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Specifications
Operating Temperature:
-55℃~+125℃
Nominal Capacitance:
220nF
Voltage Rating:
16V
Tolerance:
±20%
DC Resistance(DCR):
30mΩ
Current Rating:
2A
Mfr. Part #:
NFM21PC224R1C3D
Package:
SMD-4P,2x1.2mm
Key Attributes
Model Number:
NFM21PC224R1C3D
Product Description
Product Overview
The NFM21PC224R1C3 is a Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers advantages such as low ESL and is suitable for applications requiring high reliability.
Product Attributes
- Brand: MURATA
- Packaging: 8mm-wide paper tape, 4000 pcs./Reel
- Material: Multilayer Ceramic
Technical Specifications
| Item | Specification | Test Method |
|---|---|---|
| Nominal Capacitance | 0.22 uF | |
| Capacitance Tolerance | ±20 % | |
| DC Rated Voltage | DC 16 V | |
| Rated Current (DC) | 2A | |
| DC Resistance | 30mΩmax. | Measured with 100mA max. |
| Insulation Resistance | 1000MΩmin. | |
| Operating Temperature Range | -55 to 125 °C | |
| Storage Temperature Range | -55 to 125 °C | |
| Dimensions (L x W x T) | 2.0±0.2 x 1.25±0.1 x 0.85±0.1 mm | |
| Dimensions (e.g., j, d, g) | j: 0.25±0.2, d: 0.3±0.2, g: 0.4±0.2 mm | |
| Capacitance Measurement | Frequency: 1.0±0.1kHz, Voltage: 1±0.2V(rms) | |
| Withstanding Voltage | Rated Voltage x 300% for 1 to 5 s | Charge Current: 50 mA max. |
| Appearance | No defects or abnormalities. | Visual inspection. |
| Dimensions Check | Within specified dimensions. | Using calipers. |
| Solderability | Electrodes shall be at least 90% covered with new solder coating. | Flux: Ethanol solution of rosin, 25(wt)%, Pre-heat: 150±10°C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 240 ± 3°C, Immersion Time: 3±1 s |
| Resistance to Soldering Heat | No failure after tested. Appearance No damaged, Cap. Change Within ±7.5%, DC Resistance 0.05Ωmax. | Flux: Ethanol solution of rosin, 25(wt)%, Pre-heat: 150±10°C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 270 ± 5°C, Immersion Time: 10 ± 1 s |
| Bending Strength | No damaged, Cap. Change Within ±7.5%, DC Resistance 0.05Ωmax. | Soldered on glass-epoxy substrate (100x40x1.0mm), Deflection: 2 mm, Keeping Time: 30 s |
| Drop | No damaged, Cap. Change Within ±7.5%, DC Resistance 0.05Ωmax. | Dropped on concrete or steel board, Height: 75 cm, Method: Free fall |
| Bonding Strength | No damaged, Capacitance Meet the initial rated value. | Soldered on glass-epoxy substrate, Applying Force (F): 9.8 N, Applying Time: 30 s |
| Vibration | No damaged, Capacitance Meet the initial rated value. | Soldered on glass-epoxy substrate, Oscillation Frequency: 10 to 55 to 10Hz for 1 minute, Double Amplitude: 1.5 mm |
| Temperature Cycling | Appearance No damaged, Cap. Change Within ±12.5%, I.R. 50Ω·F min., DC Resistance 0.05Ωmax. | 1 Cycle: Min Op Temp +0/-3°C (30+3/-0 min), Room Temp (within 3 min), Max Op Temp +3/-0°C (30+3/-0 min), Room Temp (within 3 min). Total 10 cycles. |
| Humidity | Appearance No damaged, Cap. Change Within ±12.5%, I.R. 50Ω·F min., DC Resistance 0.05Ωmax. | Temperature: 40±2°C, Humidity: 90 to 95%(RH), Time: 500+24/-0 hours |
| Heat Life | Appearance No damaged, Cap. Change Within ±12.5%, I.R. 50Ω·F min., DC Resistance 0.05Ωmax. | Temperature: Maximum Operating Temperature ± 2 °C, Test Voltage: Rated Voltage x 200%, Time: 1000+48/-0 hours |
| Packaging Unit | 4000 pcs./Reel | |
| Taping Specification | Sprocket holes to the right as tape is pulled toward user. Base tape and top tape have no spliced point. Cavity shall not have burr. Missing components number within 0.1% of reel count or 1 pc., whichever is greater, and not continuous. | |
| Pull Strength of Top Tape and Bottom Tape | 5N min. | |
| Peeling off force of top tape | 0.1N to 0.6N (minimum value is typical) | Speed of Peeling off: 300 mm / min |
2410121932_muRata-NFM21PC224R1C3D_C337966.pdf
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