Product Overview
The MPIM252010 series is a Surface Mount Device (SMD) power inductor designed for various electronic applications. It offers reliable performance and is manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Product Attributes
- Brand: MICROGATE
- Origin: SHENZHEN MICROGATE TECHNOLOGY CO., LTD
- Material: Core: Mixed Alloy Material, Wire: Enameled Copper Wire, Terminal: Tin Covered Copper
- Certifications: Lead free product
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
|---|---|---|---|---|---|---|---|
| MPIM252010F1R0M-LF | 1.020% | 0.028 | 0.023 | 4.00 | 4.50 | 3.20 | 3.60 |
Dimensions
| Model | A (mm) | B (mm) | C (mm) | D (mm) | f (mm) | g (mm) | h (mm) |
|---|---|---|---|---|---|---|---|
| MPIM252010 | 2.500.25 | 2.000.25 | 1.00Max. | 0.600.20 | 1.20 Typ. | 2.80 Typ. | 2.00 Typ. |
Version Record
| Rev. | Effective Date | Changed Contents | Change Reasons | Approved By |
|---|---|---|---|---|
| 1.0 | Dec. 10.2012 | New released | / | Charles |
| 2.0 | JUL. 31.2014 | Change the Electrical Characteristics | The Electrical Characteristics improved | Charles |
Testing Conditions
Unless otherwise specified: Temperature: Ordinary Temperature (5 to 35C), Humidity: Ordinary Humidity (25 to 85% RH), Atmospheric Pressure: 86 to 106 kPa.
In case of doubt: Temperature: 202C, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.
Condition of Work
Operating temperature range: -40C ~ +125C (Including self-heating).
Recommended Soldering Conditions
Flux, Solder: Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt% (chlorine conversion value). Use Sn solder.
Reflow soldering conditions:
| Profile Feature | Lead-Free Assembly |
|---|---|
| Average Ramp-Up Rate (Ts max. to Tp) | 3C/second max. |
| Preheat Temperature Min (Ts min.) | 150C |
| Preheat Temperature Max (Ts max.) | 200C |
| Preheat Time (ts min to ts max.) | 60-180 seconds |
| Time maintained above Temperature (TL) | 217C |
| Time maintained above Time (tL) | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 260C |
| Peak/Classification Time (Tp) | 10 seconds |
| Time within 5 C of actual Peak Temperature (Tp) | 20-40 seconds |
| Ramp-Down Rate | 6C/second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
Re-work with using the iron: Pre-heating 150C, 1 minute; Tip temperature 350C max; Soldering iron output 80W max; End of soldering iron 1mm max; Soldering time 3 seconds max. Product once removed from the circuit board may not be used again.
Package Information
Packaging quantities: 2000PCS/Reel.
| W (mm) | A0 (mm) | B0 (mm) | K0 (mm) | E (mm) | F (mm) | P (mm) | P0 (mm) | D0 (mm) | T (mm) |
|---|---|---|---|---|---|---|---|---|---|
| 8.00.3 | 2.400.10 | 2.800.10 | 1.200.1 | 1.750.1 | 3.50.05 | 4.00.1 | 4.00.1 | 1.5+0.1/-0.0 | 0.180.03 |
2411121030_microgate-MPIM252010F1R0M-LF_C20613636.pdf
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