Product Overview

The MPIT3010 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO.,LTD. They are suitable for use in a wide operating temperature range and are designed for compatibility with standard soldering processes.

Product Attributes

• Brand: MICROGATE
• Origin: P.R.C. (Shenzhen)
• Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
• Environmental Compliance: Lead-free products (LF).

Technical Specifications

Dimensions

Testing Conditions

Unless otherwise specified: Temperature: 5 to 35, Humidity: 25 to 85% RH. In case of doubt: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.

Electrical Characteristics Test Instruments

Inductance and DCR: CHROMA 3302 meter. Current: CHROMA 3302 and 1320 meter. L test condition: 100KHz/1V. Isat: Based on inductance change (|LI-L|/L30%). Irms: Based on temperature rise (T:40 TYP).

Operating Conditions

Normal work ambient temperature: -40 ~ +125.

Reliability and Test Conditions

High temperature storage test: 1252 for 1000 hours. No case deformation or appearance change. Inductance change 10%. Measurement after 244 hours at room temperature.

Low temperature storage test: -402 for 1000 hours. Measurement after 244 hours at room temperature.

Humidity test: 25-85, 85% RH for 1000 hours. Measurement after 244 hours at room temperature.

Thermal shock test: 1000 cycles of -40 for 30 min. followed by 125 for 30 min.

Solderability test: Terminal area must have 90% min. solder coverage. Dip pads in flux then dip in solder pot at 2455 for 50.1 second.

Heat endurance of reflow soldering: Refer to reflow curve, 3 times. Peak temperature: 260+5/-0. No case deformation or appearance change. Inductance change 10%.

Vibration test: 10~55Hz, 1.5mm amplitude, 2 hours per direction, total 6 hours.

Drop test: Drop 10 times from 1m height onto a concrete floor.

Terminal strength push test: 17.64N force applied for 10s.

Bending test: PCB bend deflection of 2mm at 0.5mm/sec, maintained for 601s.

Loading at High Temperature: 852 for 1000 hours with rated current. No case deformation or appearance change. Inductance change 10%. Measurement after 244 hours at room temperature.

Recommended Soldering Conditions

Flux: Rosin-based flux. Do not use highly acidic flux with halide content exceeding 0.2wt%. Solder: Use Sn solder.

Flow soldering conditions: Temperature difference between product surface and solder max 150 during pre-heating. Temperature difference between product surface and solvent max 100 during cooling. Standard soldering profile applies.

Reflow soldering conditions: Preheat: 150, 1 minute max. Peak temperature: 350, 3 seconds max. Reflow curve profile: Average Ramp-Up Rate max 3/second. Preheat (Ts min 150, Ts max 200, time 60-180 seconds). Time maintained above 217 (TL) for 60-150 seconds. Peak Temperature (Tp) 260 for 3-4 seconds. Time within 5 C of actual Peak Temperature (Tp) 20-40 seconds. Ramp-Down Rate max 6C/second.

Packaging

Details not specified in the provided text.

Visual Inspection Standard of Product

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Storage

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