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Specifications
Operating Temperature:
-55℃~+125℃
Nominal Capacitance:
1uF
Voltage Rating:
6.3V
Tolerance:
±20%
DC Resistance(DCR):
30mΩ
Current Rating:
2A
Mfr. Part #:
NFM18PS105D0J3D
Package:
SMD-4P,1.6x0.8mm
Key Attributes
Model Number:
NFM18PS105D0J3D
Product Description
Product Overview
The NFM18PS105D0J3 is a Large Current & High Insertion Loss 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers a capacitance of 1uF with a DC rated voltage of 6.3V and a capacitance tolerance of 20%. This capacitor is characterized by its low ESL and suitability for high current applications.
Product Attributes
- Brand: MURATA
- Part Number: NFM18PS105D0J3
- Packaging Code: 3
- Reel Size: 180mm
- Packaging Unit: 4000 pcs./Reel
Technical Specifications
| Item | Specification | Test Method |
| Nominal Capacitance | 1 uF | |
| Capacitance Tolerance | 20 % | |
| DC Rated Voltage | DC 6.3 V | |
| Rated Current (DC) | 2A(DC) | |
| DC Resistance | 30mmax. | Measured with 100mA max. |
| Insulation Resistance | 500Mmin. | Rated Voltage x 300% Time : 2 minutes max. |
| Operating Temp. Range | -55 to 125 C | |
| Storage Temp. Range | -55 to 125 C | |
| Dimensions (L x W x T) | 1.60.1 x 0.80.1 x 0.60.1 mm | |
| Dimensions (e1, e2) | 0.15+0.2/-0.1 mm | |
| Dimensions (i) | 0.40.1 mm | |
| Dimensions (g) | 0.8+0.2/-0.1 mm | |
| Solderability | Electrodes shall be at least 90% covered with new solder coating. | Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 3C Immersion Time : 31 s |
| Resistance to soldering heat | Appearance No damaged, Cap. Change Within 7.5%, DC Resistance 0.05 max. | Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 5C Immersion Time : 10 1 s |
| Bending Strength | Deflection : 1 mm Keeping Time : 30 s | It shall be soldered on the glass-epoxy substrate (100400.8mm). |
| Drop | Height : 1m, Number of Time : 10 times | It shall be dropped on concrete or steel board. Method : Free fall |
| Bonding Strength | Applying Force (F) : 5 N, Applying Time : 10 s | It shall be soldered on the glass-epoxy substrate. |
| Vibration | Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time : A period of 6 hours in each of 3 mutually perpendicular directions. | It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute. |
| Temperature Cycling | 10 cycles | 1 Cycle 1 step : Minimum Operating Temperature +0 / -3 C / 30+3 / -0 min, 2 step : Room Temperature / within 3 min, 3 step : Maximum Operating Temperature +3 / -0 C / 30 +3 / -0 min, 4 step : Room Temperature / within 3 min |
| Humidity | 500+24 / -0 hours | Temperature : 402C, Humidity : 90 to 95%(RH) |
| Heat Life | 1000+48 / -0 hours | Temperature : Maximum Operating Temperature 2 C, Test Voltage : (474R/105R)Rated Voltage x 200% (105D) Rated Voltage x 150% |
| Pull Strength of Top Tape | 5Nmin.(Only for NFM18PS, 8Nmin.) | |
| Peeling off force of top tape | 0.1N to 0.6N (minimum value is typical) Speed of Peeling off : 300 mm / min |
2410121930_muRata-NFM18PS105D0J3D_C2650870.pdf
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