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Specifications
Current - Saturation (Isat):
1.2A
Mfr. Part #:
MCNR252012C-3R3M
Package:
1008
Key Attributes
Model Number:
MCNR252012C-3R3M
Product Description
Product Overview
The MCNR252012C series is a range of SMD inductors designed for various electronic applications. These inductors offer reliable performance with a focus on specific electrical characteristics and physical dimensions. They are manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD. and are suitable for use in applications requiring precise inductance values and current handling capabilities.
Product Attributes
- Brand: Ming Yixuan
- Origin: China
- Product Series: MCNR252012C
- Edge Type Options: A (12-edge), B (8-edge), C (4-edge)
Technical Specifications
| Part Number | Inductance (uH) | Tolerance | DC Resistance () Typ. | DC Resistance () Max. | Isat (A) Typ. | Isat (A) Max. | Irms (A) Typ. | Irms (A) Max. |
|---|---|---|---|---|---|---|---|---|
| MCNR252012C-R24N | 0.24 | 30% | 0.019 | 0.023 | 4.80 | 4.10 | 4.50 | 4.10 |
| MCNR252012C-R33N | 0.33 | 30% | 0.026 | 0.031 | 4.70 | 4.00 | 3.70 | 3.35 |
| MCNR252012C-R47N | 0.47 | 30% | 0.031 | 0.036 | 4.50 | 3.80 | 3.30 | 3.00 |
| MCNR252012C-R68N | 0.68 | 30% | 0.038 | 0.047 | 3.30 | 3.00 | 2.50 | 2.30 |
| MCNR252012C-1R0N | 1.0 | 30% | 0.050 | 0.060 | 2.50 | 2.25 | 2.60 | 2.30 |
| MCNR252012C-1R2N | 1.2 | 30% | 0.065 | 0.078 | 2.50 | 2.20 | 2.20 | 2.00 |
| MCNR252012C-1R5N | 1.5 | 30% | 0.075 | 0.090 | 2.35 | 2.00 | 2.00 | 1.80 |
| MCNR252012C-1R8N | 1.8 | 30% | 0.093 | 0.108 | 2.20 | 1.95 | 1.90 | 1.75 |
| MCNR252012C-2R2M | 2.2 | 20% | 0.093 | 0.108 | 1.90 | 1.75 | 1.90 | 1.75 |
| MCNR252012C-2R7M | 2.7 | 20% | 0.130 | 0.156 | 1.60 | 1.30 | 1.50 | 1.40 |
| MCNR252012C-3R3M | 3.3 | 20% | 0.130 | 0.156 | 1.35 | 1.20 | 1.50 | 1.40 |
| MCNR252012C-4R7M | 4.7 | 20% | 0.190 | 0.228 | 1.20 | 1.10 | 1.20 | 1.10 |
| MCNR252012C-5R6M | 5.6 | 20% | 0.255 | 0.330 | 1.10 | 1.00 | 1.15 | 1.00 |
| MCNR252012C-6R8M | 6.8 | 20% | 0.300 | 0.360 | 1.10 | 0.90 | 1.05 | 0.95 |
| MCNR252012C-100M | 10 | 20% | 0.435 | 0.522 | 0.85 | 0.70 | 0.86 | 0.78 |
| MCNR252012C-150M | 15 | 20% | 0.700 | 1.000 | 0.70 | 0.60 | 0.60 | 0.50 |
| MCNR252012C-220M | 22 | 20% | 1.000 | 1.290 | 0.55 | 0.45 | 0.55 | 0.48 |
| MCNR252012C-470M | 47 | 20% | 1.776 | 2.250 | 0.37 | 0.30 | 0.28 | 0.20 |
Dimensions (Unit: mm)
| A | B | C | D | E | F | a | b | c |
|---|---|---|---|---|---|---|---|---|
| 2.50.3 | 2.00.3 | 1.2 Max. | 2.00.2 | 0.75 Typ. | 1.0 Typ. | 0.8 Typ. | 0.9 Typ. | 2.2 Typ. |
General Specifications
- Operating Temperature: -40 to +125 (Including self-generated heat)
- Storage Temperature: -40 to +85
- Storage Humidity: Max. 70% RH
- Recommended usage within 12 months from date of delivery.
- Part temperature (ambient + temp rise) should not exceed 125 C under worst-case operating conditions. Verification in end application is required.
Soldering Conditions
- Re-flow Soldering (Lead Free): Preheat to 150, peak temperature 260 (Max tip temperature), Reflow times: no more than 2 times. Solder paste thickness: 0.08mm (best), 0.1mm (max).
- Hand Soldering: Use a 20 watt soldering iron with a 1.0mm tip diameter. Limit soldering time to 3 seconds.
Packaging Specifications
Tape Dimensions (Unit: mm)
| W | A0 | B0 | K0 | D | E | F | P | P0 | P2 | T |
|---|---|---|---|---|---|---|---|---|---|---|
| 8.0 | 2.35 0.1 | 2.65 0.1 | 1.4 0.1 | 1.5 0.1 | 1.75 0.1 | 3.5 0.1 | 4.0 0.1 | 4.0 0.2 | 2.0 0.1 | 0.25 0.1 |
Reel Dimensions (Unit: mm)
| Item | Dimension |
|---|---|
| A | 178 |
| B | 58 |
| C | 13 |
| D | 8.5 |
| a | Blank portions |
| b | Chip cavity |
| c | Leader |
Packaging Quantity
| Reel (pcs) | Box (pcs) | Carton (pcs) |
|---|---|---|
| 2000 | 8000 | 48,000 |
Packaging - Cover Tape
- F force: 10130g
- Peeling speed: 300mm/min10%
- Peeling angle: 165180
Reliability Tests
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | High temperature Storage test | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Temperature: 1255, Time: 962 hours. Place samples for one hour at room temperature and test within two hours. |
| 2 | Low temperature Storage test | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Temperature: -405, Time: 962 hours. Place samples for one hour at room temperature and test within two hours. |
| 3 | Humidity test | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Temperature: 402, Humidity: 933%RH, Time: 962 hours. Place samples for one hour at room temperature and test within two hours. |
| 4 | Solderability test | Terminals must have 95% minimum solder coverage | Dip pads in flux then dip in solder pot at 2455C for 5 seconds. Solder: lead free. Flux: rosin flux. |
| 5 | Heat endurance of flow soldering | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Refer to reflow curve, peak temperature: 260+0/-5. Tested twice. |
| 6 | Vibration test | 1. No significant defects in appearance. 2. No short and no open. | Apply frequency 10~55~10Hz and amplitude 1.5mm, 1 min/cycle in X, Y, and Z directions for 2 hours each (total 6 hours). |
| 7 | Terminal strength push test | Meet the above requirements without any loose terminals. | Applied force: 10N, Duration: 10 sec. Solder samples to PCB through 245 reflow, apply force on the side of test samples. |
2507281055_MYX-MCNR252012C-3R3M_C49449208.pdf
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