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Specifications
Current - Saturation (Isat):
900mA
Mfr. Part #:
MCNR252012C-6R8M
Package:
1008
Key Attributes
Model Number:
MCNR252012C-6R8M
Product Description
Product Overview
The MCNR252012C series is a range of SMD inductors designed for various electronic applications. These inductors offer reliable performance with precise inductance values and controlled DC resistance. They are suitable for use in circuits requiring stable magnetic components, operating within a wide temperature range of -40 to +125.
Product Attributes
- Brand: Ming Yixuan Electronic Technology Co., LTD. ()
- Series: MCNR252012C
- Origin: Dongguan, China
- Edge Type Options: A (12-edge), B (8-edge), C (4-edge)
Technical Specifications
Dimensions
Unit: mm
| Dimension | A | B | C (Max.) | D | E (Typ.) | F (Typ.) | a (Typ.) | b (Typ.) | c (Typ.) |
|---|---|---|---|---|---|---|---|---|---|
| Size | 2.50.3 | 2.00.3 | 1.2 | 2.00.2 | 0.75 | 1.0 | 0.8 | 0.9 | 2.2 |
Electrical Characteristics
| No. | Part Number | Inductance (uH) | DC Resistance () Typ. | DC Resistance () Max. | Isat (A) Typ. | Isat (A) Max. | Irms (A) Typ. | Irms (A) Max. |
|---|---|---|---|---|---|---|---|---|
| 1 | MCNR252012C-R24N | 0.2430% | 0.019 | 0.023 | 4.80 | 4.10 | 4.50 | 4.10 |
| 2 | MCNR252012C-R33N | 0.3330% | 0.026 | 0.031 | 4.70 | 4.00 | 3.70 | 3.35 |
| 3 | MCNR252012C-R47N | 0.4730% | 0.031 | 0.036 | 4.50 | 3.80 | 3.30 | 3.00 |
| 4 | MCNR252012C-R68N | 0.6830% | 0.038 | 0.047 | 3.30 | 3.00 | 2.50 | 2.30 |
| 5 | MCNR252012C-1R0N | 1.030% | 0.050 | 0.060 | 2.50 | 2.25 | 2.60 | 2.30 |
| 6 | MCNR252012C-1R2N | 1.230% | 0.065 | 0.078 | 2.50 | 2.20 | 2.20 | 2.00 |
| 7 | MCNR252012C-1R5N | 1.530% | 0.075 | 0.090 | 2.35 | 2.00 | 2.00 | 1.80 |
| 8 | MCNR252012C-1R8N | 1.830% | 0.093 | 0.108 | 2.20 | 1.95 | 1.90 | 1.75 |
| 9 | MCNR252012C-2R2M | 2.220% | 0.093 | 0.108 | 1.90 | 1.75 | 1.90 | 1.75 |
| 10 | MCNR252012C-2R7M | 2.720% | 0.130 | 0.156 | 1.60 | 1.30 | 1.50 | 1.40 |
| 11 | MCNR252012C-3R3M | 3.320% | 0.130 | 0.156 | 1.35 | 1.20 | 1.50 | 1.40 |
| 12 | MCNR252012C-4R7M | 4.720% | 0.190 | 0.228 | 1.20 | 1.10 | 1.20 | 1.10 |
| 13 | MCNR252012C-5R6M | 5.620% | 0.255 | 0.330 | 1.10 | 1.00 | 1.15 | 1.00 |
| 14 | MCNR252012C-6R8M | 6.820% | 0.300 | 0.360 | 1.10 | 0.90 | 1.05 | 0.95 |
| 15 | MCNR252012C-100M | 1020% | 0.435 | 0.522 | 0.85 | 0.70 | 0.86 | 0.78 |
| 16 | MCNR252012C-150M | 1520% | 0.700 | 1.000 | 0.70 | 0.60 | 0.60 | 0.50 |
| 17 | MCNR252012C-220M | 2220% | 1.000 | 1.290 | 0.55 | 0.45 | 0.55 | 0.48 |
| 18 | MCNR252012C-470M | 4720% | 1.776 | 2.250 | 0.37 | 0.30 | 0.28 | 0.20 |
Test Remarks:
- All test data is referenced to 25 ambient.
- Isat: DC current at which inductance drops approximate 30% from its value without current.
- Irms: DC current that causes the temperature rise (T 40) from 25 ambient.
General Specifications
- Operating Temperature: -40 ~ +125 (Including self-generated heat)
- Storage Temperature: -40 ~ +85, R.H.: 70% Max.
- Recommended Usage: Within 12 months from the date of delivery.
- Part Temperature Limit: Should not exceed 125 under worst-case operating conditions (ambient + temperature rise). Verification in the end application is required.
Soldering Conditions
Re-flow Soldering (Lead Free)
- Preheat: 150
- Peak Temperature: 260 (Max)
- Reflow Times: No more than 2 times
- Solder Paste Thickness: Recommended 0.08mm, Max 0.1mm
Hand Soldering
- Soldering Iron: 20 watt with 1.0mm tip diameter
- Soldering Time: Limit to 3 seconds
Package Specification
Tape Dimensions (Unit: mm)
| W | A0 | B0 | K0 | D | E | F | P | P0 | P2 | T |
|---|---|---|---|---|---|---|---|---|---|---|
| 8.0 | 2.35 0.1 | 2.65 0.1 | 1.4 0.1 | 1.5 0.1 | 1.75 0.1 | 3.5 0.1 | 4.0 0.1 | 4.0 0.2 | 2.0 0.1 | 0.25 0.1 |
Reel Dimensions (Unit: mm)
| Item | Dimension A | Dimension B | Dimension C | Dimension D |
|---|---|---|---|---|
| Value | 178 | 58 | 13 | 8.5 |
Packaging Quantity
| Reel (pcs) | Box (pcs) | Carton (pcs) |
|---|---|---|
| 2000 | 8000 | 48,000 |
Packaging - Cover Tape
- F force: 10130g
- Peeling speed: 300mm/min10%
- Peeling angle: 165180
Reliability Tests
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | High temperature Storage test | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Temperature: 1255, Time: 962 hours. Place samples for one hour at room temperature and test within two hours. |
| 2 | Low temperature Storage test | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Temperature: -405, Time: 962 hours. Place samples for one hour at room temperature and test within two hours. |
| 3 | Humidity test | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Temperature: 402, Humidity: 933%RH, Time: 962 hours. Place samples for one hour at room temperature and test within two hours. |
| 4 | Solderability test | Terminals must have 95% minimum solder coverage. | Dip pads in flux then dip in solder pot at 2455C for 5 seconds. Solder: lead free, Flux: rosin flux. |
| 5 | Heat endurance of flow soldering | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5. |
| 6 | Vibration test | 1. No significant defects in appearance. 2. No short and no open. | Apply frequency 10~55~10Hz and amplitude 1.5mm, 1 min/cycle in X, Y, and Z directions for 2 hours each (total 6 hours). |
| 7 | Terminal strength push test | Meet the above requirements without any loose terminals. | Applied force: 10N, Duration: 10 seconds. Solder test samples to PCB through 245 reflow, apply standard force on the side of test samples for 10 seconds. |
2507281055_MYX-MCNR252012C-6R8M_C49449211.pdf
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