Chip EMIFIL LC Combined Monolithic NFL21S Series
The Chip EMIFIL LC Combined Monolithic NFL21S Series is designed for noise suppression by conducting high-frequency noise elements to ground. It is suitable for applications requiring reliable noise filtering. The product is designed for solder mounting using reflow processes.
Product Attributes
- Brand: MURATA
- Product Type: Chip EMIFIL LC Combined Monolithic
- Series: NFL21S
- Plating: Sn plating (3, 7)
- Packaging Code: D (Taping), B (Bulk)
- RoHS Marking: ROHS Y ()
Technical Specifications
| MURATA Part Number | Cut-off Frequency [MHz] | Capacitance [pF] | Inductance (L) [nH] | DC Resistance [ max.] | Rated Current [mA(DC)] | Insulation Resistance [M min.] | Rated Voltage [V(DC)] | Withstanding Voltage [V(DC)] |
|---|---|---|---|---|---|---|---|---|
| NFL21SP106X1C3D | 10 | 67020% | 68020% | 8.5 | 100 | 1000 | 16 | 50 |
| NFL21SP106X1C3B | 10 | 67020% | 68020% | 8.5 | 100 | 1000 | 16 | 50 |
| NFL21SP206X1C7D | 20 | 24020% | 70020% | 150 | ||||
| NFL21SP206X1C7B | 20 | 24020% | 70020% | 150 | ||||
| NFL21SP506X1C3D | 50 | 8420% | 30520% | 3.5 | 150 | |||
| NFL21SP506X1C3B | 50 | 8420% | 30520% | 3.5 | 150 | |||
| NFL21SP706X1C3D | 70 | 7620% | 18520% | 3.0 | ||||
| NFL21SP706X1C3B | 70 | 7620% | 18520% | 3.0 | ||||
| NFL21SP107X1C3D | 100 | 4420% | 13520% | 2.0 | 200 | |||
| NFL21SP107X1C3B | 100 | 4420% | 13520% | 2.0 | 200 | |||
| NFL21SP157X1C3D | 150 | 2820% | 12820% | |||||
| NFL21SP157X1C3B | 150 | 2820% | 12820% | |||||
| NFL21SP207X1C3D | 200 | 2220% | 7220% | 1.5 | 250 | |||
| NFL21SP207X1C3B | 200 | 2220% | 7220% | 1.5 | 250 | |||
| NFL21SP307X1C3D | 300 | 1910% | 4510% | 1.2 | 300 | |||
| NFL21SP307X1C3B | 300 | 1910% | 4510% | 1.2 | 300 | |||
| NFL21SP407X1C3D | 400 | 1610% | 3410% | |||||
| NFL21SP407X1C3B | 400 | 1610% | 3410% | |||||
| NFL21SP507X1C3D | 500 | 1210% | 3110% | |||||
| NFL21SP507X1C3B | 500 | 1210% | 3110% |
Dimensions
(2) (1) (3)
1.250.1
0.850.1
2.00.2
0.30.2
0.60.2
0.30.2
1.250.1
0.40.2
0.250.2
Operating and Storage Temperature
- Operating Temperature: -55C to +125C (Includes self-heating.)
- Storage Temperature: -55C to +125C
Standard Testing Conditions
Temperature: Ordinary Temp. / 15 C to 35 C
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa
Packaging Specification (8mm-wide paper tape)
Packing quantity: 4000 pcs. / reel
Sprocket Hole: To the right as the tape is pulled toward the user.
Top tape pull strength: 5N min.
Bottom tape pull strength: 5N min.
Top tape peeling off force: 0.1N to 0.6N (typical)
Land Dimensions
Standard land dimensions for reflow:
0.6
1.4
2.6
0.8
2.3
0.6
1.9
Caution: Limitation of Applications
Contact manufacturer before using in applications requiring especially high reliability, including: Aircraft equipment, Aerospace equipment, Undersea equipment, Power plant control equipment, Medical equipment, Transportation equipment (automobiles, trains, ships, etc.), Traffic signal equipment, Disaster prevention / crime prevention equipment, Data-processing equipment, and applications of similar complexity or with reliability requirements comparable to the applications listed above.
Notice
Products can only be soldered with reflow. Use rosin-based flux (chlorine content not exceeding 0.2(wt)%) and Sn-3.0Ag-0.5Cu solder. Avoid highly acidic or water-soluble flux. Thermal shock: Pre-heating and cooling into solvent should limit temperature difference to 100C max. PCB bending: Design PCBs to avoid mechanical stress on products.
2410121548_muRata-NFL21SP407X1C3D_C413958.pdf
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