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Specifications
Operating Temperature:
-55℃~+125℃
Nominal Capacitance:
100pF
Voltage Rating:
16V
Tolerance:
±20%
DC Resistance(DCR):
300mΩ
Current Rating:
500mA
Mfr. Part #:
NFM18CC101R1C3D
Package:
SMD-3P,1.6x0.8mm
Key Attributes
Model Number:
NFM18CC101R1C3D
Product Description
Product Overview
The NFM18CC101R1C3 is a 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers low Equivalent Series Inductance (ESL) and is suitable for applications requiring reliable filtering and noise suppression.
Product Attributes
- Brand: MURATA
- Packaging: 180mm Reel
- Unit: 4000 pcs./Reel
Technical Specifications
| Item | Specification | Test Method |
| Electrical Performance | ||
| Capacitance | 100 pF | Frequency (Cap.) 100 to 22000pF : 10.1kHz, Voltage : 10.2V(rms) |
| Capacitance Tolerance | 20 % | |
| DC Rated Voltage | DC 16 V | Voltage : Rated Voltage Time : 2 minutes max. |
| Rated Current | 500mA(DC) | |
| DC Resistance | 1000Mmin. | Measured with 100mA max. |
| Insulation Resistance(I.R.) | 1000Mmin. | JEMCPS-02209D |
| Withstanding Voltage | Products shall not be damaged. | Test Voltage : Rated Voltage x 300% Time : 1 to 5 s Charge Current : 50mA max. |
| Operating Temperature | -55 to 125 C | Shown in Rated value. Includes self-heating |
| Storage Temperature | -55 to 125 C | Shown in Rated value. |
| Mechanical Performance | ||
| Appearance | No defects or abnormalities. | Visual inspection. |
| Dimensions | Within the specified dimensions. | Using Measuring instrument of dimension. |
| Solderability | Electrodes shall be at least 90% covered with new solder coating. Products shall be no failure after tested. | Flux : Solution of rosin ethanol 25(mass)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2403C Immersion Time : 31s Immersion and emersion rates : 25mm/s |
| Resistance to soldering heat | Products shall be no failure after tested. | Flux : Solution of rosin ethanol 25(mass)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2705C Immersion Time : 101s Immersion and emersion rates : 25mm/s |
| Bending Strength | Meet Table 2. | It shall be soldered on the glass-epoxy substrate(t=1.0mm). Deflection : 2mm Keeping Time : 30s |
| Drop | It shall be dropped on concrete or steel board. | Method : Free fall Height : 1m Attitude from which the product is dropped : 3 directions |
| Bonding Strength | The electrodes shall be no failure after tested. | It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 9.8N Applying Time : 30s |
| Vibration | Meet Table 3. | It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minutes. Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) |
| Environment Performance | ||
| Temperature Cycling | Meet Table 1. | 1 Cycle 1 step : -55+0/-3 / 30+3/-0 min 2 step : Room Temperature / within 3 min 3 step : +125+3/-0 / 30+3/-0 min 4 step : Room Temperature / within 3 min Total of 10 cycles |
| Humidity | Meet Table 4. | Temperature : 402C Humidity : 90 to 95%(RH) Time : 500+24/-0 hours |
| Heat Life | Temperature : 1252C Test Voltage : Rated Voltage x 200% Charge Current : 50mA max. Time : 1000+48/-0 hours | |
| Cold Resistance | Temperature : -552C Time : 500+24/-0 hours | |
| Packaging Specifications | ||
| Taping Dimensions (8mm-wide paper tape) | See diagram. | |
| Packing quantity | 4000 pcs. / reel | |
| Missing components number | Within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. | |
| Pull Strength of Top Tape | 5Nmin. | |
| Peeling off force of top tape | 0.1N to 0.6N (minimum value is typical) | Speed of Peeling off : 300 mm / min |
| Leader-tape, Trailer and Reel Dimensions | See diagram. | |
2410121929_muRata-NFM18CC101R1C3D_C184122.pdf
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