Product Overview
The MGHC966410E series is a high-current SMD power inductor designed for various electronic applications requiring efficient power management. This series offers robust performance and reliability in a compact surface-mount package.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Origin: Shenzhen, China
- Product Name: SMD high current power inductor
- Series: MGHC966410E
- Certifications: AEC-Q200 compliance mentioned in reliability testing.
- Lead-Free: Yes
Technical Specifications
| Microgate Part No. | Inductance (nH) | DCR1 (m) | Isat2 @25C (A) | Isat3 @100C (A) | Isat4 @125C (A) | Irms5 (A) |
| MGHC966410E-R12K-LF | 12010% | 0.15010% | 98 | 83 | 73 | 67 |
Notes:
* Operating temperature: -40~+125 (Including coils temperature rise)
* L test condition: 100kHz & 1V at 25 ambient;
* 1: DCR: Measured from point "1" to point "2" as seen in bottom view of Appearance and Dimensions.
* 2: Isat@25C: Direct current at which the inductance drops approximately 30% from its value without current at 25C.
* 3: Isat@100C: Direct current at which the inductance drops approximately 30% from its value without current at 100C.
* 4: Isat@125C: Direct current at which the inductance drops approximately 30% from its value without current at 125C.
* 5: Irms: Direct current when the temperature of the product rises (T =40C) from 20C ambient.
Dimensions
| A (Max) | B (Max) | C (Max) | D (Typ) | E (Typ) | F (Typ) | G (Typ) | H (Typ) | I (Typ) | |
| Dimensions (mm) | 6.40 | 9.60 | 10.0 | 2.60 | 3.80 | 9.10 | 3.10 | 3.40 | 9.90 |
Soldering surfaces to be coplanar within 0.10mm. PCB tolerance 0.10mm unless otherwise specified.
Recommended Soldering Conditions
Reflow Soldering Conditions
| Parameter | Value |
| Average Ramp-Up Rate (Ts max. to Tp) | 3/second max. |
| Preheat Temperature Min (Ts min.) | 150 |
| Preheat Temperature Max (Ts max.) | 200 |
| Preheat Time (ts min to ts max.) | 60-180 seconds |
| Time maintained above Temperature (TL) | 217 |
| Time maintained above Time (tL) | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 260 |
| Peak/Classification Time (Tp) | 3-4 seconds |
| Time within 5 C of actual Peak Temperature (Tp) | 20-40 seconds |
| Ramp-Down Rate | 6C/second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
Note 1: All temperatures refer to topside of the package, measured on the package body surface.
Re-work with Soldering Iron
| Condition | Specification |
| Pre-heating | 150, 1 minute |
| Tip temperature | 350 max |
| Soldering iron output | 80w max |
| End of soldering iron | 1mm max |
| Soldering time | 3 seconds max |
Product once removed from the circuit board may not be used again.
2507241130_microgate-MGHC966410E-R12K-LF_C49274413.pdf
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