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Specifications
Nominal Capacitance:
220nF
Operating Temperature:
-55℃~+105℃
Voltage Rating:
6.3V
Tolerance:
±20%
DC Resistance(DCR):
30mΩ
Current Rating:
2A
Mfr. Part #:
NFM15PC224D0J3D
Package:
0402
Key Attributes
Model Number:
NFM15PC224D0J3D
Product Description
Product Overview
This product specification applies to Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL) for General Electronic Equipment. These capacitors offer low ESL and are designed for general-purpose applications.
Product Attributes
- Brand: MURATA
- Product Line: NFM15PC Series
- Type: Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL)
Technical Specifications
| Item | Specification | Test Method |
| Electrical Performance | ||
| Nominal Capacitance | 0.22 uF | Frequency : 1.0±0.1kHz (Cap.) Voltage : 1V±0.2V(rms) |
| Capacitance Tolerance | ±20 % | |
| DC Rated Voltage | DC 6.3 V | Time : 2 minutes max. |
| Rated Current | 2A(DC) | |
| DC Resistance | 30mΩmax. | Measured with 100mA max. |
| Insulation Resistance | 1000MΩmin. | Voltage : Rated Voltage x 300% Time : 1 to 5 s Charge Current : 50 mA max. |
| Operating /Storage Temp. Range | -55 to 105 °C | |
| Mechanical Performance | ||
| Appearance | No defects or abnormalities. | Visual inspection. |
| Dimensions | Refer to drawing (Unit:mm) | Using calipers. |
| Solderability | Electrodes shall be at least 90% covered with new solder coating. Products shall be no failure after tested. | Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150±10°C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 ± 3°C Immersion Time : 3±1 s Immersion and emersion rates : 25mm / s |
| Resistance to soldering heat | Electrodes shall be no failure after tested. | Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150±10°C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 ± 5°C Immersion Time : 10 ± 1 s Immersion and emersion rates : 25mm / s |
| Bending Strength | Deflection : 1.0 mm | It shall be soldered on the glass-epoxy substrate (100×40×0.8mm). Deflection : 1.0 mm Keeping Time : 5 s |
| Drop | It shall be dropped on concrete or steel board. | Height : 1m Method : Free fall Attitude from which the product is dropped : 3 directions |
| Bonding Strength | Applying Force (F) : 5 N | It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 5 N Applying Time : 5 s |
| Vibration | Total amplitude 3.0 mm or Acceleration amplitude 196m/s² whichever is smaller. | It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute. Total amplitude 3.0 mm or Acceleration amplitude 196m/s² whichever is smaller. Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) |
| Environmental Performance | ||
| Temperature Cycling | 1 Cycle | It shall be soldered on the glass-epoxy substrate. 1 Cycle 1 step : Minimum Operating Temperature +0 / -3°C / 30+3 / -0 min 2 step : Room Temperature / within 3 min 3 step : Maximum Operating Temperature +3 / -0°C / 30 +3 / -0 min 4 step : Room Temperature / within 3 min Total of 10 cycles |
| Humidity | Temperature : 40±2°C Humidity : 90 to 95%(RH) Time : 500+24 / -0 hours | It shall be soldered on the glass-epoxy substrate. Temperature : 40±2°C Humidity : 90 to 95%(RH) Time : 500+24 / -0 hours |
| Heat Life | Temperature : Maximum Operating Temperature ± 2 °C Test Voltage : Rated Voltage x 150% Time : 1000+48 / -0 hours | Temperature : Maximum Operating Temperature ± 2 °C Test Voltage : Rated Voltage x 150% Charge Current : 50 mA max. Time : 1000+48 / -0 hours |
| Dimensions (in mm) | ||
| L | 1.0±0.1 | |
| W | 0.5±0.2 | |
| T | 0.4±0.1 | |
| e | 0.17±0.1 | |
| g | 0.1 min. | |
| D | 0.35±0.1 | |
| f | 0.15±0.1 | |
| Packaging | ||
| Packaging Code | 0J3 | |
| Unit | (7) | |
| Reel | W8P2 180mm Reel PAPER | |
| Quantity | 10000 pcs./Reel | |
2410121930_muRata-NFM15PC224D0J3D_C2661302.pdf
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