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quality High Reliability Chip Ferrite Bead muRata BLM41PG471SN1L with 2000 Ohm Impedance and 470 Milliamp Current Rating factory
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quality High Reliability Chip Ferrite Bead muRata BLM41PG471SN1L with 2000 Ohm Impedance and 470 Milliamp Current Rating factory
>
Specifications
Current Rating:
2A
Number of Circuits:
1
DC Resistance(DCR):
50mΩ
Tolerance:
±25%
Impedance @ Frequency:
470Ω@100MHz
Mfr. Part #:
BLM41PG471SN1L
Package:
1806
Key Attributes
Model Number: BLM41PG471SN1L
Product Description

Chip Ferrite Bead BLM41_SN Series

The Chip Ferrite Bead BLM41_SN Series is designed for DC power lines, offering effective noise suppression. These components are suitable for various applications requiring high reliability and performance.

Product Attributes

  • Brand: MURATA
  • Origin: Japan (implied by manufacturer)
  • Material: Ferrite

Technical Specifications

MURATA Part NumberImpedance () (at 100MHz)Rated Current (mA)DC Resistance () max.Remark
BLM41PG600SN1L6000 (Initial) / 3700 (After Testing)300.009For DC power line
BLM41PG600SN1B6000 (Initial) / 3700 (After Testing)300.009For DC power line
BLM41PG750SN1L3500 (Initial) / 2450 (After Testing)450.015
BLM41PG750SN1B3500 (Initial) / 2450 (After Testing)450.015
BLM41PG181SN1L3500 (Initial) / 2100 (After Testing)1800.02
BLM41PG181SN1B3500 (Initial) / 2100 (After Testing)1800.02
BLM41PG471SN1L2000 (Initial) / 1350 (After Testing)4700.05
BLM41PG471SN1B2000 (Initial) / 1350 (After Testing)4700.05
BLM41PG102SN1L1500 (Initial) / 1000 (After Testing)10000.09
BLM41PG102SN1B1500 (Initial) / 1000 (After Testing)10000.09

Environmental and Mechanical Specifications

ItemSpecification
Operating Temperature-55C to +125C
Storage Temperature-55C to +125C
Unit Mass (Typical)0.050g
Bonding StrengthSoldered on substrate, Applying Force: 9.8N, Applying Time: 5s1s
Bending StrengthSoldered on substrate, Substrate: Glass-epoxy, Deflection: 1.0mm
VibrationSoldered on substrate, Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1 min, Total Amplitude: 1.5mm
Resistance to Soldering HeatSoldered on substrate, Solder Temp: 270C5C, Immersion Time: 10s0.5s
DropProducts shall be no failure after tested. Dropped on concrete or steel board, Height: 75cm
SolderabilityElectrodes shall be at least 95% covered with new solder coating.
Temperature Cycle100 cycles (-55C to +125C)
Humidity40C2C, 90%(RH) to 95%(RH) for 1000h
Heat Life85C3C, Applying Current: Rated Current, for 1000h
Cold Resistance-552C for 1000h

2304140030_muRata-BLM41PG471SN1L_C88220.pdf

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