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Specifications
Mfr. Part #:
MPIT4018-R24M-LF
Package:
SMD,4x4mm
Key Attributes
Model Number:
MPIT4018-R24M-LF
Product Description
Product Overview
The MPIT4018 series SMD power inductors are designed for various electronic applications. This specification document outlines the product's identification, dimensions, materials, testing conditions, electrical characteristics, working conditions, reliability, soldering recommendations, packaging, and visual inspection standards.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
- Product Name: (SMD power inductor)
- Series: MPIT4018
- Origin: P.R.C
- Lead Free: Yes (indicated by -LF suffix)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
| MPIT4018-R24M-LF | 0.2420% | 0.016 | 0.012 | 6.50 | 7.00 | 4.60 | 5.00 |
| MPIT4018-R68M-LF | 0.6820% | 0.025 | 0.021 | 6.00 | 7.00 | 3.80 | 4.15 |
| MPIT4018-1R0M-LF | 1.020% | 0.030 | 0.025 | 4.55 | 4.85 | 3.40 | 3.80 |
| MPIT4018-1R2M-LF | 1.220% | 0.030 | 0.025 | 4.20 | 4.80 | 3.40 | 3.80 |
| MPIT4018-1R5M-LF | 1.520% | 0.036 | 0.030 | 3.90 | 4.25 | 2.95 | 3.20 |
| MPIT4018-2R2M-LF | 2.220% | 0.048 | 0.040 | 3.15 | 3.40 | 2.60 | 2.90 |
| MPIT4018-2R7M-LF | 2.720% | 0.060 | 0.050 | 2.70 | 3.00 | 2.20 | 2.50 |
| MPIT4018-3R3M-LF | 3.320% | 0.060 | 0.050 | 2.70 | 3.00 | 2.20 | 2.50 |
| MPIT4018-3R9M-LF | 3.920% | 0.078 | 0.065 | 2.60 | 2.80 | 2.00 | 2.20 |
| MPIT4018-4R7M-LF | 4.720% | 0.078 | 0.065 | 2.10 | 2.30 | 2.00 | 2.20 |
| MPIT4018-6R8M-LF | 6.820% | 0.108 | 0.090 | 1.70 | 1.85 | 1.70 | 1.90 |
| MPIT4018-100M-LF | 1020% | 0.168 | 0.140 | 1.40 | 1.55 | 1.20 | 1.30 |
| MPIT4018-150M-LF | 1520% | 0.228 | 0.190 | 1.15 | 1.25 | 1.00 | 1.20 |
| MPIT4018-220M-LF | 2220% | 0.336 | 0.280 | 1.00 | 1.10 | 0.95 | 1.10 |
| MPIT4018-330M-LF | 3320% | 0.480 | 0.400 | 0.80 | 0.90 | 0.75 | 0.85 |
| MPIT4018-470M-LF | 4720% | 0.720 | 0.600 | 0.70 | 0.80 | 0.60 | 0.70 |
| MPIT4018-560M-LF | 5620% | 0.912 | 0.760 | 0.65 | 0.80 | 0.53 | 0.58 |
| MPIT4018-101M-LF | 10020% | 1.740 | 1.450 | 0.45 | 0.55 | 0.30 | 0.35 |
| MPIT4018-221M-LF | 22020% | 3.600 | 3.000 | 0.30 | 0.34 | 0.21 | 0.23 |
Dimensions
| Dimensions in mm | A | B | C (Max.) | D | E | f (Typ.) | g (Typ.) | h (Typ.) |
| Value | 4.00.2 | 4.00.2 | 1.8 | 2.10.2 | 0.950.2 | 1.9 | 4.1 | 3.7 |
Materials
| Item | Material |
| Core | Ni-Zn Ferrite |
| Wire | Enameled Copper Wire |
| Terminal Electrode | Ag/Ni/Sn/Cu |
| Magnetic Glue | Epoxy resin and magnetic powder |
Operating Conditions
| Parameter | Value |
| Ambient Temperature | -40 ~ +125 |
Reliability Testing
| Item | Required Characteristics | Test Method/Condition |
| High temperature storage test | No case deformation or change in appearance. |L|/L10% | Temperature: 1252, Time: 1000 hours. Measurement after 244 hours at room temperature. |
| Low temperature storage test | No case deformation or change in appearance. |L|/L10% | Temperature: -552, Time: 1000 hours. Measurement after 244 hours at room temperature. |
| Humidity test | No case deformation or change in appearance. |L|/L10% | Temperature: 85, Humidity: 85% RH, Time: 1000 hours. Measurement after 244 hours at room temperature. |
| Thermal shock test | No case deformation or change in appearance. |L|/L10% | 1000 cycles of -40 for 30 min. and 125 for 30 min. |
| Solderability test | Terminal area must have 90% min. solder coverage. | Dip pads in flux then dip in solder pot at 2455 for 50.1 second. Solder: Sn96.5%Ag3%Cu0.5%. Flux: rosin flux. |
| Heat endurance of reflow soldering | No case deformation or change in appearance. |L|/L10% | Refer to reflow curve, 3 times. Peak temperature: 260+5/-0. |
| Vibration test | No case deformation or change in appearance. |L|/L10% | 10~55Hz, 1.5mm amplitude, 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Drop test | No case deformation or change in appearance. |L|/L10% | Drop 10 times on a concrete floor from a height of 1m. |
| Terminal strength push test | Terminal should not pull off. | Pulling test: 17.64N force for 10s. Bending test: 2mm deflection. |
| Loading at High Temperature | No case deformation or change in appearance. |L|/L10% | Temperature: 852, Time: 1000 hours, Apply rated current. Measurement after 244 hours at room temperature. |
Recommended Soldering Conditions
Flux and Solder
- Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt%.
- Use Sn solder.
Flow Soldering Conditions
- Temperature difference between solder and product surface during pre-heating: max 150.
- Temperature difference between solvent and product surface during cooling: max 100.
Reflow Soldering Conditions
- Pre-heating: 150, 1 minute max.
- Peak temperature: 350, 3 seconds max.
2410121252_microgate-MPIT4018-R24M-LF_C281280.pdf
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