<
>
Specifications
Mfr. Part #:
MGHC050507U-R10M21-LF
Package:
SMD,5.2x5.2mm
Key Attributes
Model Number:
MGHC050507U-R10M21-LF
Product Description
Product Overview
The MGHC050507U series is a high current SMD power inductor designed for various electronic applications. This specification covers its electrical characteristics, reliability, and recommended usage conditions.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Product Name: SMD high current power inductor
- Part Number: MGHC050507U-R10M21-LF
- Origin: Shenzhen, China
- Certifications: AEC-Q200 (implied by test methods)
- Material: Lead-free product
Technical Specifications
| Microgate Part No. | Inductance (nH) | DCR 1 (m) | Isat 2 @25C (A) | Isat 3 @100C (A) | Irms 4 (A) | Operating Temperature |
| MGHC050507U-R10M21-LF | 10020% | 0.2520% | 40 | 30 | 50 | -40~+125(Including coils temperature rise) |
| Item | Requirements | Test Methods and Remarks | Reference | Sample Size |
| Solderability | (1)No mechanical damage. (2)No corrosion. (3)Terminal area must have 90% min. solder coverage. | all samples shall be subjected to steam aging for a period of 8 hours as a precondition to testing Temperature:245 5, flux 5-10 s. Sample immersion tin furnace 5 1s. Immersed and in and out of speed: 25 6mm/s. | AEC-Q200 (J-STD-002) | 40 |
| High Temperature Storage | (1)No mechanical damage. (2)No corrosion. (3)Inductance value and DC resistance meet specifications. | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. | AEC-Q200 (MIL-STD -202 Method 108) | 77 |
| Low Temperature Storage | Temperature: -55. Time : 1000 hours. Measurement at 244 hours after test conclusion. | GB/T 2423.1-2008 | 77 | |
| Board Flex | Part mounted on a 100mm*40mm FR4 PCB board, which is 1.60.2 mm thick and as a Layer-thickness 35 m 10 m. Bending speed is 1mm/s. Keeping the P.C Board 2 mm minimum for 60 seconds. | AEC-Q200 (AEC-Q200-005) | 10 | |
| Loading at High Temperature | Samples shall be from the Pre-conditioning group. Temperature: 852. Time : 1000 hours. Applied Current : Rated current. Measurement at 244 hours after test conclusion. | MIL-STD-202 Method 108 Test Condition D | 77 | |
| Resistance to Soldering Heat | (1)No mechanical damage. (2)No corrosion. (3)Inductance value and DC resistance meet specifications. | The peak temperature: 260+5/-0. Reflow:2 times. Temperature curve is as below: | Reflow soldering: JEDED J-STD-020 Hand soldering: MIL-STD-202 Method 210 Section 4.4 Test condition A (table 1) | 20 (1 reflow cycle + 1hand soldering cycle) |
| Pre-conditioning | 2 reflow cycles | JESD22-A113 | Sufficient for reliability test coverage | |
| Temperature Cycling | Samples shall be from the Pre-conditioning group First -55for 30 minutes, last 125 30minutes as 1 cycle. Go through 200 cycles. Max transfer time is 5 minutes. Measurement at 244 hours after test conclusion. | MIL-STD -202 Method 107 Test condition D | 77 | |
| Humidity Resistance | Samples shall be from the Pre-conditioning group. 1000 hours, 852C / 852% RH. Unpowered. Measurement at 244 hours after test conclusion. | AEC-Q200 (MIL-STD -202 Method 103) | 77 | |
| Vibration | Samples shall be from the Pre-conditioning group. 10Hz to 55Hz at 151.5gs. Sweep time and duration: 10Hz~55Hz~10Hz for 20 minutes. Each four hours in X,Y,Z direction, 1 hours in total. | AEC-Q200 (MIL-STD-202 Method 204 Test condition B) | 77 | |
| Terminal Strength | (1)No mechanical damage. (2)No corrosion. (3)Inductance value and DC resistance meet specifications. | The test samples shall be soldered to the board. 17.64N, 60s. | AEC-Q200 (AEC-Q200-006) | 10 |
| Profile Feature | Lead-Free Assembly |
| Average Ramp-Up Rate ( Ts max. to Tp ) | 3/second max. |
| Preheat Temperature Min (Ts min.) | 150 |
| Preheat Temperature Max (Ts max.) | 200 |
| Preheat Time ( ts min to ts max.) | 60-180 seconds |
| Time maintained above Temperature (TL) | 217 |
| Time maintained above Time (tL) | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 260 |
| Peak/Classification Time (Tp) | 3-4 seconds |
| Time within 5 C of actual Peak Temperature (Tp) | 20-40 seconds |
| Ramp-Down Rate | 6C/second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
2507241130_microgate-MGHC050507U-R10M21-LF_C49274415.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
