQC, VDE, KTL, and KC.
Product Attributes
- Brand: DAFU Manufacturing ()
- Origin: Dongguan, China
- Product Type: Safety Certified Ceramic Disc Capacitor (Y1 )
- Material Series: Y5V
- Lead Pitch: 10MM
- Certifications: UL, CQC, VDE, KTL, KC
- Environmental Compliance: RoHS Directive compliant
Technical Specifications
| Model Detail | CAP (PF) | DF (%) | IR (M) | T.V (VAC) | Lead Type | D 1.0 (mm) | T 1.0 (mm) | L Max (mm) | F 0.5 (mm) | d 0.05 (mm) | e Max (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Y1 Y5V P:10MM (H102M050FG55250L100) | 1000 | 2.5 | 10000 | 4000V | L | 6.0 | 4.0 | 25 | 10 | 0.55 | 3.5 |
| Y1 Y5V P:10MM (H152M060FG55250L100) | 1500 | 2.5 | 10000 | 4000V | L | 7.0 | 4.5 | 25 | 10 | 0.55 | 3.5 |
| Y1 Y5V P:10MM (H222M070FG55250L100) | 2200 | 2.5 | 10000 | 4000V | L | 8.0 | 4.5 | 25 | 10 | 0.55 | 3.5 |
| Y1 Y5V P:10MM (H332M087FG58250L100) | 3300 | 2.5 | 10000 | 4000V | L | 10.0 | 4.0 | 25 | 10 | 0.58 | 3.5 |
| Y1 Y5V P:10MM (H472M105FG58250L100) | 4700 | 2.5 | 10000 | 4000V | L | 11.5 | 4.5 | 25 | 10 | 0.58 | 3.5 |
Performance Testing
| Test Item | Test Method | Specification |
|---|---|---|
| Capacitance and Tolerance | Tested at 20, 1 kHz and 1 Vrms | Refer to specification table |
| Dissipation Factor (DF) | Tested at 20, 1 kHz and 1 Vrms | 2.5% max. (Y5P, Y5U, Y5V) |
| Insulation Resistance | Tested at 500VDC, charged for 605 seconds | 10000 M min. |
| Withstand Voltage (Between leads) | 2500Vrms (X1/Y2) or 4000Vrms (X1/Y1) for 5 seconds | No breakdown or arcing |
| Withstand Voltage (Between leads and case) | 2600Vrms (X1/Y2) or 4000Vrms (X1/Y1) for 60 seconds | No breakdown or arcing |
| Temperature Characteristics (Capacitance Change) | Y5P: 10%, Y5U: +20% to -55%, Y5V: +20% to -80% | See detailed steps in document |
| Lead Tensile Strength | Axial pull of 10N for 101 seconds | No damage, no cracking or loosening of leads |
| Bending Test | 90 bending with 5N load | No damage to leads |
| Solderability | Solder temp: 2355, Immersion: 2.50.5 sec | Over 95% coverage of immersed lead part |
| Resistance to Soldering Heat | Solder temp: 2605, Immersion: 100.5 sec | No visible damage |
| Resistance to Solvents | Immersion in Isopropyl alcohol for 305 seconds | No visible damage |
| Damp Heat Test | 402, 90-95% RH for 500+24 hours | No visible damage |
| Endurance Test | 1000 hours at 853 or 402 with voltage cycling | No visible damage, Capacitance change 20%, DF 5%max., IR 3000M min. |
| Charge/Discharge Test (I) | 50 cycles of charge/discharge, followed by withstand voltage test | No visible damage, IR 1000M min. |
| Charge/Discharge Test (II) | 4 discharges at 5KV, followed by 240Vrms for 30s | Gauze does not scorch or ignite |
| Flammability Test | 5 cycles of 15s flame contact, 15s off | Maximum flame continuation time specified |
Environmental & Material Information
| Item | Limited Level |
|---|---|
| Cadmium (Cd)/Cadmium Compounds | 100PPM |
| Lead (Pb)/Lead Compounds | 1000PPM |
| Mercury (Hg)/Mercury Compounds | 1000PPM |
| Hexavalent-Chromium (Cr6+) Compounds | 1000PPM |
| PBB/PBDE | 1000PPM |
| No. | Name | Specification | Supplier |
|---|---|---|---|
| 1 | Lead wire | 0.55/0.6/0.7 0.05 | Shenzhen Yangqi Industrial Co., Ltd.; Ma'anshan Xingguan Electronic Materials Co., Ltd./Hengtai Electronics |
| 2 | Ceramic Dielectric | Y5P, Y5U, Y5V | Guangdong DAFU Electronics Co., Ltd.; Liaocheng XinhuaYi Electronics Co., Ltd.; Kunshan Wanfeng Electronics Co., Ltd.; Hangzhou Xin'anjiang Tonghao Electronics Co., Ltd. |
| 3 | Encapsulation Material | Epoxy Resin XCP-231; Epoxy Resin TK1000 | Tianjin Ruiyuan Powder Coating Co., Ltd.; Xi'an Baker Electronic Materials Technology Co., Ltd.; Weihua Electronics |
| 4 | Tin Alloy | Tin bar Sn98Ag2.0 | Dongguan Guangchen Metal Products Co., Ltd.; Nanjing Damai Technology Industrial Co., Ltd. |
2207141800_NDF-H102M050FG55250L100A_C3025028.pdf
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