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quality Electronic Wire Wound Chip Inductor MYX MWI1812UC2R7JST-HF Surface Mount Technology Halogen Free factory
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quality Electronic Wire Wound Chip Inductor MYX MWI1812UC2R7JST-HF Surface Mount Technology Halogen Free factory
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Specifications
Current Rating:
300mA
Inductance:
2.7uH
Frequency - Self Resonant:
150MHz
Tolerance:
±5%
DC Resistance(DCR):
3.2Ω
Type:
Wire-wound Chip Inductor
Q @ Frequency:
55@50MHz
Mfr. Part #:
MWI1812UC2R7JST-HF
Package:
1812
Key Attributes
Model Number: MWI1812UC2R7JST-HF
Product Description

Product Overview

The MWI1812UC series wire wound chip inductors are designed for various electronic applications. These components offer reliable performance with a focus on environmental compliance, including Halogen Free options. They are suitable for surface mount technology and are available in tape and reel packaging for automated assembly.

Product Attributes

  • Brand: DongGuan Ming Yixuan Electronic Technology Co., LTD.
  • Series: MWI1812UC
  • Origin: China
  • Environmental Compliance: Lead Free (LF), Halogen Free (HF), Red Phosphor Free (FP) options available.
  • Certifications: MSL 1

Technical Specifications

Dimensions

Unit: mm

L (Max) W (Max) T (Max) E (Typ) F (Typ) D (Typ)
4.95 3.85 3.43 1.14 3.05 3.0

Part Numbering System

MWI 1812 UC R10 J S T - HF

Position Element Description
1 PRODUCT SYMBOL MWI
2 DIMENSIONS 1812
3 MATERIAL UC
4 INDUCTANCE e.g., R10 (0.10 H), 1R0 (1.0 H), 100 (10.0 H)
5 TOLERANCE G (2%), J (5%), K (10%), M (20%)
6 TERMINAL G (Gold), S (Tin)
7 PACKAGING T (Tape & Reel), B (Bulk)
8 E.P. LF (Lead Free), HF (Halogen Free), FP (Red Phosphor Free)

Electrical Characteristics

No. Part Number Inductance (H) Test Freq (MHz) Q (Min) SRF (MHz) Min. Rdc () Max. Irms (mA) Max. Tolerance
1 MWI1812UCR10ST-HF 0.10 50 60@50MHz 400 0.60 480 J,K,M
2 MWI1812UCR12ST-HF 0.12 25 50@25MHz 900 0.10 480 J,K,M
3 MWI1812UCR15ST-HF 0.15 25 50@25MHz 700 0.12 480 J,K,M
4 MWI1812UCR18ST-HF 0.18 25 50@25MHz 700 0.13 480 J,K,M
5 MWI1812UCR22ST-HF 0.22 25 50@25MHz 500 0.14 480 J,K,M
6 MWI1812UCR27ST-HF 0.27 25 50@25MHz 500 0.15 480 J,K,M
7 MWI1812UCR33ST-HF 0.33 50 60@50MHz 400 0.70 480 J,K,M
8 MWI1812UCR39ST-HF 0.39 50 60@50MHz 400 0.80 480 J,K,M
9 MWI1812UCR75ST-HF 0.75 50 60@50MHz 350 0.65 750 J,K,M
10 MWI1812UC1R0ST-HF 1.00 50 60@50MHz 250 1.20 480 J,K,M
11 MWI1812UC1R5ST-HF 1.50 50 60@50MHz 210 1.60 430 J,K,M
12 MWI1812UC2R2ST-HF 2.20 50 35@50MHz 150 2.20 340 J,K,M
13 MWI1812UC2R7ST-HF 2.70 50 55@50MHz 150 3.20 300 J,K,M
14 MWI1812UC3R3ST-HF 3.30 50 55@50MHz 130 3.80 270 J,K,M
15 MWI1812UC3R9ST-HF 3.90 50 55@50MHz 120 5.00 240 J,K,M
16 MWI1812UC4R7ST-HF 4.70 50 25@50MHz 90 5.40 230 J,K,M
17 MWI1812UC5R6ST-HF 5.60 50 45@50MHz 90 5.70 220 J,K,M
18 MWI1812UC6R8ST-HF 6.80 50 30@50MHz 80 6.60 210 J,K,M
19 MWI1812UC8R2ST-HF 8.20 50 20@50MHz 70 7.00 200 J,K,M
20 MWI1812UC100ST-HF 10.00 50 15@50MHz 50 7.70 190 J,K,M
21 MWI1812UC120ST-HF 12.00 10 30@10MHZ 50 8.70 180 J,K,M
22 MWI1812UC150ST-HF 15.00 10 30@10MHZ 30 9.60 170 J,K,M
23 MWI1812UC180ST-HF 18.00 10 25@10MHZ 30 10.50 160 J,K,M
24 MWI1812UC220ST-HF 22.00 10 25@10MHZ 20 11.50 155 J,K,M
25 MWI1812UC270ST-HF 27.00 10 25@10MHZ 20 12.50 150 J,K,M
26 MWI1812UC330ST-HF 33.00 10 10@10MHZ 10 13.50 145 J,K,M

Test Remarks:

  • All test data is referenced to 25 ambient.
  • Irms: DC current that causes the temperature rise (T 40 ) from 25 ambient.

General Specifications

  • Operating Temperature: -40 to +125 (Including self-generated heat).
  • Storage Temperature: -10 to +40, 60% R.H. Max.
  • Moisture Sensitivity Level (MSL): 1
  • Recommended Usage: Products should be used within 12 months from the date of delivery.
  • Part Temperature Limit: The part temperature (ambient + temp rise) should not exceed 125 C under worst-case operating conditions. Verification in the end application is recommended, considering circuit design, component placement, PWB trace size and thickness, airflow, and other cooling provisions.

Soldering Conditions

Re-flow Soldering (Lead Free):

  • Preheat circuit and products to 150.
  • Peak temperature: 260 (Max) tip temperature.
  • Reflow times: No more than 2 times.
  • Solder paste thickness: Best 0.08mm, Max 0.1mm.

Hand Soldering:

  • Use a 20 watt soldering iron with a tip diameter of 1.0mm.
  • Limit soldering time to 3 seconds.

Packaging

Type: 1812

Quantity per Reel: 500 PCS

Taping Drawings & Reel Dimensions (Unit: mm):

A B C N G
1782.0 222.0 12.51.0 571.0 12

Leader and Blank Portion:

Peeling Off Force: 0.05 to 0.7N in the direction shown.

Package Specifications

Inner Box & Outer Carton Quantities:

  • Per Reel: 500 PCS
  • Per Box: 4 reels (2000 PCS)
  • Small Carton: 6 boxes (12000 PCS)
  • Medium Carton: 8 boxes (16000 PCS)
  • Large Carton: 10 boxes (20000 PCS)

Inner Box Dimensions: 20.3*19.3*5.5cm

Outer Carton Dimensions:

  • Small Carton: 40.6*23*19.7cm
  • Medium Carton: 41*22*26cm
  • Large Carton: 41*22*33cm

2506231755_MYX-MWI1812UC2R7JST-HF_C49241335.pdf

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