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Specifications
Mfr. Part #:
MPIT4030-6R8M-LF
Package:
SMD,4x4mm
Key Attributes
Model Number:
MPIT4030-6R8M-LF
Product Description
Product Overview
The MPIT4030 series SMD power inductors are designed for various electronic applications. This specification outlines the product details, electrical characteristics, and reliability testing for these components.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
- Origin: P.R.C
- Product Name: (SMD power inductor)
- Series: MPIT4030 series
- Environmental Compliance: Lead free products
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
| MPIT4030-R91M-LF | 0.9120% | 0.017 | 0.013 | 7.00 | 8.00 | 4.15 | 4.70 |
| MPIT4030-1R0M-LF | 1.020% | 0.018 | 0.014 | 6.50 | 7.20 | 4.15 | 4.70 |
| MPIT4030-1R2M-LF | 1.220% | 0.020 | 0.015 | 6.00 | 6.80 | 3.82 | 4.20 |
| MPIT4030-1R5M-LF | 1.520% | 0.026 | 0.020 | 5.50 | 6.50 | 3.34 | 3.60 |
| MPIT4030-1R8M-LF | 1.820% | 0.033 | 0.025 | 5.50 | 5.80 | 3.20 | 3.30 |
| MPIT4030-2R2M-LF | 2.220% | 0.039 | 0.030 | 5.00 | 5.40 | 2.95 | 3.20 |
| MPIT4030-3R3M-LF | 3.320% | 0.052 | 0.040 | 3.60 | 4.20 | 2.40 | 2.65 |
| MPIT4030-3R9M-LF | 3.920% | 0.072 | 0.057 | 3.30 | 3.80 | 2.10 | 2.30 |
| MPIT4030-4R7M-LF | 4.720% | 0.078 | 0.060 | 2.70 | 3.20 | 2.00 | 2.20 |
| MPIT4030-5R6M-LF | 5.620% | 0.085 | 0.065 | 2.70 | 2.90 | 1.95 | 2.10 |
| MPIT4030-6R8M-LF | 6.820% | 0.109 | 0.084 | 2.30 | 2.80 | 1.65 | 1.80 |
| MPIT4030-8R2M-LF | 8.220% | 0.109 | 0.084 | 2.10 | 2.35 | 1.65 | 1.80 |
| MPIT4030-100M-LF | 1020% | 0.125 | 0.096 | 1.80 | 2.20 | 1.52 | 1.65 |
| MPIT4030-120M-LF | 1220% | 0.170 | 0.131 | 1.65 | 2.10 | 1.30 | 1.45 |
| MPIT4030-150M-LF | 1520% | 0.245 | 0.189 | 1.60 | 1.90 | 1.11 | 1.20 |
| MPIT4030-220M-LF | 2220% | 0.295 | 0.225 | 1.10 | 1.50 | 1.00 | 1.10 |
| MPIT4030-330M-LF | 3320% | 0.415 | 0.320 | 1.00 | 1.30 | 0.85 | 0.95 |
| MPIT4030-390M-LF | 3920% | 0.450 | 0.345 | 1.03 | 1.10 | 0.80 | 0.90 |
| MPIT4030-470M-LF | 4720% | 0.580 | 0.445 | 0.75 | 1.05 | 0.72 | 0.80 |
| MPIT4030-560M-LF | 5620% | 0.720 | 0.555 | 0.85 | 0.95 | 0.65 | 0.70 |
| MPIT4030-620M-LF | 6220% | 1.080 | 0.829 | 0.80 | 0.85 | 0.53 | 0.60 |
| MPIT4030-680M-LF | 6820% | 1.130 | 0.868 | 0.70 | 0.85 | 0.52 | 0.55 |
| MPIT4030-101M-LF | 10020% | 1.450 | 1.110 | 0.60 | 0.75 | 0.45 | 0.50 |
| MPIT4030-121M-LF | 12020% | 1.630 | 1.250 | 0.53 | 0.60 | 0.43 | 0.47 |
| MPIT4030-151M-LF | 15020% | 1.720 | 1.440 | 0.50 | 0.60 | 0.42 | 0.46 |
| MPIT4030-181M-LF | 18020% | 1.836 | 1.530 | 0.48 | 0.55 | 0.40 | 0.44 |
| MPIT4030-331M-LF | 33020% | 4.080 | 3.400 | 0.30 | 0.38 | 0.27 | 0.30 |
Operating Conditions
Product normal work ambient temperature: -40 ~ +125.
Reliability Testing
| Item | Required Characteristics | Test Method/Condition |
| High temperature storage test | 1.No case deformation or change in appearance. 2.Inductance change 10% (|L|/L10%) | Temperature: 1252 Time: 1000 hours Measurement at 244 hours after test conclusion. |
| Low temperature storage test | Temperature: -402 Time: 1000 hours Measurement at 244 hours after test conclusion. | |
| Humidity test | Temperature: 25-85, Humidity: 85% RH Time: 1000 hours. Measurement at 244 hours after test conclusion. | |
| Thermal shock test | -40 for 30min, then 125 for 30min as 1 cycle. Total 1000 cycles. | |
| Solderability test | Terminal area must have 90% min. solder coverage. | Dip pads in flux then dip in solder pot at 2455 for 50.1 second. Solder: Sn96.5%Ag3%Cu0.5%. Flux: rosin flux. |
| Heat endurance of reflow soldering | 1.No case deformation or change in appearance. 2.Inductance change 10% (|L|/L10%) | Refer to reflow curve, 3 times. Peak temperature: 260+5/-0. |
| Vibration test | Apply frequency 10~55Hz, 1.5mm amplitude in each of 3 perpendicular directions for 2 hours each (total 6 hours). | |
| Drop test | Drop 10 times on a concrete floor from a height of 1m. | |
| Terminal strength push test | Pulling test: Apply 17.64N force, keep for 10s. Bending test: Terminal should not pull off after bending. | |
| Loading at High Temperature | 1. No case deformation or change in appearance. 2. |L|/L10% | 1. Temperature: 852 2. Time: 1000 hours 3. Apply rated current. 4. Measurement at 244 hours after test conclusion. |
Recommended Soldering Conditions
Product can be applied to flow and reflow soldering.
Flux: Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt% (chlorine conversion value). Use Sn solder.
Flow soldering conditions: Pre-heating temperature difference between solder and product surface 150. Cooling temperature difference 100.
Reflow soldering conditions: Refer to reflow curve.
2410121250_microgate-MPIT4030-6R8M-LF_C281306.pdf
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