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quality High density mounting wire wound chip inductor MYX MWI0603LD100MST-TIA-HF for electronic components factory
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quality High density mounting wire wound chip inductor MYX MWI0603LD100MST-TIA-HF for electronic components factory
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Specifications
Current Rating:
380mA
Inductance:
10uH
Frequency - Self Resonant:
25MHz
Tolerance:
±20%
Current - Saturation (Isat):
270mA
DC Resistance(DCR):
Type:
Wire-wound Chip Inductor
Q @ Frequency:
9@1MHz
Mfr. Part #:
MWI0603LD100MST-TIA-HF
Package:
0603
Key Attributes
Model Number: MWI0603LD100MST-TIA-HF
Product Description

Product Overview

The MWI0603LD-TIA series is a range of wire-wound chip inductors designed for various electronic applications. These inductors are characterized by their compact size, suitable for high-density mounting, and offer reliable performance across a spectrum of inductance values. They are manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD and are compliant with environmental standards such as Lead Free (LF) and Halogen Free (HF).

Product Attributes

  • Brand: Ming Yixuan ()
  • Product Type: Wire Wound Chip Inductor
  • Series: MWI0603LD-TIA
  • Origin: Dongguan, Guangdong, China
  • Environmental Compliance: LF (Lead Free), HF (Halogen Free)
  • Terminal Material: Tin (S)
  • Packaging Options: Tape & Reel (T), Bulk (B)
  • Moisture Sensitivity Level (MSL): 1
  • Recommended Usage Period: Within 12 months from date of delivery

Technical Specifications

Part Number Inductance (uH) Q (Typ.) SRF (MHz) (Typ.) Rdc () Typ. Irms (mA) Typ. Isat (mA) Typ.
MWI0603LD1R0MST-TIA-HF 1@1MHz 10@1MHz 350.00 0.14 900 800
MWI0603LD2R2MST-TIA-HF 2.2@1MHz 10@1MHz 90.00 0.30 600 580
MWI0603LD4R7MST-TIA-HF 4.7@1MHz 10@1MHz 57.00 0.46 500 450
MWI0603LD6R8MST-TIA-HF 6.8@1MHz 9@1MHz 25.00 0.67 500 410
MWI0603LD100MST-TIA-HF 10@1MHz 9@1MHz 25.00 1.00 380 270
MWI0603LD150MST-TIA-HF 15@1MHz 9@1MHz 25.00 1.42 350 220
MWI0603LD220MST-TIA-HF 22@1MHz 8@1MHz 20.00 2.46 270 180

Dimensions (Unit: mm)

L W T E F D
1.8 Max. 1.25 Max. 1.20 Max. 0.64 Max. 1.02 Typ. 0.64 Typ.

General Specifications

  • Operating Temperature: -40 ~ +85 (Including self-generated heat)
  • Storage Temperature: -10 ~ +40, R.H.: 60% Max.
  • Part Temperature Limit: Should not exceed 85 C under worst-case operating conditions (ambient + temp rise). Verification in end application is required.

Soldering Conditions

  • Re-flow Soldering (Lead Free): Preheat to 150; Tip temperature (Max) 260; Reflow times: no more than 2 times; Solder paste thickness: best 0.08mm, max 0.1mm.
  • Hand Soldering: Use a 20 watt soldering iron with tip diameter of 1.0mm; Limit soldering time to 3 sec.

Package Specification (Tape & Reel)

A B T A B C D F W t
1.15 Typ. 1.83 Typ. 0.95 Typ. 178 Typ. 60 Typ. 13 Typ. 21 Typ. 2 Typ. 8.4 Typ. 2 Typ.

Packaging Quantity: 4000 Pcs/Reel

Outer Packaging Details

  • Inner Box: 4 Reels per box (16000 PCS total)
  • Outer Carton Sizes:
    • Small Box: 6 inner boxes (96000 PCS total) - Dimensions: 40.6*23*19.7cm
    • Medium Box: 8 inner boxes (128000 PCS total) - Dimensions: 41*22*26cm
    • Large Box: 10 inner boxes (160000 PCS total) - Dimensions: 41*22*33cm
  • Inner Box Dimensions: 20.3*19.3*5.5cm

2505191720_MYX-MWI0603LD100MST-TIA-HF_C48946348.pdf

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