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quality Film type chip common mode choke coil muRata DLP0NSN350HL2L for in DSI CSI UniPro interface circuits factory
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quality Film type chip common mode choke coil muRata DLP0NSN350HL2L for in DSI CSI UniPro interface circuits factory
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Specifications
Operating Temperature:
-40℃~+85℃
DC Resistance(DCR):
1.2Ω
Voltage Rating - DC:
5V
Number of Lines:
2
Voltage Withstand:
12.5V
Mfr. Part #:
DLP0NSN350HL2L
Package:
SMD-4P,0.8x0.6mm
Key Attributes
Model Number: DLP0NSN350HL2L
Product Description

Chip Common Mode Choke Coil DLP0NS Series

The DLP0NS Series Chip Common Mode Choke Coil is designed for noise suppression in various electronic applications. This series offers a film-type structure with compact dimensions, suitable for high-density mounting. It is ideal for applications requiring filtering of common mode noise, such as in MIPI D-PHY interfaces (DSI, CSI, UniPro).

Product Attributes

  • Brand: MURATA MFG.CO., LTD
  • Product Type: Chip Common Mode Choke Coil
  • Structure: Film Type
  • Polarity: No polarity
  • Marking: No Marking
  • Mass (Typical): 0.001g

Technical Specifications

Murata Part NumberCommon Mode Impedance (at 100MHz)Rated VoltageRated CurrentDC ResistanceOperating Temperature
DLP0NSN350HL2L3510%5V(DC)100mA1.225%-40 to +85C
DLP0NSN350HL2B3510%5V(DC)100mA1.225%-40 to +85C
DLP0NSN670HL2L67 20%5V(DC)110mA2.425%-40 to +85C
DLP0NSN670HL2B67 20%5V(DC)110mA2.425%-40 to +85C
DLP0NSN900HL2L90 20%5V(DC)100mA3.025%-40 to +85C
DLP0NSN900HL2B90 20%5V(DC)100mA3.025%-40 to +85C
DLP0NSN121HL2L120 20%5V(DC)90mA3.825%-40 to +85C
DLP0NSN121HL2B120 20%5V(DC)90mA3.825%-40 to +85C
DLP0NSC280HL2L2820%5V(DC)100mA1.325%-40 to +85C
DLP0NSC280HL2B2820%5V(DC)100mA1.325%-40 to +85C
DLP0NSC900HL2L9035%5V(DC)75mA4.030%-40 to +85C
DLP0NSC900HL2B9035%5V(DC)75mA4.030%-40 to +85C
ItemSpecificationTest Method
Appearance and DimensionsMeet item 5.Visual Inspection and measured with Slide Calipers.
SolderabilityThe electrodes shall be at least 95% covered with new solder coating.Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 15010C, 6090s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2403C Immersion Time : 30.5s Immersion and emersion rates : 25 mm / s
Resistance to Soldering HeatMeet Table 1.Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 15010C, 6090s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2705C Immersion Time : 51s Immersion and emersion rates : 25 mm / s Then measured arter exposure in the room condition for 4 to 48 hours.
DropIt shall be dropped on concrete or steel board.Method : free fall Height : 1m The Number of Times : 10 times
VibrationIt shall be soldered on the substrate.Oscillation Frequency : 10 to 2000 to 10Hz for 15 minutes Total amplitude : 3.0 mm or Acceleration amplitude 196 m/s2 whichever is smaller. Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions.
Bending StrengthMeet Table 2.Substrate : (t =1.0 mm). Deflection : 3 mm Speed of Applying Force : 1.0 mm / s Keeping time : 5 seconds
Temperature CycleMeet Table 1.1 Cycle Step 1 -40C(+0C,-3C) / 30(+3,-0) min Step 2 Ordinary Temp. / within 3 min Step 3 +85(+3C,-0C) / 30(+3,-0) min Step 4 Ordinary Temp. / within 3 min Total of 100 cycles. Then measured after exposure in the room condition for 4 to 48 hours.
HumidityTemperature : 402C Humidity : 90 to 95 % (RH) Time : 1000 hours(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours.
Heat lifeTemperature : 852C Test Voltage : 2 times for Rated Voltage Time : 1000 hours(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours.
Cold ResistanceTemperature : -40 2C Time : 1000 hours(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours.

2410121457_muRata-DLP0NSN350HL2L_C2992333.pdf

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