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quality Large Current Chip Multilayer Ceramic Capacitor muRata NFM15PC105R0G3D 1uF DC4V 0402 Package Low ESL factory
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quality Large Current Chip Multilayer Ceramic Capacitor muRata NFM15PC105R0G3D 1uF DC4V 0402 Package Low ESL factory
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Specifications
Operating Temperature:
-55℃~+85℃
Nominal Capacitance:
1uF
Voltage Rating:
4V
Tolerance:
±20%
DC Resistance(DCR):
30mΩ
Current Rating:
2A
Mfr. Part #:
NFM15PC105R0G3D
Package:
SMD-4P,1x0.5mm
Key Attributes
Model Number: NFM15PC105R0G3D
Product Description

Product Overview

The NFM15PC105R0G3 is a Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers low ESL and is suitable for applications requiring high reliability.

Product Attributes

  • Brand: MURATA
  • Type: Chip Multilayer Ceramic Capacitors (EMIFIL)
  • Packaging: 0402, 1uF, DC4V

Technical Specifications

ItemSpecificationTest Method
Nominal Capacitance1 uF
Capacitance Tolerance±20 %
DC Rated VoltageDC 4 V
Rated Current (DC)2A
DC Resistance30mΩmax.Measured with 100mA max.
Insulation Resistance500MΩmin.
Operating Temperature Range-55 to 85 °C
Storage Temperature Range-55 to 85 °C
Dimensions (L x W x T)1.0±0.05 x 0.5±0.1 x 0.3±0.05 mmUsing calipers
Capacitance Measurement Frequency1.0±0.1kHz
Capacitance Measurement Voltage0.5V±0.1V(rms) for [NFM15PC474/105/435]
Withstanding Voltage TestRated Voltage x 300% for 1 to 5 s
SolderabilityElectrodes shall be at least 90% covered with new solder coating.Ethanol solution of rosin, 25(wt)%, Pre-heat: 150±10°C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 240 ± 3°C, Immersion Time: 3±1 s
Resistance to soldering heatAppearance No damaged, Cap. Change Within ±7.5%, DC Resistance 0.05Ωmax.Ethanol solution of rosin, 25(wt)%, Pre-heat: 150±10°C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 270 ± 5°C, Immersion Time: 10 ± 1 s
Bending StrengthDeflection 1.0 mmSoldered on glass-epoxy substrate (100×40×0.8mm)
Drop TestHeight 1mDropped on concrete or steel board, Free fall, 3 directions
Bonding StrengthApplying Force (F): 5 NSoldered on glass-epoxy substrate, Applying Time: 10 s
Vibration TestTotal amplitude 3.0 mm or Acceleration amplitude 196m/s² whichever is smaller.Soldered on glass-epoxy substrate, Oscillation Frequency: 10 to 2000 to 10Hz for 20 minute, 2 hours in each of 3 mutually perpendicular directions.
Temperature CyclingAppearance No damaged, Cap. Change Within ±12.5%, I.R. Meet the initial rated value, DC Resistance 0.05Ωmax.Soldered on glass-epoxy substrate, 10 cycles
Humidity TestAppearance No damaged, Cap. Change Within ±12.5%, I.R. 105MΩmin. (for 473,104,224,474,105), 25MΩmin. (for 435), 5MΩmin. (for 755,915), DC Resistance 0.05Ωmax.Soldered on glass-epoxy substrate, Temperature: 40±2°C, Humidity: 90 to 95%(RH), Time: 500+24 / -0 hours
Heat Life TestAppearance No damaged, Cap. Change Within ±12.5%, I.R. 105MΩmin. (for 473,104,224,474,105), 25MΩmin. (for 435), 5MΩmin. (for 755,915), DC Resistance 0.05Ωmax.Soldered on glass-epoxy substrate, Temperature: Maximum Operating Temperature ± 2 °C, Test Voltage: Rated Voltage x 150%, Time: 1000+48 / -0 hours
Packaging Unit10000 pcs./Reel (PAPER Tape)

2410121928_muRata-NFM15PC105R0G3D_C162671.pdf

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