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Specifications
Mfr. Part #:
MPIA252010-3R3M-LF
Package:
1008
Key Attributes
Model Number:
MPIA252010-3R3M-LF
Product Description
Product Overview
The MPIA252010 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are suitable for use in a wide operating temperature range.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
- Product Name: (SMD power inductor)
- Series: MPIA252010 series
- Origin: P.R.C
- Material: Core: Mixed Alloy Material, Wire: Enameled Copper Wire, Terminal: Ag/Ni/Sn/Cu, Magnetic Glue: Epoxy resin and magnetic powder
- Environmental Compliance: Lead free products (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR Max () | Isat Max (A) | Irms (A) |
| MPIA252010-R24M-LF | 0.2420% | 0.030 | 5.70 | 3.85 |
| MPIA252010-R33M-LF | 0.3320% | 0.026 | 6.00 | 4.50 |
| MPIA252010-R47M-LF | 0.4720% | 0.038 | 5.50 | 3.60 |
| MPIA252010-R68M-LF | 0.6820% | 0.050 | 3.60 | 3.20 |
| MPIA252010-1R0M-LF | 1.020% | 0.065 | 3.20 | 2.80 |
| MPIA252010-1R5M-LF | 1.520% | 0.100 | 2.70 | 2.00 |
| MPIA252010-2R2M-LF | 2.220% | 0.130 | 1.90 | 1.80 |
| MPIA252010-3R3M-LF | 3.320% | 0.225 | 1.80 | 1.40 |
| MPIA252010-4R7M-LF | 4.720% | 0.310 | 1.50 | 1.15 |
| MPIA252010-100M-LF | 1020% | 0.600 | 0.95 | 0.90 |
| Item | Required Characteristics | Test Method/Condition |
| High temperature storage test | No case deformation or change in appearance. |L|/L10% | Temperature: 1252 Time: 1000 hours Measurement at 244 hours after test conclusion. |
| Low temperature storage test | No case deformation or change in appearance. |L|/L10% | Temperature: -402 Time: 1000 hours Measurement at 244 hours after test conclusion. |
| Humidity test | No case deformation or change in appearance. |L|/L10% | Temperature: 85, Humidity: 85% RH Time: 1000 hours Measurement at 244 hours after test conclusion. |
| Thermal shock test | No case deformation or change in appearance. |L|/L10% | -40 for 30min to 125 for 30min as 1 cycle. Total 1000 cycles. |
| Solderability test | Terminal area must have 90% min. solder coverage. | Dip pads in flux then dip in solder pot at 2455 for 50.1 second. |
| Heat endurance of reflow soldering | No case deformation or change in appearance. |L|/L10% | Refer to reflow curve, 3 times. Peak temperature: 260+5/-0. |
| Vibration test | No case deformation or change in appearance. |L|/L10% | 10~55Hz, 1.5mm amplitude in each of 3 directions for 2 hours each. |
| Drop test | No case deformation or change in appearance. |L|/L10% | Drop 10 times on a concrete floor from a height of 1m. |
| Terminal strength push test | Terminal should not pull off. | Apply 17.64N force for 10s. |
| Loading at High Temperature | No case deformation or change in appearance. |L|/L10% | Temperature: 852, Time: 1000 hours, Apply rated current. Measurement at 244 hours after test conclusion. |
2410121252_microgate-MPIA252010-3R3M-LF_C696458.pdf
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