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quality 3 Terminals Low ESL Large Current Chip Multilayer Ceramic Capacitors muRata NFM15PC224D0J3D for General Electronic factory
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quality 3 Terminals Low ESL Large Current Chip Multilayer Ceramic Capacitors muRata NFM15PC224D0J3D for General Electronic factory
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Specifications
Nominal Capacitance:
220nF
Operating Temperature:
-55℃~+105℃
Voltage Rating:
6.3V
Tolerance:
±20%
DC Resistance(DCR):
30mΩ
Current Rating:
2A
Mfr. Part #:
NFM15PC224D0J3D
Package:
0402
Key Attributes
Model Number: NFM15PC224D0J3D
Product Description

Product Overview

This product specification applies to Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL) for General Electronic Equipment. These capacitors offer low ESL and are designed for general-purpose applications.

Product Attributes

  • Brand: MURATA
  • Product Line: NFM15PC Series
  • Type: Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL)

Technical Specifications

ItemSpecificationTest Method
Electrical Performance
Nominal Capacitance0.22 uFFrequency : 1.0±0.1kHz (Cap.) Voltage : 1V±0.2V(rms)
Capacitance Tolerance±20 %
DC Rated VoltageDC 6.3 VTime : 2 minutes max.
Rated Current2A(DC)
DC Resistance30mΩmax.Measured with 100mA max.
Insulation Resistance1000MΩmin.Voltage : Rated Voltage x 300% Time : 1 to 5 s Charge Current : 50 mA max.
Operating /Storage Temp. Range-55 to 105 °C
Mechanical Performance
AppearanceNo defects or abnormalities.Visual inspection.
DimensionsRefer to drawing (Unit:mm)Using calipers.
SolderabilityElectrodes shall be at least 90% covered with new solder coating. Products shall be no failure after tested.Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150±10°C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 ± 3°C Immersion Time : 3±1 s Immersion and emersion rates : 25mm / s
Resistance to soldering heatElectrodes shall be no failure after tested.Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150±10°C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 ± 5°C Immersion Time : 10 ± 1 s Immersion and emersion rates : 25mm / s
Bending StrengthDeflection : 1.0 mmIt shall be soldered on the glass-epoxy substrate (100×40×0.8mm). Deflection : 1.0 mm Keeping Time : 5 s
DropIt shall be dropped on concrete or steel board.Height : 1m Method : Free fall Attitude from which the product is dropped : 3 directions
Bonding StrengthApplying Force (F) : 5 NIt shall be soldered on the glass-epoxy substrate. Applying Force (F) : 5 N Applying Time : 5 s
VibrationTotal amplitude 3.0 mm or Acceleration amplitude 196m/s² whichever is smaller.It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute. Total amplitude 3.0 mm or Acceleration amplitude 196m/s² whichever is smaller. Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours)
Environmental Performance
Temperature Cycling1 CycleIt shall be soldered on the glass-epoxy substrate. 1 Cycle 1 step : Minimum Operating Temperature +0 / -3°C / 30+3 / -0 min 2 step : Room Temperature / within 3 min 3 step : Maximum Operating Temperature +3 / -0°C / 30 +3 / -0 min 4 step : Room Temperature / within 3 min Total of 10 cycles
HumidityTemperature : 40±2°C Humidity : 90 to 95%(RH) Time : 500+24 / -0 hoursIt shall be soldered on the glass-epoxy substrate. Temperature : 40±2°C Humidity : 90 to 95%(RH) Time : 500+24 / -0 hours
Heat LifeTemperature : Maximum Operating Temperature ± 2 °C Test Voltage : Rated Voltage x 150% Time : 1000+48 / -0 hoursTemperature : Maximum Operating Temperature ± 2 °C Test Voltage : Rated Voltage x 150% Charge Current : 50 mA max. Time : 1000+48 / -0 hours
Dimensions (in mm)
L1.0±0.1
W0.5±0.2
T0.4±0.1
e0.17±0.1
g0.1 min.
D0.35±0.1
f0.15±0.1
Packaging
Packaging Code0J3
Unit(7)
ReelW8P2 180mm Reel PAPER
Quantity10000 pcs./Reel

2410121930_muRata-NFM15PC224D0J3D_C2661302.pdf

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