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Specifications
Current - Saturation (Isat):
750mA
Mfr. Part #:
MPIE252010-100M-LF
Package:
1008
Key Attributes
Model Number:
MPIE252010-100M-LF
Product Description
SMD Power Inductor MPIE252010 Series
This specification applies to the MPIE252010 series of SMD power inductors. These components are designed for various electronic applications requiring reliable power inductance.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Product Series: MPIE252010 series
- Product Type: SMD power inductor
- Origin: Shenzhen, P.R.C.
- Environmental Compliance: Lead-free products
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max | DCR () Typ | Isat (A) Max | Isat (A) Typ | Irms (A) Max | Irms (A) Typ |
| MPIE252010-R24M-LF | 0.2420% | 0.030 | 0.022 | 4.00 | 5.50 | 3.90 | 4.30 |
| MPIE252010-R33M-LF | 0.3320% | 0.038 | 0.030 | 3.80 | 4.05 | 3.30 | 3.90 |
| MPIE252010-R47M-LF | 0.4720% | 0.038 | 0.030 | 3.70 | 3.90 | 3.30 | 3.90 |
| MPIE252010-R68M-LF | 0.6820% | 0.053 | 0.040 | 3.00 | 3.50 | 3.00 | 3.20 |
| MPIE252010-1R0M-LF | 1.020% | 0.072 | 0.060 | 2.30 | 2.60 | 2.30 | 2.60 |
| MPIE252010-1R5M-LF | 1.520% | 0.103 | 0.085 | 2.00 | 2.20 | 1.90 | 2.10 |
| MPIE252010-2R2M-LF | 2.220% | 0.130 | 0.108 | 1.50 | 1.70 | 1.80 | 2.00 |
| MPIE252010-3R3M-LF | 3.320% | 0.210 | 0.190 | 1.45 | 1.60 | 1.25 | 1.50 |
| MPIE252010-4R7M-LF | 4.720% | 0.318 | 0.265 | 1.20 | 1.30 | 1.10 | 1.20 |
| MPIE252010-6R8M-LF | 6.820% | 0.470 | 0.425 | 1.00 | 1.10 | 0.90 | 1.10 |
| MPIE252010-100M-LF | 1020% | 0.600 | 0.530 | 0.75 | 0.80 | 0.70 | 0.80 |
| MPIE252010-150M-LF | 1520% | 0.990 | 0.825 | 0.50 | 0.60 | 0.45 | 0.50 |
| Item | Required Characteristics | Test Method/Condition |
| High temperature storage test | No case deformation or change in appearance. |L|/L10% | Temperature: 1252, Time: 1000 hours. Measurement after 244 hours at room temperature. |
| Low temperature storage test | No case deformation or change in appearance. |L|/L10% | Temperature: -402, Time: 1000 hours. Measurement after 244 hours at room temperature. |
| Humidity test | No case deformation or change in appearance. |L|/L10% | Temperature: 25-85, Humidity: 85% RH, Time: 1000 hours. Measurement after 244 hours at room temperature. |
| Thermal shock test | No case deformation or change in appearance. |L|/L10% | -40 for 30 min. to 125 for 30 min. per cycle, 1000 cycles. |
| Solderability test | Terminal area must have 90% min. solder coverage. | Dip pads in flux then dip in solder pot at 2455 for 50.1 seconds. Solder: Sn96.5%Ag3%Cu0.5%. Flux: rosin flux. |
| Heat endurance of reflow soldering | No case deformation or change in appearance. |L|/L10% | Refer to reflow curve, 3 times. Peak temperature: 260+5/-0. |
| Vibration test | No case deformation or change in appearance. |L|/L10% | 10~55Hz, 1.5mm amplitude, 2 hours per direction, 3 directions (total 6 hours). |
| Drop test | No case deformation or change in appearance. |L|/L10% | Drop 10 times on a concrete floor from a height of 1m. |
| Terminal strength push test | Terminal should not pull off. | Apply 17.64N force for 10s after soldering on PCB. |
| Bending test | Terminal should not pull off. | Bend PCB at middle point by 2mm with 0.5mm/sec speed, hold for 601s. |
| Loading at High Temperature | No case deformation or change in appearance. |L|/L10% | Temperature: 852, Time: 1000 hours, Apply rated current. Measurement after 244 hours at room temperature. |
| Profile Feature | Specification |
| Average Ramp-Up Rate (Ts max. to Tp) | 3/second max. |
| Preheat (Ts min.) | 150 |
| Preheat (Ts max.) | 200 |
| Preheat Time (ts min to ts max.) | 60-180 seconds |
| Temperature (TL) | 217 |
| Time (tL) | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 260 |
| Peak/Classification Time (Tp) | 3-4 seconds |
2410121250_microgate-MPIE252010-100M-LF_C490472.pdf
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