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quality Electronic circuits noise suppression chip ferrite bead muRata BLM15EX331SN1D with impedance features factory
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quality Electronic circuits noise suppression chip ferrite bead muRata BLM15EX331SN1D with impedance features factory
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Specifications
Current Rating:
700mA
Number of Circuits:
1
DC Resistance(DCR):
205mΩ
Tolerance:
±25%
Impedance @ Frequency:
330Ω@100MHz
Mfr. Part #:
BLM15EX331SN1D
Package:
0402
Key Attributes
Model Number: BLM15EX331SN1D
Product Description

Chip Ferrite Bead BLM15ESN1

The BLM15E_SN series chip ferrite beads are designed for noise suppression in electronic circuits. They offer effective impedance at high frequencies, making them suitable for general use in a wide range of applications.

Product Attributes

  • Brand: MURATA
  • Product ID: BLM15E
  • Packaging: Taping (D) / Bulk (B)

Technical Specifications

MURATA Part NumberImpedance () (at 100MHz)Impedance () (at 1GHz)Rated Current (mA)DC Resistance ( max.)Remark
BLM15EG121SN1D12025%1451500*10.095For general use
BLM15EG121SN1B12025%1451500*10.095For general use
BLM15EG221SN1D22025%270700*10.28
BLM15EG221SN1B22025%270700*10.28
BLM15EX121SN1D12025%17040%1800*10.075
BLM15EX121SN1B12025%17040%1800*10.075
BLM15EX221SN1D22025%30040%1300*10.140
BLM15EX221SN1B22025%30040%1300*10.140
BLM15EX331SN1D33025%45040%1100*10.205
BLM15EX331SN1B33025%45040%1100*10.205
BLM15EX471SN1D47025%63040%950*10.280
BLM15EX471SN1B47025%63040%950*10.280

Operating and Storage Conditions

Operating Temperature: -55C to +125C

Storage Temperature: -55C to +125C

Standard Testing Conditions

Temperature: Ordinary Temp. (15 C to 35 C) or 20C2 C

Humidity: Ordinary Humidity (25%(RH) to 85%(RH)) or 60%(RH) to 70%(RH)

Atmospheric pressure: 86kPa to 106kPa

Mechanical Performance

ItemSpecification
Unit Mass (Typical value)0.001g
Appearance and DimensionsVisual Inspection and measured with Slide Calipers.
Bonding StrengthImpedance Change (at 100MHz): Within 30%; DC Resistance: Meet item 3.
Bending StrengthDeflection: 2.0mm
VibrationOscillation Frequency: 10Hz to 2000Hz to 10Hz for 20 min; Total Amplitude 1.5mm or Acceleration 196m/s2 whichever is smaller
Resistance to Soldering HeatPre-Heating: 150C10C, 60s90s; Solder: Sn-3.0Ag-0.5Cu; Solder Temperature: 270C5C; Immersion Time: 10s0.5s
DropFree fall from 75cm onto concrete or steel board, 3 directions, 3 times each direction.
SolderabilityElectrodes shall be at least 95% covered with new solder coating.

Environmental Performance

ItemSpecification
Heat Shock500 cycles of -55C (30min) to +125C (30min)
Humidity70C2C, 90%RH to 95%RH for 1000h
Heat Life125C3C with Rated Current for 1000h
Cold Resistance-552C for 1000h

Packaging Specification

8mm-wide paper tape, 2mm-pitch. Standard quantity per reel: 10000 pcs. / 180mm reel.

Caution

Excessive surge current may cause critical failure. Contact manufacturer before applying surge current. Consult manufacturer before using in high-reliability applications such as aircraft, medical, or transportation equipment.

Notice

Designed for solder mounting. Consult manufacturer for alternative mounting methods. Standard land dimensions and reflow soldering conditions are provided for BLM15EG and BLM15EX series.


2308111547_muRata-BLM15EX331SN1D_C596498.pdf

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