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quality Electronic Component Wire Wound Chip Inductor MWI MWI1008IF470KST-HF Suitable For Harsh Environments factory
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quality Electronic Component Wire Wound Chip Inductor MWI MWI1008IF470KST-HF Suitable For Harsh Environments factory
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Specifications
Current Rating:
160mA
Inductance:
47uH
Frequency - Self Resonant:
10MHz
Tolerance:
±10%
DC Resistance(DCR):
10.7Ω
Type:
Wire-wound Chip Inductor
Q @ Frequency:
10@2.5MHz
Mfr. Part #:
MWI1008IF470KST-HF
Package:
1008
Key Attributes
Model Number: MWI1008IF470KST-HF
Product Description

Product Overview

The MWI1008IF series is a range of wire-wound chip inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD. They are suitable for operating environments ranging from -40 to +85 and are available in lead-free (LF) and halogen-free (HF) options.

Product Attributes

  • Brand: Ming Yixuan ()
  • Origin: Dongguan, Guangdong, China
  • Product Type: Wire Wound Chip Inductor
  • Series: MWI1008IF
  • Environmental Compliance: Lead Free (LF), Halogen Free (HF)
  • Moisture Sensitivity Level (MSL): 1

Technical Specifications

Shape & Dimension (Unit: mm)

L W T E F D
2.92 Max. 2.70 Max. 2.23 Max. 1.02 Typ. 2.54 Typ. 1.27 Typ.

Part Numbering System

MWI 1008 IF 1R0 K S T - HF

  • 1. PRODUCT SYMBOL: MWI
  • 2. DIMENSIONS: 1008
  • 3. MATERIAL: IF (Chip Type)
  • 4. INDUCTANCE: e.g., 1R0 (1.0H)
  • 5. TOLERANCE: J (5%), K (10%), M (20%)
  • 6. TERMINAL: S (Tin Terminal)
  • 7. PACKAGING: T (Tape & Reel), B (Bulk)
  • 8. E.P. (Environmental Protection): LF (Lead Free), HF (Halogen Free), FP (Red Phosphor Free)

Electrical Characteristics

No. Part Number L (H) Freq (MHz) Q (Typ.) SRF (MHz) Min. Rdc () Max. Isat (mA) Max. Tolerance
1 MWI1008IFR39ST-HF 0.39 7.9 12 400 0.40 500 K,M
2 MWI1008IFR47ST-HF 0.47 25 12 600 0.27 700 K,M
3 MWI1008IFR56ST-HF 0.56 7.9 12 230 0.62 700 K,M
4 MWI1008IFR68ST-HF 0.68 7.9 12 230 0.62 700 K,M
5 MWI1008IFR82ST-HF 0.82 7.9 12 230 0.62 700 K,M
6 MWI1008IFR90ST-HF 0.9 7.9 20 300 0.35 1400 K,M
7 MWI1008IF1R0ST-HF 1 7.9 18 230 0.62 700 K,M
8 MWI1008IF1R2ST-HF 1.2 7.9 18 210 0.68 650 K,M
9 MWI1008IF1R5ST-HF 1.5 7.9 18 190 0.76 630 K,M
10 MWI1008IF1R8ST-HF 1.8 7.9 18 170 0.84 600 K,M
11 MWI1008IF2R0ST-HF 2 7.9 18 160 1.10 550 K,M
12 MWI1008IF2R2ST-HF 2.2 7.9 18 150 1.10 520 K,M
13 MWI1008IF2R7ST-HF 2.7 7.9 18 135 1.28 490 K,M
14 MWI1008IF3R3ST-HF 3.3 7.9 18 120 1.46 450 K,M
15 MWI1008IF3R9ST-HF 3.9 7.9 18 105 2.30 300 K,M
16 MWI1008IF4R7ST-HF 4.7 7.9 18 90 2.00 400 K,M
17 MWI1008IF5R6ST-HF 5.6 7.9 15 80 1.80 380 K,M
18 MWI1008IF6R8ST-HF 6.8 7.9 15 70 2.00 360 K,M
19 MWI1008IF8R2ST-HF 8.2 7.9 15 65 2.65 330 K,M
20 MWI1008IF100ST-HF 10 2.5 12 60 2.95 300 K,M
21 MWI1008IF150ST-HF 15 2.5 12 30 3.70 280 K,M
22 MWI1008IF180ST-HF 18 2.5 12 26 4.00 160 K,M
23 MWI1008IF220ST-HF 22 2.5 12 22 6.14 270 K,M
24 MWI1008IF330ST-HF 33 2.5 10 12 7.00 200 K,M
25 MWI1008IF390ST-HF 39 2.5 10 16 10.00 180 K,M
26 MWI1008IF470ST-HF 47 2.5 10 10 10.70 160 K,M
27 MWI1008IF560ST-HF 56 2.5 10 8 12.00 170 K,M
28 MWI1008IF680ST-HF 68 2.5 10 6 13.50 145 K,M
29 MWI1008IF820ST-HF 82 2.5 8 6 20.00 100 K,M
30 MWI1008IF101ST-HF 100 1 8 4 21.00 80 K,M

Test remarks:

  • (1). All test data is referenced to 25 ambient.
  • (2). Isat: DC current at which inductance drops approximate 30% from its value without current.

General Specifications

  • Operating Temperature: -40 ~ +85 (Including self-generated heat)
  • Storage Temperature: -10 ~ +40 R.H.: 60% Max.
  • Recommended Usage: Products should be used within 12 months from the date of delivery.
  • Part Temperature Limit: The part temperature (ambient + temp rise) should not exceed 85 C under worst-case operating conditions. This is influenced by circuit design, component placement, PWB trace size and thickness, airflow, and other cooling provisions. Part temperature should be verified in the end application.

Soldering Conditions

Re-flow Soldering (Lead Free):

  • Preheat circuit and products to 150.
  • 260 tip temperature (Max).
  • Reflow times: no more than 2 times.
  • Solder paste thickness: best is 0.08mm, max is 0.1mm.

Hand Soldering:

  • Use a 20 watt soldering iron with tip diameter of 1.0mm.
  • Limit soldering time to 3 sec.

Packaging

Tape Specifications (unit: mm)

Type A B C D E W t
1008 2.73 2.9 2.34 1008 178 60 13 21

Packaging Quantity: 2000Pcs/Reel

Package Specifications

Inside Box And Outside Carton

  • Per Reel: 2000 PCS
  • Inner Box: 4 reels per box, total 8000 PCS
  • Outer Carton:
    • Small Box: 6 inner boxes, total 48000 PCS
    • Medium Box: 8 inner boxes, total 64000 PCS
    • Large Box: 10 inner boxes, total 80000 PCS
  • Inner Box Dimensions: 20.3*19.3*5.5cm
  • Outer Carton Dimensions:
    • Small Carton: 40.6*23*19.7cm
    • Medium Carton: 41*22*26cm
    • Large Carton: 41*22*33cm

2505191720_MYX-MWI1008IF470KST-HF_C48946622.pdf

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