Product Overview
The MWI0805LD-TIA series is a line of wire-wound chip inductors designed for electronic applications. These components offer specific inductance values, Q factors, and SRF (Self-Resonant Frequency) ratings, making them suitable for various circuit designs. They are manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD and are available in lead-free and halogen-free options.
Product Attributes
- Brand: Ming Yixuan ()
- Origin: Dongguan, China
- Product Type: Wire Wound Chip Inductor
- Series: MWI0805LD-TIA
- Environmental Compliance: LF (Lead Free), HF (Halogen Free)
Technical Specifications
Shape & Dimension (Unit: mm)
| L | W | T | E (Typ.) | F (Typ.) | D (Typ.) |
|---|---|---|---|---|---|
| 2.4 Max. | 1.73 Max. | 1.52 Max. | 1.02 | 1.78 | 0.76 |
Part Numbering System
MWI 0805 LD [Inductance] [Tolerance] [Terminal] [Packaging] - [E.P.]
- 1. Product Symbol: MWI
- 2. Dimensions: 0805
- 3. Material: LD
- 4. Inductance: e.g., 1R0 (1.0uH), 2R2 (2.2uH), 4R7 (4.7uH), 8R2 (8.2uH), 100 (10uH)
- 5. Tolerance: K (10%), M (20%)
- 6. Terminal: S (Tin Terminal)
- 7. Packaging: T (Tape & Reel), B (Bulk)
- 8. E.P. (Environmental Protection): LF (Lead Free), HF (Halogen Free)
Electrical Characteristics
| No. | Part Number | L (uH) | Freq (MHz) | Q (Typ.) | SRF (MHz) Typ. | Rdc 30% () Max. | Isat (mA) Typ. | Irms (mA) Typ. |
|---|---|---|---|---|---|---|---|---|
| 1 | MWI0805LD1R0MST-TIA-HF | 1 | 1 | 12 | 250 | 0.14 | 1100 | 1200 |
| 2 | MWI0805LD2R2MST-TIA-HF | 2.2 | 1 | 12 | 100 | 0.18 | 750 | 900 |
| 3 | MWI0805LD4R7MST-TIA-HF | 4.7 | 1 | 12 | 50 | 0.32 | 530 | 550 |
| 4 | MWI0805LD8R2MST-TIA-HF | 8.1 | 1 | 12 | 35 | 0.50 | 430 | 460 |
| 5 | MWI0805LD100MST-TIA-HF | 10 | 1 | 12 | 35 | 0.55 | 420 | 450 |
Test Remarks:
- (1). All test data is referenced to 25 ambient.
- (2). Isat: DC current at which inductance drops approximate 30% from its value without current.
- (3). Irms: DC current that causes the temperature rise (T 40 ) from 25 ambient.
General Specification
- Operating Temperature: -40 ~ +85 (Including self-generated heat)
- Storage Temperature: -10 ~ +40 R.H.: 60% Max.
- Moisture Sensitivity Level (MSL): 1
- Recommended Usage: Within 12 months from the date of delivery.
- Part Temperature Limit: The part temperature (ambient + temp rise) should not exceed 85 C under worst-case operating conditions. Verification in the end application is required.
Soldering Conditions
Re-flow Soldering (Lead Free):
- Preheat circuit and products to 150.
- Peak tip temperature: 260 (Max).
- Reflow times: No more than 2 times.
- Solder paste thickness: Best 0.08mm, Max 0.1mm.
Hand Soldering:
- Soldering iron: 20 watt with tip diameter of 1.0mm.
- Limit soldering time to 3 sec.
Package Specification (Unit: mm)
| Type | A | B | T | A | B | C | D | E | W | t | |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | 1.85 | 2.4 | 1.45 | 0805 | 178 | 60 | 13 | 21 | 2 | 8.4 | 2 |
Packaging Quantity: 2000Pcs/Reel
Package Specifications Inside Box And Outside Carton
| Description | Quantity | Dimensions (cm) |
|---|---|---|
| Per Reel | 2000 PCS | - |
| Inner Box (4 Reels) | 8000 PCS | 20.3*19.3*5.5 |
| Outer Carton (Small - 6 Inner Boxes) | 48000 PCS | 40.6*23*19.7 |
| Outer Carton (Medium - 8 Inner Boxes) | 64000 PCS | 41*22*26 |
| Outer Carton (Large - 10 Inner Boxes) | 80000 PCS | 41*22*33 |
2505191720_MYX-MWI0805LD4R7MST-TIA-HF_C48946406.pdf
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