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Specifications
Current Rating:
1.2A
Inductance:
1uH
Frequency - Self Resonant:
250MHz
Tolerance:
±20%
Current - Saturation (Isat):
1.1A
DC Resistance(DCR):
140mΩ
Type:
Wire-wound Chip Inductor
Q @ Frequency:
12
Mfr. Part #:
MWI0805LD1R0MST-TIA-HF
Package:
0805
Key Attributes
Model Number:
MWI0805LD1R0MST-TIA-HF
Product Description
Product Overview
The MWI0805LD-TIA series wire wound chip inductors are designed for electronic applications requiring reliable inductance components. These inductors feature a compact 0805 chip size, making them suitable for space-constrained designs. They are manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD, a company committed to quality and environmental standards, offering both Lead Free (LF) and Halogen Free (HF) options. The series provides a range of inductance values with tight tolerances and is designed for compatibility with standard reflow and hand soldering processes.
Product Attributes
- Brand: Ming Yixuan ()
- Origin: DongGuan, China
- Product Type: Wire Wound Chip Inductor
- Series: MWI0805LD-TIA
- Environmental Compliance: LF (Lead Free), HF (Halogen Free)
- Packaging Options: Tape & Reel (T), Bulk (B)
Technical Specifications
| Part Number | Inductance (uH) | Frequency (MHz) | Q (Typ.) | SRF (MHz)Typ. | Rdc 30% ()Max. | Isat (mA)Typ. | Irms (mA)Typ. |
|---|---|---|---|---|---|---|---|
| MWI0805LD1R0MST-TIA-HF | 1 | 1 | 12 | 250 | 0.14 | 1100 | 1200 |
| MWI0805LD2R2MST-TIA-HF | 2.2 | 1 | 12 | 100 | 0.18 | 750 | 900 |
| MWI0805LD4R7MST-TIA-HF | 4.7 | 1 | 12 | 50 | 0.32 | 530 | 550 |
| MWI0805LD8R2MST-TIA-HF | 8.1 | 1 | 12 | 35 | 0.50 | 430 | 460 |
| MWI0805LD100MST-TIA-HF | 10 | 1 | 12 | 35 | 0.55 | 420 | 450 |
Dimensions (Unit: mm)
| Parameter | L | W | T | E | F | D |
|---|---|---|---|---|---|---|
| Value | 2.4 Max. | 1.73 Max. | 1.52 Max. | 1.02 Typ. | 1.78 Typ. | 0.76 Typ. |
General Specifications
- Operating Temperature: -40 ~ +85 (Including self-generated heat)
- Storage Temperature: -10 ~ +40
- Storage Relative Humidity: 60% Max.
- Moisture Sensitivity Level (MSL): 1
- Recommended Usage Period: Within 12 months from the date of delivery
- Maximum Part Temperature: Not to exceed 85 C (ambient + temp rise) under worst-case operating conditions. Verification in end application is required.
Soldering Conditions
- Re-flow Soldering (Lead Free): Preheat to 150; Max tip temperature 260; Max 2 reflow times; Solder paste thickness: 0.08mm (best), 0.1mm (max).
- Hand Soldering: Use a 20 watt soldering iron with a 1.0mm tip diameter; Limit soldering time to 3 seconds.
Package Specification (Unit: mm)
| Type | A | B | T | A | B | C | D | E | W | t |
|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | 1.85 | 2.4 | 1.45 | 0805 | 178 | 60 | 13 | 21 | 8.4 | 2 |
Packaging Quantity: 2000 Pcs/Reel
Package Specifications (Inside Box and Outside Carton)
- Per Reel: 2000 PCS
- Inner Box Packaging: 4 Reels per box (8000 PCS total)
- Outer Carton Packaging:
- Small Box: 6 Inner Boxes (48,000 PCS total)
- Medium Box: 8 Inner Boxes (64,000 PCS total)
- Large Box: 10 Inner Boxes (80,000 PCS total)
- Inner Box Dimensions: 20.3*19.3*5.5cm
- Outer Carton Dimensions:
- Small Box: 40.6*23*19.7cm
- Medium Box: 41*22*26cm
- Large Box: 41*22*33cm
2505191720_MYX-MWI0805LD1R0MST-TIA-HF_C48946404.pdf
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