Chip EMIFIL LC Combined Type for Large Current NFE61PT Series

The Chip EMIFIL LC Combined Type for Large Current NFE61PT Series is designed for noise suppression by conducting high-frequency noise elements to ground. This product is suitable for various electronic applications requiring effective EMI filtering.

Product Attributes

• Brand: MURATA
• Product Type: Chip EMIFIL LC Combined Type
• Series: NFE61PT
• Origin: Japan (implied by manufacturer)

Technical Specifications

Dimensions

Unit Mass (Typical value): 0.062g

Dimensions (in mm):

• Length: 6.80.5
• Width: 1.60.3
• Height: 0.70.2
• Terminal Width: 2.60.3
• Terminal Spacing: 1.60.3

Standard Testing Conditions

Ordinary Temp: 15C to 35C, Ordinary Humidity: 25 %(RH) to 85 %(RH), Atmospheric pressure: 86kPa to 106kPa

In case of doubt: Temperature: 20C 2C, Humidity: 60 %(RH) to 70 %(RH)

Packaging Specification

Taping (12mm-wide plastic tape):

• Packing Quantity: 2500 pcs. / reel
• Packing Method: Products packaged in cavity of plastic tape and sealed with cover tape.
• Sprocket Hole: To the right as the tape is pulled toward the user.
• Spliced point: Cover tape has no spliced point.
• Missing components number: Within 0.1% of the number per reel or 1 pc., whichever is greater, and not continuous.

Pull Strength:

• Plastic tape: 5N min.
• Cover tape: 10N min.

Peeling off force of cover tape: 0.2N to 0.7N (minimum value is typical) at 300 mm / min Speed of Peeling off.

Leader-tape, Trailer and Reel Dimensions:

• Leader-tape: Cover tape only and empty tape.
• Trailer-tape: Empty tape.
• Reel Dimensions: 180, 60, 13, 171.4

Marking for reel: Customer part number, MURATA part number, Inspection number, RoHS marking, Quantity, etc.

Marking for Outside package (corrugated paper box): Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking, Quantity, etc.

Outer Case Dimensions (Standard Reel Quantity in Outer Case: 4 reels): W: 186mm, D: 186mm, H: 93mm

Standard Land Dimensions

For Reflow Soldering:

• Side on which chips are mounted
• Dimensions (in mm): 1.5, 3.8, 4.8, 9.0, 0.6, 1.2, 3.2, 3.6

For Flow Soldering:

• Side on which chips are mounted
• Dimensions (in mm): 2.0, 4.8, 8.8, 1.6, 2.6, 3.0
• Small diameter thru hole: 0.4

Caution

Limitation of Applications: Please contact us before using our products for applications requiring especially high reliability, such as aircraft equipment, aerospace equipment, undersea equipment, power plant control equipment, medical equipment, transportation equipment, traffic signal equipment, disaster prevention/crime prevention equipment, data-processing equipment, and applications of similar complexity or with comparable reliability requirements.

Notice

This product is designed for solder mounting. Please consult us in advance for applying other mounting methods such as conductive adhesive.

Flux and Solder:

• Flux: Use rosin-based flux. Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%) or water-soluble flux.
• Solder: Use Sn-3.0Ag-0.5Cu solder.

Note for Assembling:

• Thermal Shock: Pre-heating temperature difference between solder and product surface should be limited to 100C max. Cooling into solvent after soldering should also be limited to 100C max.
• Consideration for mounting of 2.5mm pitch: Prevent mounting on flow soldering to avoid excess solder volume.

Attention Regarding P.C.B. Bending:

• P.C.B. shall be designed so that products are not subject to mechanical stress from board warpage. Products should be located in the sideways direction (Length: a < b) to the mechanical stress.
• Products located on P.C.B. near seam for separation should be carefully placed to avoid mechanical stress due to warping the board, as they may be subjected to stress in the order of A > C > B D.

Standard Soldering Conditions: On flow soldering (e.g., double wave soldering), use the product in consideration of...