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Specifications
Nominal Capacitance:
4.7uF
Operating Temperature:
-40℃~+85℃
Voltage Rating:
10V
Tolerance:
±20%
DC Resistance(DCR):
5mΩ
Current Rating:
6A
Mfr. Part #:
NFM21PC475B1A3D
Package:
SMD-4P,2x1.2mm
Key Attributes
Model Number:
NFM21PC475B1A3D
Product Description
Product Description
The NFM21PC475B1A3 is a Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers low ESL (Equivalent Series Inductance) and is suitable for applications requiring high current handling.
Product Attributes
- Brand: MURATA
- Packaging: 8mm-wide paper tape, 180mm Reel
Technical Specifications
| Item | Specification | Test Method |
|---|---|---|
| Nominal Capacitance | 4.7 uF | Frequency : 1.00.1kHz (Cap.) Voltage : 10.2V(rms) |
| Capacitance Tolerance | 20 % | - |
| DC Rated Voltage | 10 V | - |
| Rated Current (DC) | 6A | - |
| DC Resistance | 5mmax. | Measured with 100mA max. |
| Insulation Resistance | 100Mmin. | Rated Voltage Time : 2 minutes max. |
| Operating /Storage Temp. Range | -40 to 85 C | - |
| Dimensions (L x W x T) | 2.00.2 x 1.250.1 x 0.850.1 mm | - |
| Terminal Dimensions (e x d) | 0.30.2 x 0.40.2 mm | - |
| Pitch (p) | 0.60.2 mm | - |
| Packaging Unit | 4000 pcs./Reel | - |
| Appearance | No defects or abnormalities. | Visual inspection. |
| Solderability | Electrodes shall be at least 90% covered with new solder coating. Products shall be no failure after tested. | Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 3C Immersion Time : 31 s Immersion and emersion rates : 25mm / s |
| Resistance to soldering heat | Appearance No damaged Cap. Change Within 7.5% DC Resistance 0.05max. | Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 5C Immersion Time : 10 1 s Immersion and emersion rates : 25mm / s |
| Bending Strength | Appearance No damaged Cap. Change Within 7.5% I.R. Meet the initial rated value. DC Resistance 0.05 max. | It shall be soldered on the glass-epoxy substrate (100401.0mm). Deflection : 2 mm Keeping Time : 30 s |
| Drop | Appearance No damaged Capacitance Meet the initial rated value. DC Resistance 0.05max. | It shall be dropped on concrete or steel board. Height : 75 cm Method : Free fall Attitude from which the product is dropped : 3 directions |
| Bonding Strength | - | It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 9.8 N Applying Time : 30 s |
| Vibration | - | It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 55 to 10Hz for 1 minute Double Amplitude : 1.5 mm Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) Preconditioning : Heat treatment (150+0 / -10 C,1hour) |
| Temperature Cycling | Appearance No damaged Cap. Change Within 12.5% I.R. 50F min. DC Resistance 0.05max. | It shall be soldered on the glass-epoxy substrate. 1 Cycle 1 step : Minimum Operating Temperature +0 / -3 C / 30+3 / -0 min 2 step : Room Temperature / within 3 min 3 step : Maximum Operating Temperature +3 / -0 C / 30 +3 / -0 min 4 step : Room Temperature / within 3 min Total of 10 cycles |
| Humidity | Appearance No damaged Cap. Change Within 12.5% I.R. 50F min. DC Resistance 0.05max. | It shall be soldered on the glass-epoxy substrate. Temperature : 402C Humidity : 90 to 95%(RH) Time : 500+24 / -0 hours |
| Heat Life | Appearance No damaged Cap. Change Within 12.5% I.R. 50F min. DC Resistance 0.05max. | Temperature : Maximum Operating Temperature 2 C Test Voltage : Rated Voltage x 200% Charge Current : 50 mA max. Time : 1000+48 / -0 hours |
| Taping Specification | Packing quantity : 4000 pcs. / reel. Pull Strength of Top Tape and Bottom Tape : 5N min. Peeling off force of top tape : 0.1N to 0.6N (minimum value is typical) Speed of Peeling off : 300 mm / min | - |
2410121725_muRata-NFM21PC475B1A3D_C96293.pdf
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