SMD Power Inductor - MPIT252010 Series
This specification applies to the MPIT series of SMD power inductors manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD. These inductors are designed for various electronic applications requiring efficient power management.
Product Attributes
- Brand: MICROGATE
- Origin: SHENZHEN MICROGATE TECHNOLOGY CO., LTD, P.R.C
- Product Series: MPIT252010 Series
- Material: Ferrite Core (Ni-Zn Ferrite), Enameled Copper Wire, Ag/Ni/Sn/Cu Terminal Electrode, Epoxy resin and magnetic powder Magnetic Glue
- Certifications: Lead free product (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Typ. | Isat 1 (A) Typ. | Irms 2 (A) Typ. | SRF (MHz) Typ. |
|---|---|---|---|---|---|
| MPIT252010-R47N-LF | 0.4730% | 0.056 | 2.50 | 2.15 | 201 |
| MPIT252010-R68N-LF | 0.6830% | 0.074 | 2.20 | 1.80 | 139 |
| MPIT252010-1R0N-LF | 1.030% | 0.108 | 1.85 | 1.50 | 100 |
| MPIT252010-1R5N-LF | 1.530% | 0.182 | 1.80 | 1.20 | 80 |
| MPIT252010-2R2N-LF | 2.230% | 0.209 | 1.20 | 1.10 | 60 |
| MPIT252010-3R3M-LF | 3.320% | 0.328 | 1.05 | 0.85 | 49 |
| MPIT252010-4R7M-LF | 4.720% | 0.564 | 1.00 | 0.65 | 40 |
| MPIT252010-5R6M-LF | 5.620% | 0.564 | 0.80 | 0.65 | 37 |
| MPIT252010-6R8M-LF | 6.820% | 0.896 | 0.78 | 0.58 | 32 |
| MPIT252010-100M-LF | 1020% | 1.092 | 0.65 | 0.48 | 26 |
Product Dimensions
| Model | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | f (mm) | g (mm) | h (mm) |
|---|---|---|---|---|---|---|---|---|
| MPIT252010 | 2.500.20 | 2.000.20 | 1.00Max. | 0.800.2 | 0.800.2 | 0.80 Typ. | 2.50 Typ. | 2.00 Typ. |
Test Conditions
Ordinary Conditions: Temperature: 5 to 35, Humidity: 25 to 85% RH, Atmospheric Pressure: 86 to 106 kPa
Reference Conditions: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa
Operating Conditions
- Ambient Temperature: -25 to +85
- Allowed High Temperature: +125
- Temperature Dependence: 40
- Storage Temperature: -25 to +85
- Storage Life: Half a year
- Operating Ambient Frequency: 0.1MHz to 1MHz
Recommended Soldering Conditions
Suitable for flow and reflow soldering.
- Flux: Rosin-based flux (halide content 0.2wt%)
- Solder: Sn solder
- Flow Soldering: Pre-heating temperature difference 150 (solder vs. product surface). Cooling into solvent after soldering should be gradual.
2410121314_microgate-MPIT252010-1R5N-LF_C486422.pdf
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