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Specifications
Operating Temperature:
-55℃~+125℃
Nominal Capacitance:
22nF
Voltage Rating:
16V
Tolerance:
±20%
DC Resistance(DCR):
50mΩ
Current Rating:
1A
Mfr. Part #:
NFM18CC223R1C3D
Package:
SMD-3P,1.6x0.8mm
Key Attributes
Model Number:
NFM18CC223R1C3D
Product Description
Product Overview
The NFM18CC223R1C3 is a Chip EMIFIL Chip 3-terminal Capacitor designed for general electronic equipment. It offers reliable performance with specific electrical, mechanical, and environmental characteristics.
Product Attributes
- Brand: MURATA
- Product Type: Chip EMIFIL Chip 3-terminal Capacitor
- Packaging: 180mm Reel PAPER W8P4, 4000 pcs./Reel
Technical Specifications
| Item | Nominal Capacitance | Capacitance Tolerance | DC Rated Voltage | DC Resistance | Insulation Resistance | Rated Current | Operating Temp. Range | Dimensions (LxWxT) |
| NFM18CC223R1C3 | 22000 pF | 20 % | DC 16 V | 50mmax. | 1000Mmin. | 1A(DC) | -55 to 125 C | 1.60.1 x 0.80.1 x 0.60.1 mm |
Specifications and Test Methods
Electrical Performance
| Item | Specification | Test Method |
| Capacitance | 22000 pF | Frequency: 10.1kHz, Voltage: 10.2V(rms) |
| DC Resistance (Rdc1, Rdc2) | Rdc1,2: 0.05 max. (for 22000pF) | Measured with 100mA max. |
| Withstanding Voltage | Products shall not be damaged. | Test Voltage: Rated Voltage x 300%, Time: 1 to 5 s |
| Operating Temperature | -55 to 125 C | Shown in Rated value. Includes self-heating |
| Storage Temperature | -55 to 125 C | Shown in Rated value. |
Mechanical Performance
| Item | Specification | Test Method |
| Appearance | No defects or abnormalities. | Visual inspection. |
| Dimensions | Within the specified dimensions. | Using calipers or Micrometer. |
| Solderability | Electrodes shall be at least 90% covered with new solder coating. | Flux: Ethanol solution of rosin, 25(wt)%, Pre-heat: 15010C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temp: 240 3C, Immersion Time: 31 s |
| Resistance to soldering heat | Cap. Change Within 7.5%, Rdc 1,2: 0.05 max. (for 22000pF) | Flux: Ethanol solution of rosin, 25(wt)%, Pre-heat: 15010C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temp: 270 5C, Immersion Time: 10 1 s |
| Bending Strength | Deflection: 2 mm | It shall be soldered on the glass-epoxy substrate(t = 1.0mm). |
| Drop | Products shall be no failure after tested. | Free fall, Height: 1 m, 3 directions |
| Bonding Strength | F: 9.8 N | It shall be soldered on the glass-epoxy substrate. |
| Vibration | Cap. Change Within 7.5%, Rdc 1,2: 0.05 max. (for 22000pF) | Soldered on glass-epoxy substrate. Frequency: 10 to 2000 to 10Hz for 20 minutes. Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time: 2 hours in each of 3 directions. |
Environment Performance
| Item | Specification | Test Method |
| Temperature Cycling | Cap. Change Within 7.5%, I.R. Meet the initial rated value. Rdc 1,2: 0.05 max. (for 22000pF) | 10 cycles: -55C to +125C. |
| Humidity | Cap. Change Within 12.5%, I.R. Meet the initial rated value. Rdc 1,2: 0.05 max. (for 22000pF) | Temperature: 402C, Humidity: 90 to 95%(RH), Time: 500+24 / -0 hours |
| Heat Life | Cap. Change Within 12.5%, I.R. Meet the initial rated value. Rdc 1,2: 0.05 max. (for 22000pF) | Temperature: 1252C, Test Voltage: Rated Voltage x 200%, Time: 1000+48 / -0 hours |
| Cold Resistance | Cap. Change Within 12.5%, I.R. Meet the initial rated value. Rdc 1,2: 0.05 max. (for 22000pF) | Temperature: -552C, Time: 500+24 / -0 hours |
Packaging Specifications
| Item | Specification |
| Packaging Code | R1C3 |
| Unit | 180mm Reel PAPER W8P4 |
| Quantity per Reel | 4000 pcs. |
| Leader-trailer Tape | Empty tape, 190 min. (Leader), 160 min. (Trailer) |
| Pull Strength of Top Tape | 5Nmin. |
| Peeling off force of top tape | 0.1N to 0.6N |
2410121725_muRata-NFM18CC223R1C3D_C98102.pdf
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