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quality Electronic Wire Wound Chip Inductor MWI MWI1210IF471KST-HF Halogen Free Component for Circuit Design factory
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quality Electronic Wire Wound Chip Inductor MWI MWI1210IF471KST-HF Halogen Free Component for Circuit Design factory
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Specifications
Current Rating:
40mA
Inductance:
470uH
Frequency - Self Resonant:
2MHz
Tolerance:
±10%
DC Resistance(DCR):
42Ω
Type:
Wire-wound Chip Inductor
Q @ Frequency:
8@1MHz
Mfr. Part #:
MWI1210IF471KST-HF
Package:
1210
Key Attributes
Model Number: MWI1210IF471KST-HF
Product Description

Product Overview

The MWI1210IF series wire wound chip inductors are designed for various electronic applications. These components offer reliable performance with a focus on environmental compliance, being available in Halogen Free (HF) options. They are suitable for use in a wide operating temperature range and are manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD.

Product Attributes

  • Brand: Ming Yixuan ()
  • Origin: DongGuan, China
  • Product Line: MWI1210IF series
  • Environmental Compliance: Halogen Free (HF)
  • Certifications: Lead Free (LF) option available

Technical Specifications

1. Shape & Dimension (Unit: mm)

L (Max) W (Max) T (Max) E (Typ) F (Typ) D (Typ)
3.5 2.9 2.6 1.02 2.54 1.78

2. Schematic

[Image of Schematic - Not provided in text]

3. Part Numbering System

MWI 1210 IF R56 K S T - HF

  • 1. PRODUCT SYMBOL: MWI
  • 2. DIMENSIONS: 1210
  • 3. MATERIAL: IF
  • 4. INDUCTANCE: R56 (0.56H)
  • 5. TOLERANCE: J (5%), K (10%), M (20%)
  • 6. TERMINAL: S (Tin terminal)
  • 7. PACKAGING: T (Tape & Reel), B (Bulk)
  • 8. E.P. (Environmental Protection): LF (Lead Free), HF (Halogen Free), FP (Red Phosphor Free)

4. Electrical Characteristics

No. Part Number L (H) Freq (MHz) Q (Min.) SRF (MHz) Min. Rdc () Max. Irms (mA) Max. Tolerance
1 MWI1210IFR56ST-HF 0.56 25 20 180 0.55 450 K,M
2 MWI1210IFR82ST-HF 0.82 7.9 20 200 0.40 450 K,M
3 MWI1210IF1R0ST-HF 1 7.9 20 200 0.40 450 K,M
4 MWI1210IF1R2ST-HF 1.2 7.9 20 200 0.40 450 K,M
5 MWI1210IF1R5ST-HF 1.5 7.9 20 200 0.40 450 K,M
6 MWI1210IF1R8ST-HF 1.8 7.9 20 195 0.80 450 K,M
7 MWI1210IF2R2ST-HF 2.2 7.9 30 175 0.80 450 K,M
8 MWI1210IF3R3ST-HF 3.3 7.9 20 150 1.20 400 K,M
9 MWI1210IF4R7ST-HF 4.7 7.9 18 60 1.30 350 K,M
10 MWI1210IF5R6ST-HF 5.6 7.9 18 50 2.00 320 K,M
11 MWI1210IF6R8ST-HF 6.8 7.9 18 35 1.50 310 K,M
12 MWI1210IF8R2ST-HF 8.2 7.9 15 33 1.60 305 K,M
13 MWI1210IF100ST-HF 10 2.5 15 30 1.00 300 J,K,M
14 MWI1210IF120ST-HF 12 2.5 15 25 1.80 300 J,K,M
15 MWI1210IF150ST-HF 15 2.5 15 22 2.00 225 J,K,M
16 MWI1210IF180ST-HF 18 2.5 15 22 2.05 215 J,K,M
17 MWI1210IF220ST-HF 22 2.5 15 20 2.40 210 J,K,M
18 MWI1210IF270ST-HF 27 2.5 15 20 2.80 160 J,K,M
19 MWI1210IF330ST-HF 33 2.5 15 15 2.90 160 J,K,M
20 MWI1210IF470ST-HF 47 2.5 15 10 5.20 140 J,K,M
21 MWI1210IF560ST-HF 56 2.5 8 8 5.60 125 J,K,M
22 MWI1210IF680ST-HF 68 1 6 10 13.00 100 J,K,M
23 MWI1210IF820ST-HF 82 1 6 10 13.00 100 J,K,M
24 MWI1210IF101ST-HF 100 1 6 10 13.00 100 J,K,M
25 MWI1210IF221ST-HF 220 1 8 2.6 30.00 65 J,K,M
26 MWI1210IF331ST-HF 330 1 8 2.3 35.00 55 J,K,M
27 MWI1210IF471ST-HF 470 1 8 2 42.00 40 J,K,M
28 MWI1210IF561ST-HF 560 1 8 3 60.00 10 J,K,M
29 MWI1210IF621ST-HF 620 1 8 2 85.00 10 J,K,M
30 MWI1210IF681ST-HF 680 1 6 2 90.00 10 J,K,M
31 MWI1210IF102ST-HF 1000 1 6 1 130.00 30 J,K,M

: Represents product tolerance.

Test Remarks:

  • All test data is referenced to 25 ambient.
  • Irms: DC current that causes the temperature rise (T 40 ) from 25 ambient.

5. General Specification

  • Operating Temperature: -40 to +85 (Including self-generated heat).
  • Storage Temperature: -10 to +40, Relative Humidity: 60% Max.
  • Moisture Sensitivity Level (MSL): 1
  • Recommended products should be used within 12 months from the date of delivery.
  • The part temperature (ambient + temperature rise) should not exceed 85 C under worst-case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

6. Soldering Conditions

Figure 1. Re-flow Soldering (Lead Free)

  • Preheat circuit and products to 150.
  • 260 tip temperature (Max).
  • Reflow times: no more than 2 times.
  • Solder paste thickness: the best is 0.08mm, but max is 0.1mm.

Figure 2. Hand Soldering

  • Use a 20 watt soldering iron with tip diameter of 1.0mm.
  • Limit soldering time to 3 seconds.

7. Packaging (Unit: mm)

Type A B C D E W t
1210 2.96 3.60 2.40 1210 178 60 13 21

Packaging Quantity: 2000Pcs/Reel

8. Package Specifications

Inside Box And Outside Carton

  • Per Reel: 2000 PCS
  • Inner Box: 4 reels per box, total 8000 PCS
  • Outer Carton (Small): 6 boxes per carton, total 48000 PCS
  • Outer Carton (Medium): 8 boxes per carton, total 64000 PCS
  • Outer Carton (Large): 10 boxes per carton, total 80000 PCS

Inner Box Dimensions: 20.3*19.3*5.5cm

Outer Carton Dimensions:

  • Small Carton: 40.6*23*19.7cm
  • Medium Carton: 41*22*26cm
  • Large Carton: 41*22*33cm

2505191720_MYX-MWI1210IF471KST-HF_C48946679.pdf

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