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quality High current 0603 chip multilayer ceramic capacitor muRata NFM18PS105R0J3D with low DC resistance and insulation resistance factory
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quality High current 0603 chip multilayer ceramic capacitor muRata NFM18PS105R0J3D with low DC resistance and insulation resistance factory
>
Specifications
Nominal Capacitance:
1uF
Operating Temperature:
-55℃~+105℃
Voltage Rating:
6.3V
Tolerance:
±20%
DC Resistance(DCR):
30mΩ
Current Rating:
2A
Mfr. Part #:
NFM18PS105R0J3D
Package:
SMD-4P,1.6x0.8mm
Key Attributes
Model Number: NFM18PS105R0J3D
Product Description

Product Overview

The NFM18PS105R0J3 is a 0603 chip multilayer ceramic capacitor from Murata, designed for general electronic equipment. It features large current handling, high insertion loss, 3 terminals, and low ESL, making it suitable for applications requiring efficient filtering and noise suppression. This capacitor operates within a wide temperature range and offers stable performance with its robust construction.

Product Attributes

  • Brand: MURATA
  • Product Type: Chip Multilayer Ceramic Capacitors (EMIFIL)
  • Series: NFM18PS
  • Packaging: 0603

Technical Specifications

ItemSpecificationTest Method
Nominal Capacitance1 uFJEMCPS-02212C
Capacitance Tolerance±20 %JEMCPS-02212C
DC Rated VoltageDC 6.3 VJEMCPS-02212C
Rated Current2A(DC)JEMCPS-02212C
DC Resistance30mΩmax.JEMCPS-02212C
Insulation Resistance500MΩmin.JEMCPS-02212C
Operating Temp. Range-55 to 105 °CJEMCPS-02212C
Storage Temp. Range-55 to 125 °CJEMCPS-02212C
Dimensions (L x W x T)1.6±0.1 x 0.8±0.1 x 0.6±0.1 mmJEMCPP-02231A
Packaging Code(7)JEMCPP-02231A
Packaging Unit4000 pcs./ReelJEMCPP-02231A
Reel Diameter180mmJEMCPP-02231A
TapingPAPER W8P4JEMCPP-02231A
AppearanceNo defects or abnormalities.Visual inspection
SolderabilityElectrodes shall be at least 90% covered with new solder coating.Ethanol solution of rosin, 25(wt)%; Pre-heat: 150±10°C, 60 to 90s; Solder: Sn-3.0Ag-0.5Cu; Solder Temp: 240 ± 3°C; Immersion Time: 3±1 s
Resistance to soldering heatProducts shall be no failure after tested.Ethanol solution of rosin, 25(wt)%; Pre-heat: 150±10°C, 60 to 90s; Solder: Sn-3.0Ag-0.5Cu; Solder Temp: 270 ± 5°C; Immersion Time: 10 ±1 s
Bending StrengthMeet Table 2. Deflection: 1 mmSoldered on glass-epoxy substrate (100x40x0.8mm)
DropIt shall be dropped on concrete or steel board. Height: 1mFree fall, 10 times
Bonding StrengthIt shall be soldered on the glass-epoxy substrate.Applying Force (F): 5 N, Applying Time: 10 s
VibrationMeet Table 3. Oscillation Frequency: 10 to 2000 to 10HzSoldered on glass-epoxy substrate
Temperature CyclingMeet Table 1. 10 cyclesSoldered on glass-epoxy substrate
HumidityMeet Table 4. Temperature: 40±2°C, Humidity: 90 to 95%(RH), Time: 500+24 / -0 hoursSoldered on glass-epoxy substrate
Heat Life1000+48 / -0 hoursSoldered on glass-epoxy substrate

2410121725_muRata-NFM18PS105R0J3D_C98105.pdf

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