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quality Chip EMIFIL Chip Capacitor 2.2uF 10 Volt DC 4 Ampere Current muRata NFM18PC225B1A3D for Electronic Devices factory
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quality Chip EMIFIL Chip Capacitor 2.2uF 10 Volt DC 4 Ampere Current muRata NFM18PC225B1A3D for Electronic Devices factory
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Specifications
Nominal Capacitance:
2.2uF
Operating Temperature:
-40℃~+85℃
Voltage Rating:
10V
Tolerance:
±20%
DC Resistance(DCR):
10mΩ
Current Rating:
4A
Mfr. Part #:
NFM18PC225B1A3D
Package:
SMD-3P,1.6x0.8mm
Key Attributes
Model Number: NFM18PC225B1A3D
Product Description

Product Overview

The NFM18PC225B1A3 is a Chip EMIFIL Chip 3-terminal Capacitor designed for large current applications in general electronic equipment. It offers a capacitance of 2.2uF and a DC rated voltage of 10V, with a rated current of 4A (DC).

Product Attributes

  • Brand: MURATA
  • Product Type: Chip EMIFIL Chip 3-terminal Capacitor for Large Current
  • Packaging: 7) Packaging Code (W8P4, 4000 pcs./Reel)

Technical Specifications

ItemSpecificationTest Method
Capacitance2.2 uFFrequency : 1.00.1kHz (Cap.) Voltage : 10.2V(rms)
Capacitance Tolerance20 %
DC Rated Voltage10 VRated Voltage x 300% Time : 1 to 5 s
Rated Current4A(DC)
DC Resistance10mmax.Measured with 100mA max.
Insulation Resistance0.250.1 200Mmin.Voltage : Rated Voltage Time : 2 minutes max.
Operating Temperature Range-40 to 85 C
Storage Temperature Range-40 to 85 C
Dimensions (L x W x T)1.60.1 x 0.80.1 x 0.80.1 mm
AppearanceNo defects or abnormalities.Visual inspection.
SolderabilityElectrodes shall be at least 90% covered with new solder coating.Flux: Ethanol solution of rosin, 25(wt)%. Pre-heat: 15010C, 60 to 90s. Solder: Sn-3.0Ag-0.5Cu. Solder Temperature: 240 3C. Immersion Time: 31 s.
Resistance to soldering heatAppearance No damaged, Cap. Change Within 7.5%, DC Resistance 0.05 max.Flux: Ethanol solution of rosin, 25(wt)%. Pre-heat: 15010C, 60 to 90s. Solder: Sn-3.0Ag-0.5Cu. Solder Temperature: 270 5C. Immersion Time: 10 1 s.
Bending StrengthDeflection 2 mm, Keeping Time 30 sSoldered on glass-epoxy substrate (100401.0mm).
DropHeight: 1m, Method: Free fall, Attitude: 3 directionsDropped on concrete or steel board.
Bonding StrengthApplying Force (F): 9.8 N, Applying Time: 10 sSoldered on glass-epoxy substrate.
VibrationOscillation Frequency: 10 to 2000 to 10Hz for 20 minute. Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time: 2 hours in each of 3 mutually perpendicular directions.Soldered on glass-epoxy substrate. Preconditioning: Heat treatment (150+0 / -10 C,1hour).
Temperature Cycling-55C (30 min) to +125C (30 min) per cycle, 10 cyclesSoldered on glass-epoxy substrate.
Humidity402C, 90 to 95%(RH), 500 hoursSoldered on glass-epoxy substrate.
Heat LifeMaximum Operating Temperature 2 C, Rated Voltage x 200%, 1000 hoursSoldered on glass-epoxy substrate.

2410121725_muRata-NFM18PC225B1A3D_C113151.pdf

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