Online Service

Online Service

Contact Person
+86 136 6733 2386
quality 3 Terminal Low ESL Chip Multilayer Ceramic Capacitor muRata NFM31KC223R2A3L for Noise Filtering Applications factory
<
quality 3 Terminal Low ESL Chip Multilayer Ceramic Capacitor muRata NFM31KC223R2A3L for Noise Filtering Applications factory
>
Specifications
Operating Temperature:
-55℃~+105℃
Nominal Capacitance:
22nF
Voltage Rating:
100V
Tolerance:
±20%
DC Resistance(DCR):
1.5mΩ
Current Rating:
10A
Mfr. Part #:
NFM31KC223R2A3L
Package:
SMD-4P,3.2x1.6mm
Key Attributes
Model Number: NFM31KC223R2A3L
Product Description

Product Overview

The NFM31KC223R2A3 is a 3-terminal low ESL chip multilayer ceramic capacitor (EMIFIL) designed for general-purpose applications in electronic equipment. It offers very large current handling capabilities and is suitable for noise filtering.

Product Attributes

  • Brand: MURATA
  • Product Type: Very Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL)
  • Packaging: 180mm Reel, EMBOSSED W8P4, 3000 pcs./Reel

Technical Specifications

ItemSpecificationTest Method
Nominal Capacitance22000 pFFrequency: 1 0.1kHz (Cap.) Voltage: 1 0.2V(rms)
Capacitance Tolerance20 %
DC Rated Voltage100 VRated Voltage Time: 2 minutes max.
Rated Current10A(DC)
DC Resistance1.5mmax.Measured with 100mA max.
Insulation Resistance1000Mmin.
Operating Temp. Range-55 to 105 C
Storage Temp. Range-55 to 105 C
Dimensions (L x W x T)3.20.2 x 1.60.2 x 1.30.2 mm
Dimensions (e, g)0.40.3, 0.3 min.
Dimensions (i, j)1.20.3, 0.30.2
AppearanceNo defects or abnormalities.Visual inspection.
DimensionsWithin the specified dimensions.Using calipers or Micrometer.
SolderabilityElectrodes shall be at least 90% covered with new solder coating.Flux: Ethanol solution of rosin, 25(wt)% Pre-heat: 150 10C, 60 to 90s Solder: Sn-3.0Ag-0.5Cu Solder Temperature: 240 3C Immersion Time: 3 1 s Immersion and emersion rates: 25mm / s
Resistance to soldering heatProducts shall be no failure after tested.Flux: Ethanol solution of rosin, 25(wt)% Pre-heat: 15010C, 60 to 90s Solder: Sn-3.0Ag-0.5Cu Solder Temperature: 270 5C Immersion Time: 10 1 s Immersion and emersion rates: 25mm / s
Bending StrengthDeflection: 1 mm Keeping Time: 30 sIt shall be soldered on the glass-epoxy substrate(100 x 40 x 1.0 mm).
DropHeight: 1m Attitude: 3 directionsIt shall be dropped on concrete or steel board.
Bonding StrengthApplying Force (F): 9.8 N Applying Time: 30 sIt shall be soldered on the glass-epoxy substrate.
VibrationDouble Amplitude: 1.5 mm Time: A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours)It shall be soldered on the glass-epoxy substrate. Oscillation Frequency: 10 to 55 to 10Hz for 1 minute
Temperature Cycling10 cycles1 step: Min. Op. Temp. +0/-3C / 30 min; 2 step: Room Temp. / within 3 min; 3 step: Max. Op. Temp. +3/-0C / 30 min; 4 step: Room Temp. / within 3 min
Humidity500+24 / -0 hoursTemperature: 40 2 C Humidity: 90 to 95%(RH)
Heat Life1000+48 / -0 hoursTemperature: Maximum Operating Temperature2C Test Voltage: Rated Voltage150% (for NFM31KC***R2A3) Test Current: Rated Current (at Maximum Operating Temperature)

2410121921_muRata-NFM31KC223R2A3L_C2661369.pdf

Request A Quote

Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible

You Can Upload Up To 5 Files And Each File Sized 10M Max