Product Overview
This product specification is applied to Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL) used for General Electronic equipment. These capacitors offer low ESL and are designed for general-purpose applications.
Product Attributes
- Brand: MURATA
- Part Number System Example: NFM41PC155B1E3
- Packaging: 180mm Reel, EMBOSSED W12P4, 4000 pcs./Reel
Technical Specifications
| Item | Specification | Test Method |
|---|---|---|
| Electrical Performance | ||
| Nominal Capacitance | 1.5 ±0.3 μF | Frequency : 1.0±0.1KHz (Cap.) Voltage : 1±0.2V(rms) |
| Capacitance Tolerance | ±20 % | - |
| DC Rated Voltage | DC 25 V | Rated Voltage Time : 2 minutes max. |
| Rated Current | 6A(DC) | - |
| DC Resistance | 9mΩmax. | Measured with 100mA max. |
| Insulation Resistance | 300MΩmin. | - |
| Withstanding Voltage | Products shall not be damaged. | Test Voltage : Rated voltage x 250% Time : 1 to 5 s Charge Current : 50mA max. |
| Operating Temperature | -55 to 85 ℃ | Shown in Rated value. Includes self-heating |
| Storage Temperature | -55 to 85 ℃ | Shown in Rated value. |
| Mechanical Performance | ||
| Appearance | No defects or abnormalities. | Visual inspection. |
| Dimensions | Within the specified dimensions. | Using Measuring instrument of dimension. |
| Solderability | Electrodes shall be at least 95% covered with new solder coating. | Flux : Solution of rosin ethanol 25(mass)% Pre-heat : 150±10℃, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240±3℃ Immersion Time : 3±1s Immersion and emersion rates : 25mm/s |
| Resistance to soldering heat | Products shall be no failure after tested. | Flux : Solution of rosin ethanol 25(mass)% Pre-heat : 150±10℃, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270±5℃ Immersion Time : 10±1s Immersion and emersion rates : 25mm/s |
| Bending Strength | Meet Table 2. | It shall be soldered on the glass-epoxy substrate(t = 1.0mm). Deflection : 2mm Keeping Time : 30s |
| Drop | The electrodes shall be no failure after tested. | It shall be dropped on concrete or steel board. Method : Free fall Height : 1m The Number of Time : Total 10 times |
| Bonding Strength | - | It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 9.8N Applying Time : 30s |
| Vibration | Meet Table 3. | It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute. Total amplitude : 1.5 mm or Acceleration amplitude 196m/s² whichever is smaller. Time: 4 hours of the 3 directions for each. |
| Environment Performance | ||
| Temperature Cycling | Meet Table 4. | 1 Cycle: -55+0/-3℃ / 30+3/-0 min, Room Temp. / within 3 min, +85+3/-0℃ / 30+3/-0 min, Room Temp. / within 3 min. Total of 10 cycles. |
| Humidity | Meet Table 5. | Temperature : 70±2℃ Humidity : 90 to 95%(RH) Time : 1000+48/-0 hours |
| Humidity Life | Meet Table 6. | Temperature : 70±2℃ Humidity : 90 to 95%(RH) Time : 500+24/-0 hours Test Voltage : Rated Voltage Test Current : Rated Current |
| Heat life | Meet Table 4. | Temperature : -85±2℃ Time : 1000+48/-0 hours Test Voltage : Rated Voltagex200% Test Current : Rated Current Change Current : 50A |
| Cold Resistance | Meet Table 6. | Temperature : -55±2℃ Time : 500+24/-0 hours |
| Dimensions (Unit:mm) | ||
| L | 1.5±0.3 | - |
| W | 1.6±0.3 | - |
| T | 1.0±0.2 | - |
| e | 0.4±0.3 | - |
| f | 0.7 min. | - |
| Packaging Code | 1E3 L | - |
Standard Testing Condition
Unless otherwise specified
Temperature : Ordinary Temp. / 15 ℃ to 35 ℃
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa
In case of doubt
Temperature: 20 ℃ ± 2 ℃
Humidity: 60 %(RH) to 70 %(RH)
2410121725_muRata-NFM41PC155B1E3L_C98106.pdf
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